Abstract: A dielectric wave guide cable (1) includes a tubular core (2) made from a low loss material having a certain permittivity. The tubular core (2) is encompassed by a cladding (3) having, compared to the tubular core (2), a lower permittivity. The tubular core (2) may be coated on the inside by a coating (3) having a higher permittivity. The cladding (3) may be encompassed by a jacket (4).
Abstract: Example embodiments relate to substrate integrated waveguide (SIW) transitions. An example SIW may include a dielectric substrate having a top surface and a bottom surface and a first metallic layer portion coupled to the top surface of the dielectric substrate that includes a single-ended termination, an impedance transformer, and a metallic rectangular patch located within an open portion in the first metallic layer portion such that the open portion forms a non-conductive loop around the metallic rectangular patch. The SIW also includes a second metallic layer portion coupled to the bottom surface of the dielectric substrate and metallic via-holes electrically coupling the first metallic layer to the second metallic layer. The SIW may be implemented in a radar unit to couple antennas to a printed circuit board (PCB). In some examples, the SIW may be implemented with only a non-conductive opening that lacks the metallic rectangular patch.
Abstract: A transmission line includes a signal conductor and one or more return conductors, one or more of which having a stepped multi-layer structure. The return conductors may be disposed at opposite sides of the signal conductor. The return conductors may be multi-layer structures. At least some layers of each return conductor may have a stepped arrangement that defines a curve, such as an exponential curve. Additionally or alternatively, the signal conductor may be a stepped multi-layer structure, where at least some layers of the signal conductor may define a curve, such as an exponential curve. The signal conductor may be disposed at one or more upper layers of the transmission line or may be embedded at one or more layers near the center of the transmission line.
Type:
Grant
Filed:
May 9, 2022
Date of Patent:
January 30, 2024
Assignee:
NXP B.V.
Inventors:
Mustafa Acar, Danny Wayling Chang, Dominicus Martinus Wilhelmus Leenaerts, Philipp Franz Freidl
Abstract: An assembly for a radio frequency filter includes: an elongate pedestal with an upper surface; a resonator; a tuning member that is positioned above the resonator; and a screw that mounts the resonator to the upper surface of the pedestal, the screw including a shank with a thread and a head, the head including a plurality of recesses configured to receive a tool, the recesses extending through the head.
Type:
Grant
Filed:
April 18, 2022
Date of Patent:
January 23, 2024
Assignee:
CommScope Italy S.R.L.
Inventors:
Andrea Manzoni, Luca Bonato, Antonio Sala
Abstract: A phase shifter and an antenna device are provided. The phase shifter includes a substrate, a signal line on the substrate, ground lines in pairs on the substrate, and a capacitance adjusting component. Two ground lines in a same pair of ground lines are on both sides of the signal line and spaced apart from the signal line, respectively. The capacitance adjusting component includes a film bridge, and both ends of the film bridge are on the two ground lines, respectively. The signal line is in a space enclosed by the film bridge and the substrate. The capacitance adjusting component is configured to adjust a capacitance between the film bridge and the signal line to a target capacitance when the capacitance adjusting component receives a bias voltage, and the target capacitance has a linear correlation with a magnitude of the bias voltage.
Abstract: An example balun includes a center conductor that passes through a printed wiring board having multiple dielectric layers and cage vias arranged relative to the center conductor. The cage vias include a first set of cage vias that extend between an unbalanced connection to the balun and a balanced connection to the balun. The first set of cage vias are part of a first circular arc and are connected to electrical ground through a first ground ring. The cage vias include a second set of cage vias that extend from the unbalanced connection part-way through the printed wiring board. The second set of cage vias are part of a second circular arc and are connected to the electrical ground through a second ground ring. The second circular arc is longer than the first circular arc.
Abstract: The present disclosure relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: first side terminal contacted with the electrode pad; and the second side terminal connected to the RF signal connecting portion. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevents disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.
Type:
Grant
Filed:
December 11, 2020
Date of Patent:
January 16, 2024
Assignee:
KMW INC.
Inventors:
Nam Shin Park, Joung Hoe Kim, Sung Ho Jang
Abstract: A coupling assembly is provided. More specifically, the coupling assembly is configured to form a quick, preferably mechanical and electromagnetic, connection between two devices such as a radio and antenna. The coupling assembly has interchangeable portions can be easily adjusted or adapted to swap parts such as waveguides having different sizes and dimensions while maintaining a standard connection portion that can be used with the different sized and shaped parts, thereby reducing manufacturing costs and increasing the efficiency of field installations.
Type:
Grant
Filed:
May 19, 2021
Date of Patent:
January 2, 2024
Assignee:
NETQUI J.S.A.
Inventors:
Martin Marcin{hacek over (c)}ák, Peter {hacek over (S)}vihura, Pavol Capek
Abstract: Base station antenna feed boards are provided. A base station antenna feed board includes a phase shifter and a hybrid radio frequency transmission line that is coupled to the phase shifter. The hybrid radio frequency transmission line includes a coplanar waveguide and a microstrip line. Related base station antennas are also provided.
Abstract: High speed waveguide-based data communication systems are disclosed. Such systems may include separable electrical connectors, forming signal propagation paths between electronic assemblies with one or more waveguides.
