Abstract: A phase shifter circuit and a power divider are disclosed. The phase shifter circuit provides a (90/N)-degree phase shift for a signal with two or more frequencies, where N is an integer. The phase shifter circuit includes a first inductor, a first capacitor, a second inductor and a second capacitor. The first inductor is grounded, and is coupled to the first capacitor in series. The second inductor is grounded, and is coupled to the second capacitor in series. A first node between the first capacitor and the first inductor is coupled to a node between a second node between the second capacitor and the second inductor. The power divider includes plural circuit blocks cascaded in series. Each circuit block provides a (90/N)-degree phase shift for a signal with two or more operating frequencies.
Abstract: A vehicle having a communication system is disclosed. The system includes two electrical couplings, coupled by way of a rotary joint having a bearing waveguide. Each electrical coupling includes an interface waveguide configured to couple to external signals. Each electrical coupling also includes a waveguide section configured to propagate electromagnetic signals between the interface waveguide and the bearing waveguide of the rotary joint. Additionally, the rotary joint is configured to allow one electrical coupling to rotate with respect to the other electrical coupling. An axis of rotation of the rotary joint is defined by a center of a portion of the waveguides. Yet further, the rotary joint allows electromagnetic energy to propagate between the waveguides of the electrical couplings.
Type:
Grant
Filed:
October 6, 2021
Date of Patent:
June 27, 2023
Assignee:
Waymo LLC
Inventors:
Zhe Li, Jamal Izadian, Pierre-yves Droz, Min Wang, Samuel Lenius, Paul Karplus, Kyla Purvis
Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.
Type:
Grant
Filed:
June 16, 2021
Date of Patent:
June 20, 2023
Assignee:
RAYTHEON COMPANY
Inventors:
Karl L. Worthen, James S. Wilson, Joshua Lamb
Abstract: A differential time delay shifter may comprise a 1-to-N switch, where N is an integer greater than 1. The switch may have a pole contact, N throw contacts, and a pole arm to selectively couple the pole contact to one of the throw contacts. One throw contacts may be a first throw contact at a first switch position, and one throw contacts may be a last throw contact at a last switch position. The shifter may further comprise one or more transmission lines, each of which is electrically connected between two of the N throw contacts. The shifter may further comprise a source configured to generate an electromagnetic signal. The source may be electrically coupled to the pole contact, to convey the signal to the pole contact. The shifter may further comprise one or more loads, a first of which is electrically coupled to the first throw contact.
Type:
Grant
Filed:
December 16, 2020
Date of Patent:
June 20, 2023
Assignee:
Menlo Microsystems, Inc.
Inventors:
Christopher Ian Mobbs, Marten A. E. Seth
Abstract: A phase shifter, comprising a base, a circuit substrate, a phase-shifting member, and a plurality of first output cables. The circuit substrate is disposed on the base, and comprises a main feeder circuit and at least one sub-feeder circuit. The main feeder circuit comprises a main input circuit section. The at least one sub-feeder circuit is disposed on one side of the main feeder circuit, and comprises two output circuit sections and an arc circuit section. The arc circuit section is disposed between the two output circuit sections. The phase-shifting member is rotatably connected with the circuit substrate and comprises a coupling band. One end of the coupling band corresponds to and is coupled to the main input circuit section while the other end corresponds to and is coupled to the arc circuit section.
Abstract: Resonant cavity filters include a conductive housing having a floor. A dielectric resonator is mounted to extend upwardly from the floor. The dielectric resonator has a cylindrical body with a longitudinal bore that defines an inner sidewall. The longitudinal bore has a variable transverse cross-sectional area. A threaded dielectric fastener is at least partially inserted within the longitudinal bore of the cylindrical body. The dielectric resonator may have a protrusion that extends inwardly from the inner sidewall.
Type:
Grant
Filed:
November 18, 2021
Date of Patent:
June 20, 2023
Assignee:
CommScope Italy S.R.L.
Inventors:
Martin Kufa, Lukás Matrka, Frantisek Ondracek, Jaromir Peroutka, Giuseppe Resnati
Abstract: A ridge gap waveguide millimeter-wave crossover bridge structure device includes: an upper planar metal plate and a bottom planar metal plate arranged in parallel; a supporting structure fixedly arranged between the two planar metal plates; a ridge waveguide fixed on the upper surface of the bottom planar metal plate, with an air gap between the upper planar metal plate and the ridge waveguide; and a plurality of metal pins fixed on the upper surface of the bottom planar metal plate and evenly arranged around the ridge waveguide. The ridge waveguide includes two transmission lines arranged crosswise and four impedance transformation structures respectively connected to the ends of the two transmission lines. The distal end of each of the impedance transformation structures away from the connected transmission line is used to connect with external test equipment to be accommodated in four input ports in the bottom planar metal plate.
Type:
Grant
Filed:
September 30, 2021
Date of Patent:
June 6, 2023
Assignee:
BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
Inventors:
Yongle Wu, Jie Wang, Yuhao Yang, Weimin Wang
Abstract: A method of manufacturing a device is provided. The method includes forming a first cavity in a first substrate with the first cavity having a first depth. A second cavity is formed in a second substrate with the second cavity having a second depth. The first cavity and the second cavity are aligned with each other. The first substrate is affixed to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth. A conductive layer is formed on the sidewalls of the hollow waveguide. The waveguide substrate is placed over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device.
