Abstract: A system to perform multi-stage cleaning of material from a space suit worn by an astronaut in a deep space environment includes one or more discharge units installed external to an interior volume of a facility in the deep space environment. Each of the one or more discharge units releases one or more substances. The one or more substances includes water or air and the interior volume of the facility is defined by an interior hatch that is separated from an exterior hatch leading to the deep space environment by an airlock. One or more collection units installed external to the interior volume. Each collection unit traps released material that is released from a space suit based on the multi-stage cleaning to prevent the released material from entering the interior volume.

Abstract: A cleaning system and a cleaning method configured for cleaning task of solar panels are provided. The cleaning system includes an operation region, cleaning robots, shuttle robots, and a data processing system. The cleaning method includes a first carrying step, a cleaning step, and a second carrying step.

Abstract: A temperature control method includes a switchover process, an ignition process, a slope calculation process, a first and a second control processes. In the switchover process, a heat medium to be supplied into a flow path is switched from a heat medium of a first temperature supplied from a first temperature controller to a heat medium of a second temperature supplied from a second temperature controller. In the slope calculation process, a slope of temperature change of the heat medium is calculated based on a temperature of the heat medium at an outlet side of the flow path. In the first control process, the second temperature controller is controlled until the temperature of the heat medium is stabilized to a temperature lower than a set value. In the second control process, the second temperature controller is controlled such that the temperature of the heat medium reaches the set value.

Abstract: A cleaning chemical liquid supply device includes: first and second mixers respectively mixing first chemical liquid with dilution water and respectively supplying to first and second nozzles respectively supplying the first chemical liquid adjusted to desired flow rates and concentrations to a first position and a second, different position of the substrate in the cleaning device; a first dilution water control box controlling flow rates of the dilution water supplied to the first and second mixers; third and fourth mixers respectively mixing second, different chemical liquid with the dilution water and respectively supplying to third and fourth nozzles for respectively supplying the second chemical liquid adjusted to desired flow rates and concentrations to a third position and a fourth, different position of the substrate in the cleaning device; and a second dilution water control box controlling flow rates of the dilution water supplied to the third and fourth mixers.

Abstract: The substrate processing method includes a hydrophilization step of hydrophilizing a surface of a substrate, a processing liquid supplying step of supplying a processing liquid to the hydrophilized surface of the substrate, a processing film forming step in which the processing liquid supplied to the surface of the substrate is solidified or cured to form a processing film on the surface of the substrate, and a peeling step in which a peeling liquid is supplied to the surface of the substrate to peel the processing film from the surface of the substrate. The peeling step includes a penetrating hole forming step in which the processing film is partially dissolved in the peeling liquid to form a penetrating hole in the processing film.

Abstract: Techniques for depowdering additively fabricated parts are described. The techniques utilize various mechanisms to separate powder from parts. For instance, techniques for depowdering described herein may include fabrication of auxiliary structures in addition to fabrication of parts. Certain auxiliary structures may aid with depowdering operations, and may be fabricated along with parts during an additive fabrication process. The auxiliary structures may be shaped and/or have positional and/or geometrical relationships to the parts during fabrication. For instance, an auxiliary structure may include a cage structure fabricated around one or more parts.

Abstract: A method for cleaning a semiconductor wafer to clean a semiconductor wafer after polishing, including: performing a first ozone-water treatment step of cleaning the polished semiconductor wafer with ozone water to form an oxide film; performing a brush cleaning step of brush-cleaning the semiconductor wafer with carbonated water after the first ozone-water treatment step; and then performing a second ozone-water treatment step including cleaning the semiconductor wafer with hydrofluoric acid to remove the oxide film, followed by cleaning with ozone water to form an oxide film again. This second ozone-water treatment step is performed one or more times.

Abstract: A method for rinsing an overflow chamber at the bath-side end of a snout of a device for hot-dip coating a metal strip is presented. The snout guides the metal strip in a protective gas atmosphere before the metal strip is coated with a metal melt. A rinsing cycle is carried out in the overflow chamber of the snout by feeding metal melt from the molten bath into the overflow chamber and at the same time, sucking and pumping said melt out of the overflow chamber back into the molten bath. This rinsing cycle can be performed even when the snout has been retracted from the melt by supplying the melt from the molten bath to the overflow chamber with a delivery pump.

Abstract: An ultrasonic treatment apparatus according to the present invention includes: a treatment tank capable of containing a treatment object and a treatment liquid for immersing the treatment object; and an ultrasonic application mechanism that applies ultrasonic waves to the treatment liquid, wherein the treatment tank has a long axis where cross-sectional shapes are substantially identical to each other, and a wall surface to a scheduled liquid level height line of the treatment liquid is formed by a concave surface, and the ultrasonic application mechanism is installed at a position where an angle ? formed by a normal line of an oscillation surface of ultrasonic waves and the scheduled liquid level line of the treatment liquid is 5° to 80°.