Type:
Grant
Filed:
May 24, 2021
Date of Patent:
December 26, 2023
Assignee:
FCI USA LLC
Inventors:
Stephen B. Smith, Madhumitha Rengarajan, Kapil Sharma
Abstract: A cavity device is disclosed comprising a plurality of flat boards stacked one on lop of the other to form a multilayered structure. At least some of the flat boards comprise at least one opening or perforations having one or more layers of electrically conducting materials configured to establish electrical conduction with one or more layers of electrically conducting materials of another one of the flat boards, to thereby form electrically conducting patterns in the multilayered structure for interacting with electromagnetic radiation introduced into the cavity device.
Abstract: An aspect of the present invention simplifies a method of manufacturing a mode converter. A mode converter (10) includes: a post-wall waveguide (PW); a microstrip line (MS); and a blind via (BV) configured to carry out conversion between a waveguide mode of the post-wall waveguide (PW) and a waveguide mode of the microstrip line (MS), the blind via (BV) having a shape approximated by a shape obtained by combining a plurality of cylinders (C1 to C4), each of the plurality of cylinders (C1 to C4) having a diameter equal to the diameter of through vias 14i.
Abstract: A phase shifter and a method for operating the same, an antenna and a communication device are provided. The phase shifter includes: a first substrate and a second substrate opposite to each other; a dielectric layer between the first substrate and the second substrate; a first electrode on a side of the first substrate proximal to the second substrate; a second electrode on a side of the second substrate proximal to the first substrate; and a ground electrode on a side of the second substrate distal to the first substrate. The dielectric layer includes liquid crystal molecules, and the first electrode and the second electrode are configured to control rotation of the liquid crystal molecules according to different voltages respectively received by the first electrode and the second electrode. The second electrode has a one-piece structure.
Abstract: An aspect of the present invention is to reduce return loss in a mode converter. A mode converter (10) includes an excitation pin (through via TV) configured to carry out mutual conversion between a waveguide mode of a post-wall waveguide (PW) and a waveguide mode of a microstrip line (MS). The mode conductor includes a pair of wide walls (conductor layers 12 and 13), in which first and second anti-pads (anti-pads 12c, 13c) are formed, respectively. The first and second anti-pads each have an inner edge including the excitation pin and each have an outer size (diameter D12) that is more than 5 times and less than 6 times as large as the diameter (DT) of the excitation pin.
Abstract: An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.
Type:
Grant
Filed:
August 31, 2022
Date of Patent:
November 28, 2023
Assignee:
Apple Inc.
Inventors:
Alireza Pourghorban Saghati, Mohammed W. Mokhtar, Ali N. Ergun, Oren S. Levy, Arman Samimi-Dehkordi, Sean T. McIntosh
Abstract: A phase shifter, a manufacture method for manufacturing a phase shifter, a drive method for driving a phase shifter, and an electronic device are provided. The phase shifter includes a dielectric substrate, and a transmission line, a dielectric layer, an insulating layer, and a metal layer on the dielectric substrate. In a direction perpendicular to a first surface of the dielectric substrate, the dielectric layer and the insulating layer are between the metal layer and the transmission line, a material of the dielectric layer is a semiconductor material; and an orthographic projection of the metal layer on the dielectric substrate, an orthographic projection of the insulating layer on the dielectric substrate, and an orthographic projection of the dielectric layer on the dielectric substrate at least partially overlap. The present disclosure provides a new phase shifter based on a metal-insulator-semiconductor capacitor structure.
Abstract: A wireless transmission system comprising a main circuit board having a first controller and a first connector assembly associated therewith; a removable and replaceable radio frequency module for transmitting and receiving wireless data, wherein the radio frequency module includes a second controller, a first module connector assembly, and a second connector assembly that is configured to couple to the first connector assembly; a removable and replaceable diplexer module for sending and receiving the wireless data at different frequencies, wherein the diplexer module includes a storage element, a first waveguide port connector, and a second module connector assembly that is configured to couple to the first module connector assembly; and a transition waveguide module having a second waveguide port connector that is configured to couple to the first waveguide port connector.
Abstract: A radar sensor that includes a circuit board, a waveguide structure having at least one waveguide channel, and at least one pin that is pressed into the circuit board. The pin connects the circuit board to the at least one waveguide channel of the waveguide structure in such a way that radar signals may be coupled into the at least one waveguide channel and/or decoupled from the at least one waveguide channel.
Type:
Grant
Filed:
December 21, 2021
Date of Patent:
October 31, 2023
Assignee:
ROBERT BOSCH GMBH
Inventors:
Christian Hollaender, Gustav Klett, Klaus Baur, Klaus Voigtlaender
Abstract: An interposer acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect and establishes two well-defined reference planes that can be optimized independently. The interposer includes a block of material having: a first interface region to interface with an antenna coupled to an integrated circuit (IC); and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.
Type:
Grant
Filed:
January 4, 2021
Date of Patent:
October 24, 2023
Assignee:
TEXAS INSTRUMENTS INCORPORATED
Inventors:
Baher Haroun, Juan Alejandro Herbsommer, Gerd Schuppener, Swaminathan Sankaran
Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.
Type:
Grant
Filed:
April 6, 2022
Date of Patent:
October 17, 2023
Assignee:
Intel Corporation
Inventors:
Adel A. Elsherbini, Mathew Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov, Henning Braunisch, Feras Eid, Javier Soto