Abstract: In a solar cell module in which a solar cell element is mounted on a four-sided metal plate, two opposite sides of the metal plate are bent, and a reinforcement member is provided on at least one of the two remaining sides. Thus, a solar cell module which is easily manufactured, lightweight, and inexpensive can be provided. Furthermore, the solar cell module of the present invention has excellent structural strength.

Abstract: This invention describes a method of forming alignment marks which will be preserved after contact holes in a dielectric have been filled with barrier metal and contact metal and the wafer has been planarized. The alignment marks are formed by filling alignment lines, formed in the dielectric when the contact holes are formed, with barrier metal and contact metal. The alignment lines and contact holes are filled with metal at the same time. After the wafer has been planarized, using a method such as chemical mechanical polishing, a small thickness of the dielectric is etched back using vertical dry anisotropic etching which will not remove either the contact metal or barrier metal. This leaves barrier metal and contact metal extending above the plane of the dielectric forming alignment marks. These alignment marks are preserved after subsequent processing steps, such as deposition of a layer of electrode metal.

Abstract: A selenium photovoltaic cell has a top electrode formed of lemon juice or another fluid which enters into a chemical reaction with the selenium which produces a sulfur compound. A contact disk fixed to the selenium surface makes reliable contact to the fluid top electrode and provides a connection point for a top electrode lead.

Abstract: The photo-curable liquid solder resist ink composition of the present invention mainly comprises a photo-polymerizable resin having sufficient molecular weight and (meth)acryloyl groups which are imparted by both of introduction of (meth)acryloyl groups into a novolak-type epoxy resin having 4 or more of benzene nuclei and polymerization using a chain-extension agent. The composition is useful for a photo-curable type resist, since it can produce a coated film excellent in tack free characteristic and resolution, and can produce a cured film excellent in heat resistance, adhesiveness, and chemical resistance. In addition, by reacting with an acid anhydride, development with alkalis becomes possible.

Abstract: Photosensitive compositions containing a polyimide precursor and a complex cation of a polymerizable carboxylic acid functional compound with a tertiary amino functional group; and use thereof to provide a pattern.

Abstract: A method for forming a photosensitive, heat-resistant resin composition film including the step of coating a base material with a varnish made up of a polyimide precursor having no photosensitivity, a photopolymerizable monomer or oligomer capable of providing a high-heat-resistant polymer upon being polymerized, and a polymerization initiator for the monomer or oligomer. The coating is exposed to a light pattern to polymerize the monomer or oligomer in a pattern. The remaining coating is selectively removed from the non-patterned areas. The patterned coating is heat treated to cure the polyimide precursor, thereby forming the film.

Abstract: Photosensitive compositions containing a polyimide precursor and a complex cation of a polymerizable carboxylic acid functional compound with a tertiary amino functional group; and use thereof to provide a pattern.

Abstract: In an apparatus for removing material from an article, such as an exposed surface of an intermediate integrated circuit structure, by planarizing, polishing, etching or the like, a sensor is mechanically coupled to a moving carrier of the article for directing through the article to its first side an electromagnetic radiation beam having a wavelength band to which the structure is substantially transparent. The beam is detected after interacting with the article, such as being reflected from its exposed surface, and resulting information of the state of the processing of the exposed surface is transmitted from the moving carrier to a stationary receiver by radiation without the use of any physical transmission media such as wires or optical fibers. Multiple sensors mounted on the moving article carrier provide information of the uniformity of the processing across the exposed article surface.

Abstract: A papermaking belt comprised of a resinous polymer with improved elongation. The papermaking belt of this invention is comprised of a reinforcing element and a resinous polymer wherein the resinous polymer exhibits improved elongation both at room temperature and elevated temperatures while maintaining creep resistance and without any undue loss of tensile strength. In addition to papermaking belts, the resinous polymer of this invention may also be used for other applications.

Abstract: A wafer having an interlayer insulating film on a silicon substrate and an Al alloy layer on the interlayer insulating film coated with a resist pattern is introduced into an etching chamber where the Al alloy layer is selectively etched in etchant gas plasma. A main etching process is performed under the etching conditions of a high plasma density until the interlayer insulating film 12 is exposed, and a succeeding over etching process is performed under the etching conditions of a low plasma density. A dry etching method and system is provided which can suppress generation of an abnormal shape or notch of a wiring pattern etched in low pressure and high density plasma, without sacrificing etching selectivity and with productivity being maintained high.

Abstract: An apparatus and method are described for stripping the photoresist from a wafer while in a substantially parallel manner, another wafer is being transferred between a load lock chamber and a transfer chamber, where the processing occurs. Further, a system is described whereby two load lock chambers are employed so that processing of wafers can continue uninterrupted by a delay caused by the need to open, empty, reload and re-equilibrate a single load lock chamber. Still further, a system is described for performing multi-step dry-stripping applications requiring different conditions for two or more of the steps wherein the steps may be performed simultaneously or sequentially. Finally, a system combining a dry-stripping module and a wet-cleaning module is described which combination system permits the continuous, fully-automated dry-stripping and wet-cleaning of wafers and, upon completion of the entire processing cycle, returning wafers to their original wafer cassettes.

