Abstract: A radially-fed RF power combiner combines a plurality of input signals to generate a single fundamental-mode transverse electromagnetic (TEM) output. The combiner comprises a vacuum coaxial transmission line having a plurality of coaxial vacuum feedthroughs configured to receive the input signals. The feedthroughs are arranged radially around the vacuum coaxial transmission line. The inner conductive surface of the vacuum coaxial transmission line may comprise a cylindrical conductive base and a plurality of radially-aligned conductive ridges azimuthally distributed within a vacuum envelope of the vacuum coaxial transmission line. Each of the conductive ridges may be coupled to a center conductor of a corresponding one of the coaxial vacuum feedthroughs. The conductive ridges may have a taper to provide an increasing gap between the top of the conductive ridges and an outer conductive surface of the vacuum coaxial transmission line.

Abstract: A conductor non-formed portion where no conductor layer exists is provided in a first ground conductor layer. A multilayer body is provided with a void where no insulating resin exists. At least a portion of the conductor non-formed portion is provided in a first area positioned at a right of a first interlayer connection conductor with respect to a multilayer body left-right direction and at left of a second interlayer connection conductor with respect to the multilayer body left-right direction in a view in a multilayer body downward direction. At least a portion of a void overlaps with the conductor non-formed portion in the view in the multilayer body downward direction and is provided above a first signal conductor layer with respect to a multilayer body up-down direction and below the first ground conductor layer with respect to the multilayer body up-down direction.

Abstract: A method of making a semiconductor device includes forming a first transmission line over a substrate. The method includes forming a second transmission line over the substrate. The method further includes depositing a high-k dielectric material between the first transmission line and the second transmission line, wherein the high-k dielectric material partially covers each of the first transmission line and the second transmission line. The method further includes depositing a dielectric material directly contacting the high-k dielectric material, wherein the dielectric material has a different dielectric constant from the high-k dielectric material, and the dielectric material directly contacts the first transmission line or the second transmission line.

Abstract: A power divider includes a substrate which includes an input terminal, a microstrip, a short-circuit stub, an open-circuit stub, a first output terminal and a second output terminal. One end of the microstrip is electrically connected to the input terminal. One end of the short-circuit stub is electrically connected to the microstrip. The first output terminal is electrically connected to the other end of the microstrip and the open-circuit stub. The second output terminal is electrically connected to the other end of the microstrip. Through impedance matching of the open-circuit stub at the first output terminal, the range of the radiated electric field at the second output terminal is reduced, and the bend slope attenuation may be carried out under the wide frequency band of 700 MHz. Therefore, the radiated electric field of the antenna can still be reduced without adjusting the antenna gain in a wide frequency band.

Abstract: A transition unit of a radio frequency device provides a transition between a planar differential pair transmission line and a hollow radio frequency waveguide. It comprises a substrate layer arrangement with a planar differential pair transmission line arranged on one or more surfaces of at least one substrate layer, whereby an end section of the differential pair transmission line is configured as a radio frequency signal transition pattern. It further comprises an end section of a waveguide that is attached to the substrate layer arrangement and that superposes the radio frequency signal transition pattern. The waveguide is directed perpendicular to the substrate layer arrangement. An open end of the end section of the waveguide is attached to a first outer surface or a second outer surface of the substrate layer arrangement. The transition pattern comprises open loop shaped end sections of a first and second transmission line segment.

Abstract: Embodiments of the present disclosure provide a metadevice including a substrate, a resonator loop coupled to the substrate. The resonator loop having a first gap in the resonator loop. The metadevice includes an organic electrochemical transistor positioned in the first gap, a gate electrode, and an electrolyte extending between the organic electrochemical transistor and the gate electrode.

Abstract: Circuits and methods that enable stable and reliable “hot switching” from one antenna to another without turning RF power to the antennas OFF in wireless RF systems during at least some transmission events. One embodiment comprises an RF switch circuit including a common port configured to pass an RF signal, a plurality of switch arms each coupled to the common port and including an associated port, and a shunt termination impedance selectively couplable to the common port through a switch. Another embodiment comprises a method for switching an RF signal applied to a common port of a switch from a first switch arm initially in an ON state to a second switch arm initially in an OFF state, including: setting the second switch arm to the ON state, and then setting the first switch arm to the OFF state.

Abstract: A quantum computing chip device provides an edge based capacitive, intra-chip connection. A first chip includes a first signal line with a distal end positioned proximate to or on an edge of the first chip and a proximal end positioned away from the edge of the first chip. A second chip includes a second signal line with a distal end positioned proximate to or on an edge of the second chip and a proximal end positioned away from the edge of the second chip. The first signal line and the second signal line are configured to conduct a signal. The second signal line of the second chip is disposed in alignment for a capacitive bus connection to the first signal line of the first chip.

Abstract: An arrangement (100) for interconnection of waveguide structures (10,20) or components comprising a number of waveguide flange adapter elements (100) having a surface of a conductive material with a periodic or quasi-periodic structure (15) formed by a number of protruding elements (115) arranged or designed to allow waves to pass across a gap between a surface around a waveguide opening (3) to another waveguide opening in a desired direction or waveguide paths, at least in an intended frequency band of operation, and to stop propagation of waves in the gap in other directions.

