Abstract: A method of assembling a load center featuring a dielectric barrier that securely retains a plug-on neutral rail without requiring any fasteners. The dielectric barrier and the rail are installed in the same Z-axis direction, which is orthogonal to a rear wall of an enclosure into which the load center is installed. Retention features in the dielectric barrier can create a snap-fit connection between the rail and the barrier, or the barrier can feature a support feature onto which the rail snaps as the rail is installed relative to the dielectric barrier in the Z-axis direction. The snap fit connections eliminate the need for any fasteners, and together with the Z-axis assembly, the assembly process is simplified and accelerated and the possibility of assembly error is reduced or eliminated.

Abstract: A furcation assembly for electrical conductors of an electro-optical cable with electrical conductors and optical conductors has an inner tube surrounded by a metallic shield layer and a polymer jacket surrounding the metallic shield layer. The inner tube may have a circular or a generally ovaloid cross section inner diameter. A transition housing may be applied over an interconnection between the metallic shield layer and a metallic shield of the electro-optical cable. A pull strand may be provided in the inner tube inner diameter, for ease of insertion of the electrical conductors and/or additional water proofing characteristics.

Abstract: A method of manufacturing a multi-layer circuit board includes: forming a first circuit layer on a first surface of a first prepreg; stacking a second prepreg on a first surface of the first circuit layer; and forming at least one of a second or a third circuit layer on at least one of a first surface of the second prepreg and a second surface opposite of the first surface of the first prepreg, wherein, in the stacking of the first prepreg, the first prepreg and the second prepreg are semi-cured.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: A method is provided for crimping an electrical terminal to an electrical wire having electrical conductors. The method includes positioning the electrical wire and the electrical terminal between opposing crimp tooling members of a crimp tool. The method also includes pressing a crimp barrel of the electrical terminal against the electrical conductors of the electrical wire using the crimp tooling members such that the electrical conductors are mechanically and electrically connected to the crimp barrel. The crimp barrel is pressed against the electrical conductors such that at least some contact portions of metallic surfaces of at least some of the electrical conductors melt and form hot weld bonds with one or more contact portions of the metallic surface of one or more adjacent electrical conductors.

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.

Abstract: A maintenance tool for an insulator of a direct current transmission line comprises clamping devices and a tensioning device. The clamping devices are mounted at the two sides of the insulator through clamping, and the tensioning device is connected between the clamping devices. The clamping devices comprise a closed clamp (1), a single serial clamping device (2) and a wire end clamping device (30). The clamping device has advantages such as strong overall strength and bearing capacity, small size, light weight, and reliable working, and can be applied to replacement of various insulators on the direct current transmission line, reliably ensuring safe commissioning and regular maintenance of transmission lines.

Abstract: A process for fabricating an electromagnetic flow meter by encapsulating an electrode with a liquefied plastic. The electrode is fabricated out of an electrically conducting material and with at least a first circumferential indentation that runs orthogonal to the longitudinal expansion of the electrode. The electrode is positioned in a tool and encapsulated with a liquefied plastic, at least in sections, wherein the first indentation is encapsulated, at least in sections, with liquefied plastic.

Abstract: Provided is a method of assembling and adjusting multi-beam scanning optical apparatus including a light source unit having multiple light emitting points, a deflecting unit configured to deflect multiple light beams emitted from the light source unit, and an imaging optical system configured to image the multiple light beams deflected by the deflecting unit on a surface to be scanned, the method including: adjusting incident positions of the multiple light beams in a sub-scanning direction, which are entered into an imaging optical element constituting the imaging optical system to adjust irradiated positions of the multiple light beams on the surface to be scanned; and adjusting the irradiated positions of the multiple light beams on the surface to be scanned in the sub-scanning direction without changing the incident positions.

Abstract: A method for forming a cochlear electrode array with a plurality of electrodes which are spaced so as to stimulate sites within a cochlea includes shaping a sheet of electrically conductive material to form a support structure and a plurality of electrodes, in which the electrodes are tethered to the support structure at the spacing of the cochlear electrode array. A cochlear lead includes a flexible body that has frictional characteristics that vary about its circumference. A cochlear lead includes a flexible body with a first region and a second region with different surface textures. This generates differential sliding forces during insertion of the cochlear lead which influence a motion of the cochlear lead during insertion. The cochlear lead having an electrode array with varying stiffness along its length is also provided.

Abstract: A method of placing an element onto a data carrier, where there is a placement actuator arranged to be able to secure the element. A transport layer is advanced until the element is located between the placement actuator and the data carrier in a desired position. The actuator is moved towards the data carrier so that it secures the element. The transport layer is then retracted to detach the element from it and then the placement element is moved towards the data carrier to bring the element into contact with the data carrier at the desired position.

