Abstract: In the dishwasher and the control method therefor of the present invention, the turbidity of washing water is measured and, if it is decided that the level of dirtiness of the tableware is low, then the time over which a heater operates during the washing routine is reduced and, instead, the time over which the heater operates during the rinsing routine is increased. This is advantageous in that it can improve the performance of the drying which is carried out after the rinsing routine. Further, if it is decided that the level of dirtiness of the tableware is high, then the time over which the heater operates during the washing routine is increased and the time over which the heater operates during the rinsing routine is reduced. This is advantageous in that the washing performance can be improved while the overall heater operating time can be maintained.

Abstract: A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.

Abstract: A double bucket cleaning system for use with microfiber mat mops. One bucket contains clean water; the second holds dirty water. The second bucket has a slide press for extracting dirty water from the mop. The system can use a connector to connect the two buckets together, or a single bucket with two compartments can be used. Both designs use a footpad upon which the user stands during the pressing operation. This ensures that the device remains in place during the sliding. Finally, once the dirty water has been extracted from the mop, the user can pick up clean water from the first bucket for the next portion of the floor to be cleaned. In this way, the user is able to quickly clean a large floor with clean water, instead of repeatedly dipping the mop back into dirty water.

Abstract: A method and system for cleaning lithography components including contacting a substrate having residue including organic compounds and graphitic carbon deposited on a surface thereof with hydrogen peroxide vapor. The hydrogen peroxide vapor is irradiated with electromagnetic radiation having a wavelength in the range of 100 nm to 350 nm forming hydroxyl radicals. The hydroxyl radicals react with the residue to remove the residue from the surface of the substrate.

Abstract: A semiconductor substrate cleaning method includes cleaning a semiconductor substrate formed with a line-and-space pattern, rinsing the substrate, supplying the rinse water to rinse the substrate, and drying the substrate. The rinsing includes supplying deionized water and hydrochloric acid into a mixing section to mix the deionized water and the hydrochloric acid into a mixture, heating the mixture in the mixing section by a heater, detecting a pH value and a temperature of the mixture by a pH sensor and a temperature sensor respectively, adjusting an amount of hydrochloric acid supplied into the mixing section so that the rinse water has a predetermined pH value indicative of acidity, and energizing or de-energizing the heater so that the temperature of the mixture detected by the temperature sensor reaches a predetermined temperature, thereby producing the rinse water which has a temperature of not less than 70° C. and is acidic.

Abstract: Methods of acidic warewashing are disclosed. The compositions can include other materials including surfactants and chelating agents, and are preferably phosphorous free. Methods of using the acidic compositions are also disclosed. Exemplary methods include using the acidic compositions together with other compositions, including alkaline compositions and rinse aids employed in an alternating alkaline/acid/alkaline manner. The methods also include acidic compositions that serve multiple roles.

Abstract: A hard floor surface care process comprising a process of identifying, cleaning, polishing, and protecting manmade and natural stone hard floor surfaces having a single surface or multi-surface quality. The hard floor surface care process comprising an acid reactive or nonreactive hard floor surface identifying process; an emulsifying solution, agitating, and toweling cleaning process; a polishing process utilizing a lubricating solution with a polishing chemistry or pad, and a protecting process utilizing a protecting chemistry selected as a function of the identifying process.

Abstract: Disclosed are a liquid processing method, a liquid processing apparatus, and a recording medium that can prevent convex portions of a target substrate from collapsing when a rinsing liquid is dried. A base surface of a target substrate is hydrophilized and the surfaces of convex portions become water-repellent by surface-processing the target substrate which includes a main body, a plurality of convex portions protruding from the main body, and a base surface formed between the convex portions on the substrate main body. Next, a rinsing liquid is supplied to the target substrate which has been subjected to the surface processing. Thereafter, the rinsing liquid is removed from the target substrate.

Abstract: A cleaning device for blades of a fan including a first arm with distal end and proximal end, a first cleaning element attached to the proximal end and a second arm with a distal end and proximal end, a second cleaning element attached to the proximal end as well as a pivoting joint connected to the distal end of the first arm and the distal end of the second arm the pivoting joint also having a handle connection.

Abstract: A windshield wiper includes a wiper assembly, a scrubber assembly, and an engaging assembly. The wiper assembly includes a wiper support structure and a wiper blade attached to the wiper support structure. The scrubber assembly includes a scrubber support structure, an elongated scrubber element and a motor. The scrubber element is movably attached to the scrubber support structure and extends between a first end and a spaced apart second end along a central longitudinal axis. The motor is mounted to the scrubber support structure and is engaged with the scrubber element to reciprocally move the scrubber element along the central longitudinal axis. The engaging assembly is coupled with the wiper assembly and the scrubber assembly and is configured to raise and lower the scrubber assembly with respect to the wiper assembly. Also, an automated method of using a windshield wiper.