Abstract: High speed waveguide-based data communication systems are disclosed. Such systems may include separable electrical connectors, forming signal propagation paths between electronic assemblies with one or more waveguides.

Abstract: A power divider, a regulation method, a power allocation method, a storage medium, and an electronic device are disclosed. The power divider includes M power division units. The M power division units are cascade connected to form a cascade structure of N levels, each of the power division units includes one input port and two output ports. Each of power division units in a Kth level in the cascade structure satisfies relationships of: input impedance of a power division unit in the Kth level conjugate-matches output impedance of a unit connected to an input port of the power division unit in the Kth level, and output impedance of the power division unit in the Kth level conjugate-matches load impedance of the power division unit in the Kth level, where N, K, and M are positive integers greater than or equal to 1.

Abstract: An electromagnetic splitting coupler is provided for receiving a transverse electromagnetic (TEM) signal input and emitting a transverse electric mode one-zero (TE10) signal output. The coupler includes a receiver port; a plurality of emitter ports; a hollow manifold; and a terminus. The receiver port provides the TEM signal input. The emitter ports impart the TE10 signal output. The manifold includes a chamber that connects the receiver port to the emitter ports. The terminus seals the manifold. The coupler can also include an interface plate to connect the emitter ports thereto, such as to an antenna.

Abstract: Provided is a band-pass filter that includes a plurality of resonators that are electromagnetically coupled to each other. At least one of the plurality of resonators is a specific resonator to which a signal is input from outside or that outputs a signal to the outside. The specific resonator includes a conductor pin, a first surrounding conductor that surrounds the conductor pin in a radial direction, a dielectric that is positioned between the conductor pin and the surrounding conductor, a second surrounding conductor that surrounds the dielectric in an axial direction of the conductor pin, and an intermediate conductor that extends in a direction crossing the axial direction of the conductor pin and that electrically connects the conductor pin to the first surrounding conductor or the second surrounding conductor.

Abstract: A phase shifter and a method for operating the same, an antenna and a communication device are provided. The phase shifter includes: a first substrate and a second substrate opposite to each other; a dielectric layer between the first substrate and the second substrate; a first electrode on a side of the first substrate proximal to the second substrate; a second electrode on a side of the second substrate proximal to the first substrate; and a ground electrode on a side of the second substrate distal to the first substrate. The dielectric layer includes liquid crystal molecules, and the first electrode and the second electrode are configured to control rotation of the liquid crystal molecules according to different voltages respectively received by the first electrode and the second electrode. The second electrode has a one-piece structure.

Abstract: A power feed circuit for a circularly polarized antenna includes a synthesizing-distributing unit and a phase shift unit. The synthesizing-distributing unit distributes input signals to two paths with the same phase and same amplitude. The phase shift unit has two phase shift circuits connected respectively between the two paths distributed by the synthesizing-distributing unit and two feed points of a circularly polarized antenna. The phase shift unit outputs signals whose phase difference is 90° to the two feed points and of the circularly polarized antenna.

Abstract: The disclosure discloses a low-loss transmission line structure, which belongs to the field of radio frequency transmission lines and includes at least two metal layers stacked in a vertical manner. A dielectric layer is filled between the metal layers. The metal layers include a signal transmission strip in a middle portion. Ground strips are provided on both sides of the signal transmission strip. Through holes are evenly distributed on the dielectric layer, and the signal transmission strips on each of the metal layers are connected through the through holes to form a signal transmission line. The ground strips on each metal layer are connected through the through holes.

Abstract: A dielectric waveguide filter includes a dielectric plate including first and second principal surfaces facing each other and a side surface connecting outer edges of the first and second principal surfaces, a first surface conductor at the first principal surface, a second surface conductor at the second principal surface, a side conductor film inside the dielectric plate and connecting the first and second surface conductors, and an internal conductor extending in a perpendicular direction to the first principal surface and electrically connected to neither the first surface conductor nor the second surface conductor. Dielectric waveguide resonant spaces are surrounded by the first surface conductor, the second surface conductor, and the side conductor film.

Abstract: A waveguide arrangement contains a first ridged waveguide and a second waveguide. The first ridged waveguide contains a first casing with a first cavity and a first ridge extending in the first cavity in the longitudinal direction. The first ridge is conductively connected to a wall of the first casing. The second waveguide contains a second casing with a second cavity. The first ridged waveguide overlaps the second waveguide in the longitudinal direction of the waveguide arrangement in a connecting section to produce a capacitive coupling between the first ridge and the second waveguide.

Abstract: A surface mount constructed millimeter wave transceiver device and methods of making a surface mount constructed millimeter wave transceiver device are disclosed. The transceiver device includes a printed circuit board having a first waveguide port and a second waveguide port. A diplexer is surface mounted to a first side of the printed circuit board, the diplexer comprising a low frequency waveguide port and a high frequency waveguide port each coupled to an antenna port. A transmitter and a receiver are surface mounted to a second side of the printed circuit board, located opposite the first side of the printed circuit board, wherein the transmitter and the receiver comprise a transmitter waveguide port and a receiver waveguide port, respectively, that are configured to be aligned to the first waveguide port and the second waveguide port of the printed circuit board, respectively.

Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.