Abstract: Embodiments of the present invention are directed to electrical devices and methods for fabricating electrical devices using an oxidation process. According to one embodiment, a method of forming an electrical device using an oxidation process includes forming a metallic element which is to become an electrically insulating or resistive element in an electrical device; forming an electrically conductive element connected to the metallic element, wherein the metallic element and the electrically conductive element have different oxidation behavior when subjected to the oxidation process; and subjecting the elements forming the electrically insulating or resistive element and the electrically conductive element to the oxidation process.

Abstract: The present invention discloses a method for minimizing warpage in the electronic products, and the structures of such electronic products as well. Groove holes are formed into the insulating material layer or several layers. The groove holes can be processed by laser drilling or by other suitable means. A cured epoxy adhesive will fill the groove holes after the heat and pressure treatment performed to the circuit structure. The electronic product may contain several insulating layers and embedded electronic components connected to a wiring layer. A double-stacked symmetrical structure can also be manufactured. Asymmetrical structures with different sized embedded components can be handled as well. The groove holes can be shaped as straight short lines, ellipses, crosses, circles etc, or as any combination of different shapes.

Abstract: A method of manufacturing an electronic component module includes sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with a sealing resin and cutting boundary portions between electronic component modules from an outer surface of the sealing resin to a position at least partially through the aggregate substrate to form first grooves. A shield layer is formed by coating the outer surface of the sealing resin with a conductive resin and filling the first grooves with the conductive resin, and recesses are formed at positions on the shield layer where the first grooves are formed. The boundary portions between electronic component modules are cut along the corresponding recesses so that second grooves each having a width smaller than the width of a corresponding one of the recesses are formed, and the aggregate substrate is singulated into the individual electronic component modules.

Abstract: Photovoltaic modules may include multiple flexible thin film photovoltaic cells electrically connected in series, and laminated to a substantially transparent top sheet having a conductive grid pattern facing the cells. Methods of manufacturing photovoltaic modules including integrated multi-cell interconnections are provided. Methods may include steps of coordinating, integrating, and registering multiple rolls of substrates in continuous processes.

Abstract: A method for deployment of a display system includes providing a first collection container for receiving a first display arrangement, and a second collection container for receiving a second display arrangement. The method further includes positioning the first collection container and the second collection container in close proximity to one another. The method further includes selectably engaging the first display arrangement to the second display arrangement and simultaneously deploying the first and second display arrangements.

Abstract: A inverting head 20 that inverts a component 4 picked up by a nozzle 20a upside down includes a flat-plate-like base 31 provided on a vertically-movable transfer base 21d; a nozzle holder support member 33 that is swayable within a horizontal plane the base as a result of arcuate peripheries 41 being supported by a plurality of bearings 32 provided on the base 31; and a nozzle holder 34 that is supported so as to be turnable around a horizontal axis CX by the nozzle holder support member 33 and that holds on its side surface the nozzle 20a.

Abstract: A step drill test structure for a PCB and method for using the same is disclosed. In one embodiment, a test structure includes a drill path and a connection via. The drill path may include sensing pads on selected ones of a plurality of layers of the PCB (e.g., the non-surface layers). The sensing pads of a given drill path may be electrically conductive, while the remaining portion of the drill path is non-conductive. The sensing pads of each drill path may be electrically coupled to the connection via. The depth of a given layer at a particular drill path may be determined by drilling, using an electrically conductive drill bit, into the drill path and determining when an electrical connection is made between the drill bit and the connection via.

Abstract: A vehicle lamp socket assembly includes a housing, a body, a sealant, and a terminal blade. The housing has a cavity and has a connector with a socket. The housing also has a pass-through spanning between the cavity and the socket. In assembly, the body is received in the housing and has a retainer that holds a vehicle lamp. The sealant is located at the pass-through and fills a section or more of the pass-through. And the terminal blade extends through the pass-through and through the sealant.

Abstract: A method to prevent the accumulation of static electricity in a pipe system for containing corrosive petroleum products is provided, for a total resistance of less than 1 MEG ohms to ground from all points. The pipe system has at least two pipe sections, each comprising a structural layer and a corrosion resistant layer. The corrosion resistant layer has at least a conductive surface area in contact with the fluid, with the conductive surface area defining an electrical pathway extending a length of the pipe section. Each pipe section has a tapered end exposing a portion of the corrosion resistant layer. The method comprises joining the two pipe sections at the tapered ends by a conductive adhesive overlay, and electrically connecting the conductive adhesive overlay to a grounding device, wherein the grounding device helps dissipate build-up of electrostatic charge in the pipe system carrying the fluid.