Abstract: There is provided a technique that includes removing a substance adhering to the interior of the process container by performing a cycle a predetermined number of times under a first temperature, the cycle including: (a) supplying one gas of a nitrogen- and hydrogen-containing gas and a fluorine-containing gas into the process container after a substrate is processed; and (b) supplying the other gas different from the one gas of the nitrogen- and hydrogen-containing gas and the fluorine-containing gas into the process container where the one gas remains.

Abstract: This invention relates to cleaning the induction systems, the combustion chambers and exhaust systems of internal combustion engines. And, more particularly, to chemicals and mixtures of chemicals for removing the different types of carbon deposits encountered in internal combustion engines used in “road vehicles”. Carbon deposits were taken from the induction systems of these road vehicles for the purpose of bench testing such carbon and product development. More specifically, chemicals (i.e., solvents) and chemical mixes (i.e., solutions) have been accurately tested on such harvested carbon deposits for their ability to remove the various types of carbon deposits that accumulate within road vehicle internal combustion engines. Additionally this invention also relates to apparatus for delivering chemicals and chemical mixes.

Abstract: The present disclosure relates to a method for removing residual acid of implant that has been surface treated using acid, the method including thermal decomposition step of thermally decomposing and removing the acid remaining on the implant; base treatment step of treating the acid remaining on the implant with base, thereby neutralizing and removing the acid; and washing step of washing and removing the acid and the base remaining on the implant with washing water. According to the present disclosure, the acid remaining on the surface of the fixture can be effectively removed, and thus there is an effect of preventing the problem of bone loss that may occur near the placed implant.

Abstract: A shoe sole cleaning device is disclosed. The shoe sole cleaning device comprises a housing; a shoe receiving arrangement provided on the housing to receive one or more shoes therein; and a cleaning mechanism comprising a plurality of water jets arranged in the shoe receiving arrangement. The plurality of water jets are adapted to provide water sprays towards bottom of soles of the one or more shoes received in the shoe receiving arrangement for cleaning thereof.

Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Abstract: A method for improving a corrosion protection of a hollow shaft may include introducing a lance into the hollow shaft, and cleaning and expelling a liquid from an inside of the hollow shaft via spraying a gas from the lance. The method may also include applying a corrosion protection medium onto an inner lateral surface of the hollow shaft at least in certain regions, and closing off the hollow shaft.

Abstract: A method of cleaning a jet pump assembly of a nuclear reactor may comprise evacuating an interior of the jet pump assembly that is filled with a first liquid by injecting a gas to purge the first liquid from the interior to provide an evacuated surface. In addition, the method may comprise directing a jet of a second liquid onto the evacuated surface.

Abstract: Various embodiments include methods and chemistries to etch metal-oxide films. In one embodiment, a method of etching tin oxide (SnO2) films includes using thionyl chloride (SOCl2) chemistry to produce an etch rate of the SnO2 films of up to 10-times higher as compared with Cl2 chemistry for similar flow-rates and process conditions, and gettering oxygen species from the SnO2 films by using the SOCl2, thereby forming volatile SO2 and volatile SnCl4 to provide human safety and machine safety and operations. Other methods, chemistries, and techniques are disclosed.

Abstract: A high flow differential cleaning system uses a source of pressurized compressed dry gas to pressurize a holding tank. A component to be cleaned is securely loaded and oriented against a blast plate designed specifically for the desired pressure, flow, and volume. A fast-actuated valve system opens to direct high volumes of pressurized gas from a holding tank through and around the component(s) held within the cleaning chamber for the removal of remnant powder and foreign particles from interior cavities as well as exterior component surfaces.

Abstract: A method of cleaning a complex powder transfer system including providing a powder transfer system having a washing fluid source, a spray device valve in fluid communication with the washing fluid source, a backflush valve in fluid communication with the washing fluid source, a receiving device having an upper chamber, a lower chamber, and a membrane filter disposed between the upper and lower chambers. The method includes opening the backflush valve to initiate a backflush cycle, running the backflush cycle to wash the upper chamber with a fluid, and closing the backflush valve after the backflush cycle completes. The method includes opening the spray device valve to initiate a spray device cycle, running the spray device cycle to wash the lower chamber with fluid, and closing the spray device valve after the spray device cycle completes. The method includes opening a pressure valve to provide PCA to the receiving container.

Abstract: A method and an apparatus for cleaning a channel, especially a transmission and/or cooling channel, in any type of device, machine, installation, and/or tool, particularly in any type of heat exchanger and/or a molding core, cavity and/or insert is proposed, wherein a channel is cleaned through dynamic, bi-directional pulsation of cleaning medium inside the to-be-cleaned channel, the method being realized by a cleaning apparatus equipped with a diaphragm pump module, plugged either only in the feed side of the transmission line or in the feed side and in the return side, which, after connecting the diaphragm pump module to the external energy source and shutting off the flow control system from the reservoir and the feed pump, allows for putting cleaning medium into a state of two-way dynamic pulsating motion.