Type:
Grant
Filed:
November 30, 2020
Date of Patent:
May 30, 2023
Assignee:
NXP B.V.
Inventors:
Adrianus Buijsman, Abdellatif Zanati, Giorgio Carluccio
Abstract: Embodiments disclosed herein include waveguides. In an embodiment, a waveguide comprises a conductive shell and a first ridge within the conductive shell. In an embodiment, the first ridge extends away from the conductive shell. In an embodiment, the waveguide further comprises a first core over the first ridge, where the first core comprises a first dielectric material with a first permittivity. In an embodiment, the waveguide may further comprise a second core embedded in the first core, where the second core comprises a second dielectric material with a second permittivity that is greater than the first permittivity.
Type:
Grant
Filed:
June 11, 2019
Date of Patent:
May 30, 2023
Assignee:
Intel Corporation
Inventors:
Cooper S. Levy, Chintan S. Thakkar, James E. Jaussi, Bryan K. Casper
Abstract: A semiconductor device includes a first transmission line. The semiconductor device includes a second transmission line. The semiconductor device includes a high-k dielectric material between the first transmission line and the second transmission line, wherein the high-k dielectric material partially covers each of the first transmission line and the second transmission line. The semiconductor device further includes a dielectric material directly contacting the high-k dielectric material, wherein the dielectric material has a different dielectric constant from the high-k dielectric material, and the dielectric material directly contacts each of the first transmission line and the second transmission line.
Abstract: A redirecting device for mm-waves includes an input section, an output section disposed at 90 degrees to the input section, and a waveguide member extending from the input section to the output section. The waveguide member is a rigid dielectric material.
Abstract: A packaging structure, a method of manufacturing a packaging structure, and a quantum processor include a substrate; a coplanar waveguide including a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire; an air bridge including a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a gap exists between the air bridge and a surface of the signal wire away from the substrate; and a compensation structure located on the surface of the substrate.
Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.
Abstract: A dual-band filtering switch based on a single quad-mode dielectric resonator (DR) includes: a first printed circuit board (PCB) provided thereon with an input terminal; a second PCB provided thereon with an output terminal; a shielding shell arranged between the first and second PCBs and enclosing a shielding cavity together with the first and second PCBs; and a single quad-mode DR arranged in the shielding cavity. The first and second PCBs each include a feeding layer, a dielectric layer, and a ground layer that are stacked in sequence. The feeding layers of the first and second PCBs each include a microstrip line and a switching circuitry connected to the microstrip line, and the feeding layer is in contact with a surface of the DR to realize a switching function of the filtering switch. The proposed filtering switch feature low loss transmission and high selectivity with dual-band operation, miniaturization with the fewest resonators and friendly-integration, simultaneously.
Abstract: Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.
Type:
Grant
Filed:
October 14, 2019
Date of Patent:
May 23, 2023
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventors:
Joshua C. Myers, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi, Wiren D. Becker, Sungjun Chun, Daniel M. Dreps
Abstract: Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.
Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about ?30 dB at about 28 GHz.
Type:
Grant
Filed:
March 3, 2021
Date of Patent:
May 16, 2023
Assignee:
KYOCERA AVX Components Corporation
Inventors:
Arie Leonid Talalaevsky, Michael Marek, Elinor O'Neill
Abstract: Disclosed is a phase shifter. According to an embodiment of the present invention, provided is a phase shifter comprising: an elongated fixed board unit including one or more fixed circuit boards each having a circuit pattern formed on one surface thereof, a guiding bracket surrounding the fixed board unit and fixed to the fixed board unit, and one or more moving board units disposed between the guiding bracket and at least one surface of the fixed board unit, guided by the guiding bracket, and including one or more moving circuit boards having conductive strips formed thereon that are coupled to the circuit patterns on the fixed circuit boards.
Type:
Grant
Filed:
January 10, 2021
Date of Patent:
May 16, 2023
Assignee:
KMW INC.
Inventors:
Seong-man Kang, Yong Hee Han, Sung-hwan So, Dae-myung Park, Hae Ri Roh, Gyo Jin Jo, Chang Won Seo
Abstract: The present disclosure provides a phase shifter and a manufacturing method thereof, and an antenna. The phase shifter includes a first substrate including a reference electrode, and a second substrate including a delay line and a bias line. An orthographic projection of the bias line on the first substrate and that of the delay line, at least partially overlap with that of the reference electrode respectively. The orthographic projection of the bias line on the first substrate does not overlap with that of the delay line. The delay line is used for transmitting a microwave signal and defining a microwave transmission region. When electrical signals are applied to the reference electrode, the delay line and the bias line, electric field areas formed respectively between the reference electrode and the delay line, and between the reference electrode and the bias line, cover the microwave transmission region.
Abstract: The present disclosure provides a phase shifter and a manufacturing method thereof, and an antenna. The phase shifter includes a first substrate and a second substrate, and a medium layer arranged between them. The first substrate includes a reference electrode arranged on a side of a first base substrate close to the medium layer, and the second substrate includes a delay line arranged on a side of a second base substrate close to the medium layer. An orthographic projection on the first substrate of the delay line at least partially overlaps with that of the reference electrode. A line spacing and/or a line width of the delay line is enable to make a cell thickness between the first substrate and the second substrate be 20 ?m-75 ?m.