Abstract: A scrub brush housing a swab of foam material impregnated with an anti bacterial disinfectant is first placed over a female luer with an annular portion of the swab compressed against the luer and a central portion of the swab passed into the passage of the luer to effect a full contact with the surfaces of the swab. The swab is then rotated on the female luer for a time sufficient to substantially remove the biofilm on the surfaces of the luer that are contacted by the swab.

Abstract: The wet treatment of wafer-shaped articles is improved by utilizing a droplet generator designed to produce a spray of monodisperse droplets. The droplet generator is mounted above a spin chuck, and is moved across a major surface of the wafer-shaped article in a linear or arcuate path. The droplet generator includes a transducer acoustically coupled to its body such that sonic energy reaches a region of the body surrounding the discharge orifices. Each orifice has a width w of at least 1 ?m and at most 200 ?m and a height h such that a ratio of h to w is not greater than 1.

Abstract: A process for cleaning a compound semiconductor wafer; the compound semiconductor wafer comprises, taking gallium arsenide (GaAs) as a representative, a group III-V compound semiconductor wafer. The process comprises the following steps: 1) treating the wafer with a mixture of dilute ammonia, hydrogen peroxide and water at a temperature not higher than 20° C.; 2) washing the wafer with deionized water; 3) treating the wafer with an oxidant; 4) washing the wafer with deionized water; 5) treating the wafer with a dilute acid solution or a dilute alkali solution; 6) washing the wafer with deionized water; and 7) drying the resulting wafer. The process can improve the cleanliness, micro-roughness and uniformity of the wafer surface.

Abstract: A method of cleaning dishware with a liquid detergent composition having a hydrophobic emollient and a crystalline structurant to provide improved hand skin care benefits and superior grease cleaning and/or suds mileage.

Abstract: A method of simultaneously cleaning and disinfecting an industrial water system is described and claimed. The method involves the addition to the water of the industrial water system of a Compound selected from the group consisting of the alkali salts of chlorite and chlorate and mixtures thereof; and an acid, followed by allowing the water in the industrial water system to circulate for several hours. The reaction of the alkali salts of chlorite and chlorate and acid produces chlorine dioxide in-situ in the water of the industrial water system. The chlorine dioxide kills microorganisms and the acid acts to remove deposits upon the water-contact surfaces of the equipment. This cleaning and disinfecting method works in a variety of industrial water systems including cooling water systems.

Abstract: The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

Abstract: Embodiments of the invention generally provide methods for cleaning a UV processing chamber. In one embodiment, the method includes flowing an oxygen-containing gas through a plurality of passages formed in a UV transparent gas distribution showerhead and into a processing region located between the UV transparent gas distribution showerhead and a substrate support disposed within the thermal processing chamber, exposing the oxygen-containing gas to UV radiation under a pressure scheme comprising a low pressure stage and a high pressure stage to generate reactive oxygen radicals, and removing unwanted residues or deposition build-up from exposed surfaces of chamber components presented in the thermal processing chamber using the reactive oxygen radicals.

Abstract: An ultrasonic cleaning method of using ultrasonic vibrations to clean an object that is immersed in a cleaning liquid in a cleaning tank is provided. The method includes generating a frequency modulated signal including at least two frequency modulated portions having modulation widths different from each other with a single frequency as a center frequency, such that among the at least two frequency modulated portions a frequency modulated portion having a smaller modulation width is generated at a timing when a frequency modulated portion having a larger modulation width reaches the center frequency. The method further includes generating the ultrasonic vibrations based on the frequency modulated signal and transferring the ultrasonic vibrations to the cleaning tank to clean the object.

Abstract: A double bucket cleaning system for use with microfiber mat mops. One bucket contains clean water; the second holds dirty water. The second bucket has a slide press for extracting dirty water from the mop. The system can use a connector to connect the two buckets together, or a single bucket with two compartments can be used. Both designs use a footpad upon which the user stands during the pressing operation. This ensures that the device remains in place during the sliding. Finally, once the dirty water has been extracted from the mop, the user can pick up clean water from the first bucket for the next portion of the floor to be cleaned. In this way, the user is able to quickly clean a large floor with clean water, instead of repeatedly dipping the mop back into dirty water.

Abstract: A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.