Abstract: The present invention relates to photopolymerizable compositions comprising an addition-polymerizable compound which has at least one ethylenically unsaturated double bond; a radical-producing agent and a squarylium compound represented by the formula (I): The compositions are highly sensitive to visible and near infrared lights, particularly He-Ne laser, LED, diode laser, etc. having oscillation wavelengths in a wavelength region of 600 nm or more, and thus are useful as materials for holograms, presensitized plate for laser direct process, dry film resists, digital proofs, photosensitive microcapsules.

Abstract: The present invention provides a photoconductor element for use in electrophotographic imaging, including a support, a photoconductive layer coated on the support, and a barrier layer coated on the photoconductive layer. The barrier layer includes an organic polymer and silica.

Abstract: A fabrication method of a printed wiring board realizing high adhesion strength of a patterned conductive layer while keeping the high insulation reliability between adjacent conductive paths. First, an adhesive material is prepared, which is a mixture of a photo-setting resin as a matrix, fine particles of a photolyzable resin dispersed in the photo-setting resin, and a metal-organic compound/complex mixed with the photo-setting resin. The adhesive material is coated on an insulative base material to form an adhesive layer. The adhesive layer is then selectively exposed to light, selectively curing the photo-setting resin and selectively photolyzing the particles of the photolyzable resin. The exposed adhesive layer is developed by an alkaline developer solution, thereby transferring the pattern on the mask to the adhesive layer and removing the photolyzed particles for surface roughening of the remaining, unexposed parts of the adhesive layer.

Abstract: A photoresist layer supporting film is (A) formed from a polymer composition comprising (i) 55 to 100% by weight of a copolyester containing ethylene terephthalate units as a main recurring unit and having a melting point of 210 to 250.degree. C. and (ii) 0 to 45% by weight of polybutylene terephthalate or a copolyester containing butylene terephthalate units as a main recurring unit and having a melting point of not lower than 180.degree. C. and (B) has a plane orientation coefficient of 0.08 to 0.16. Since this supporting film is excellent in substrate shape follow-up properties and resolution, it is suitable for the preparation of a photoresist film laminate by laminating a protective film and a photoresist layer on the surface thereof.

Abstract: The present invention provides crosslinked polymeric networks that are reversibly crosslinked upon exposure to light of a suitable wavelength. In one embodiment photocrosslinkable branched hydrophilic polymers containing photochromic groups are synthesized. Cinnamylidene groups and derivatives of cinnamylidene are preferably used as the photochromic agents or photocrosslinking agents.

Abstract: A method for forming resist patterns having two photoresist layers and an intermediate layer involves coating a primary photoresist film having a small thickness over an under layer, and exposing the primary photoresist film to light using a mask. Then, the primary photoresist film is developed, thereby forming a primary photoresist film pattern. An intermediate layer is formed over the entire exposed surface of a resulting structure, the intermediate layer being made of a spin on glass or plasma enhancement oxide. A secondary photoresist film is coated over the intermediate layer. The secondary photoresist film is exposed to light using the same mask as used for the primary photoresist film, and is developed to form a secondary photoresist pattern. A portion of the intermediate layer exposed through the secondary photoresist pattern is etched, forming a secondary photoresist pattern completely overlapping with the primary photoresist pattern so that the resulting resist pattern has a vertical profile.

Abstract: A magnetic toner for use in electrophotographic development which can be endowed with high performance by subjecting it to surface treatment with hot air in its dispersed state. The magnetic toner is used in an electrophotographic system including a development process in which an electrostatic latent image is formed by using a photoconductive drum having a stationary magnet therein, and thereafter the magnetic toner is sucked in a toner sump by magnetic force, whereby non-image area toner is recovered by an electrode roller, and the electrophotographic system including a recycle process of the residual toner. The magnetic toner is capable of realizing high-quality image development and stable recycle of residual toner by subjecting the magnetic toner to surface treatment with hot air.

Abstract: A photolithographic projection system for selectively irradiating a photosensitive layer on a wafer according to a predetermined pattern on a mask is discussed. The photolithographic projection system includes a radiation source which generates radiation such as light. A reflector reflects the radiation from the radiation source on a path which intersects the wafer. This reflector includes a radiation reflecting portion and a phase-shifting and partially reflecting portion adjacent the radiation reflecting portion. The reflecting portion may include a plurality of reflecting portions surrounded by the absorbing portion, or the reflecting portion may surround the absorbing portion. Alternately, the reflector may include a reflecting portion and an absorbing portion adjacent the reflecting portion. Related methods are also discussed.

Abstract: The invention relates to a process for forming bilayer resist images with a chemically-amplified, radiation-sensitive bilayer resist. The bilayer resist is disposed on a substrate and comprises (i) a top imaging layer comprising a radiation-sensitive acid generator and a vinyl polymer having an acid-cleavable silylethoxy group and (ii) an organic underlayer. The bilayer resist is used in the manufacture of integrated circuits.