Abstract: The method of the invention includes: placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent; and cooling the base member and the frame member from the curing temperature. The frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller than that in a case where the frame member is flat in the state.

Abstract: An integrated circuit structure and method of forming is provided. A die is place on a substrate and encased in molding compound. A redistribution layer is formed overlying the die and the substrate is removed. One or more surface mounted devices and/or packages are connected to the redistribution layer on an opposite side of the redistribution layer from the die. The redistribution layer is connected to a printed circuit board.

Abstract: An apparatus for installing at least one electrical contact into a connector housing comprises a base configured to fixedly support the connector housing, an alignment guide, extending from the base and having a central axis, and a carrier, translatably and pivotally coupled with the alignment guide. With the connector housing fixedly supported by the base, the alignment guide is configured to be parallel to an insertion axis of a socket of the connector housing, and the carrier is movable parallel to the insertion axis. The apparatus additionally comprises a tool holder, coupled to the carrier. The tool holder has a working axis, only one degree of freedom relative to the carrier, and only three degrees of freedom relative to the base.

Abstract: The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.

Abstract: A method of forming a capacitor is described as is an improved capacitor formed with a one-sided capacitor foil. The method includes: providing a foil comprising a conductive core and a high surface area on each side of a first side and a second side of the core; removing at least a portion of the high surface area on the first side of the core; and forming a conductive layer on the dielectric.

Abstract: A method for manufacturing traces of a printed circuit board (PCB) comprises an application of the periodic pulse reverse (PPR) pattern plating process. In the first stage, walls and bottoms in drilled holes of the PCB are modified with reduced graphene oxide (rGO) so that the vias can be formed by filling with copper and a very thin copper layer can be formed on the substrate through the electroplating process. In the second stage, a pattern of very fine traces with width/space less than 30/30 ?m is formed on the thin copper layer and then the traces are formed through the PPR pattern plating process. After removing unwanted copper layer, the traces with even thicknesses and square profiles are achieved and thus conform to requirements of the high density interconnection (HDI) technology.

Abstract: Integrated Microelectromechanical System (“MEMS”) devices and methods for making the same. The integrated MEMS device comprises a substrate (200) with first electronic circuitry (206) formed thereon, as well as a MEMS filter device (100). The MEMS filter device has a transition portion (118) configured to (a) electrically connect the MEMS filter device to second electronic circuitry and (b) suspend the MEMS filter device over the substrate such that a gas gap exists between the substrate and the MEMS filter device. The transition portion comprises a three dimensional hollow ground structure (120) in which an elongate center conductor (122) is suspended. The RF MEMS filter device also comprises at least two adjacent electronic elements (102/110) which are electrically isolated from each other via a ground structure of the transition portion, and placed in close proximity to each other.

Abstract: A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.

Abstract: First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.

Abstract: A method of making a package for a fuel unit, a fuel unit including the package, and a hydrogen generator including one or more of the fuel units are disclosed. The package includes a package strip made by forming apertures in a nonconductive substrate strip, forming conductor sections in a conductor strip, aligning the substrate and conductor strips, bonding the conductor sections to the substrate strip to cover the apertures, and removing non-bonded portions of the conductor strip. A package enclosing a hydrogen generating reactant is formed by securing a segment of the package strip to itself, to one or more other segments and/or to one or more other package components. One or more conductor sections in the package strip are in thermal contact with one or more quantities of reactant composition so heat can be transferred thermally decompose the reactant composition and generate hydrogen gas.

Abstract: A stackable variable height via package includes a substrate having a first surface and terminals thereon. The terminals include a first terminal and a second terminal. Vias are on the terminals, the vias including a first via on the first terminal and a second via on the second terminal. The first via has a height from the first surface of the substrate less than a height of the second via from the first surface of the substrate. The package further includes a package body and via apertures in the package body to expose the vias. Forming the stackable variable height via package with variable height vias readily accommodate stacking of additional packages having different types of terminals, e.g., LGA and BGA type packages, as well as variable degrees of warpage on the stackable variable height via package. Further, the vias are formed with a minimum pitch.

Abstract: A method for making thermoacoustic device includes following steps. A substrate having a first surface and second surface is provided. The first surface defines a plurality of grids. Grooves are formed on each of the plurality of grids. A first electrode and a second electrode are formed on each grid. The first electrode is spaced from the second electrode. One of the grooves is located between the first electrode and the second electrode. A number of carbon nanotube wires are applied on the first surface and electrically connected to the first electrode and the second electrode. A thermoacoustic device array is formed on the substrate by separating the carbon nanotube wires. A number of thermoacoustic device is formed by cutting the substrate according to the grids.

Abstract: Provided is a method of preparing a connection for an electrical conductor. The insulation layer of an electrical conductor is cut and the insulation is separated into a first portion and a second portion. The second portion is moved away from the first portion to at least partially expose conductor strands of the electrical conductor. A strand retainer is placed around the exposed conductor strands. The insulation second portion is removed from the electrical conductor. The exposed conductor strands are inserted into an electrical connector.

Abstract: A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions.

Abstract: A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced at a distance from the first stator, and a membrane between the first stator and the second stator. The membrane is displaceable between a first position in which the membrane mechanically contacts the first stator and a second position in which the membrane mechanically contacts the second stator. The first stator and the second stator are arranged to electrostatically move the membrane from a rest position spaced apart from the first position and the second position to the first position and the second position, respectively.

Abstract: The present disclosure includes a method of assembling a power distribution box, that may include providing a circuit board and providing a first L-shaped terminal. The first L-shaped terminal may include a horizontal portion and a vertical portion. A second L-shaped terminal may include a horizontal portion and a vertical portion. In embodiments, the first terminal and/or the second terminal may be inserted into the circuit board such that the horizontal portion of the second terminal may be disposed above the horizontal portion of the first terminal with an air gap between the horizontal portion of the first terminal and the horizontal portion of the second terminal. A power distribution box cover may include a recess that may be configured to receive the first terminal and the second terminal without contacting the first terminal.

Abstract: The procedure for the manufacture and assembly of electronic boards includes the steps of: arranging a first electronic board (2) having a first power connector (7) of substantially elongated shape; arranging a second electronic board (10) having a through opening (14) suitable for allowing the passage of the first power connector (7); arranging a third electronic board (15) including a power circuit and having a second power connector (18) which can be connected to the first power connector (7); associating the second electronic board (10) with the first electronic board (2), wherein the step of associating includes inserting the first power connector (7) through the through opening (14); associating the third electronic board (15) with the second electronic board (10), wherein the step of associating includes connecting the second power connector (18) to the first power connector (7).

Abstract: A substrate supporting unit, a substrate processing apparatus, and a method of manufacturing the substrate supporting unit are provided. The substrate supporting unit includes a susceptor provided with heaters to heat a substrate placed on the susceptor, and including a first temperature region and a second temperature region having a higher temperature than that of the first temperature region; a heat dissipating member including a contact surface being in thermal contact with the second temperature region; and a reflecting member disposed approximately in parallel with one surface of the susceptor to reflect heat emitted from the susceptor toward the susceptor.

Abstract: An electrosurgical instrument is manufactured by presenting an electrode, and attaching a sacrificial portion to the electrode to form a first electrode assembly. An insulating material is molded over the first electrode assembly to form a second electrode assembly, and the second electrode assembly is subjected to a further process which is capable of removing the sacrificial portion without removing the insulating material. The sacrificial portion is removed to form at least one cavity within the electrosurgical instrument.

Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.