Patents Examined by Binh B Tran
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Patent number: 10930988Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.Type: GrantFiled: January 29, 2020Date of Patent: February 23, 2021Assignee: Hitachi Metals, Ltd.Inventors: Kazufumi Suenaga, Yuju Endo, Hideyuki Sagawa, Takahiro Sugiyama, Hiroshi Ishikawa
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Patent number: 10932390Abstract: An immersion tank includes a tank main body configured to store a coolant, at least one first air bag that is provided in the tank main body, that is coupled to a bottom portion of the tank main body, that is able to be inflated toward an upper portion of the tank main body, and that is able to be deflated, from an inflated state thereof, toward the bottom portion, and a guide member that is provided outside the at least one first air bag in the tank main body and that is configured to guide the at least one first air bag during the inflation and the deflation of the at least one first air bag.Type: GrantFiled: February 7, 2020Date of Patent: February 23, 2021Assignee: FUJITSU LIMITEDInventor: Masayuki Korikawa
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Patent number: 10925157Abstract: A flexible board is formed by mounting a one end of the flexible board on a mounting surface provided on a liquid crystal panel, the mounting surface having a curved shape, and by folding back the flexible board from the one end through another end. The flexible board includes a bent portion in which, at a position between the one end and the other end, a gap to the one end changes according to the position along a curving direction of the mounting surface, the bent portion being formed by bending at least a portion among the positions where the gap to the one end is small so as to make the portion protrude in a direction that crosses a board surface of the flexible board.Type: GrantFiled: March 28, 2019Date of Patent: February 16, 2021Assignee: SHARP KABUSHIKI KAISHAInventor: Hideaki Yabuuchi
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Patent number: 10925188Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.Type: GrantFiled: November 11, 2019Date of Patent: February 16, 2021Assignee: Microsoft Technology Licensing, LLCInventors: Nicholas Keehn, Robert Jason Lankston, Husam Alissa
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IT container system design approach for fast deployment and high compatibility application scenarios
Patent number: 10925180Abstract: An IT enclosure and immersion cooling unit is disclosed. The unit comprises: an immersion cooling area to accommodate electronic devices that require cooling, the electronic devices being immersed in coolant; an heat exchanger; an coolant supply line to supply cooler coolant from the heat exchanger to the immersion cooling area; and an coolant return line to return warmer coolant from the immersion cooling area to the heat exchanger, wherein the cooler coolant absorbs heat from the electronic devices in the immersion cooling area and turns into the warmer coolant, wherein heat is extracted from the warmer coolant in the heat exchanger and transferred to external coolant, and wherein the heat exchanger, the coolant supply line, and the coolant return line are packaged within the immersion cooling unit.Type: GrantFiled: March 4, 2019Date of Patent: February 16, 2021Assignee: BAIDU USA LLCInventor: Tianyi Gao -
Patent number: 10925186Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.Type: GrantFiled: May 15, 2019Date of Patent: February 16, 2021Assignee: Hewlett Packard Enterprise Development LPInventors: David A. Selvidge, Pinche Tsai, Minh H. Nguyen
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Patent number: 10915153Abstract: The present invention is a docking station that consists essentially of two cradle arms and a central cradle portion including one or more temperature control units. It may include a case configured to allow heat transfer between a mobile device and the temperature control units. It may include both a heating element and a cooling element, wherein each of the elements are configured to engage at particular temperatures. It may include control units and temperature sensors. The cradle arms may include upper cradle hooks and lower cradle hooks to securely hold a mobile device. The case may be configured to securely receive the cradle hooks. The cradle arms may include upper and lower portions that are spring coupled. The docking station may include one or more locks that lock the upper and lower arm portions in their relative positions to prevent theft of a docked mobile device.Type: GrantFiled: October 31, 2018Date of Patent: February 9, 2021Inventor: Joseph Todrzak
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Patent number: 10917974Abstract: Disclosed herein is a circuit board that includes a resin substrate including a substrate wiring layer, and an electronic component embedded in the resin substrate and having a plurality of external electrodes. The resin substrate includes a plurality of via holes that expose the external electrodes and a plurality of via conductors embedded in the via holes to electrically connect the substrate wiring layer to the external electrodes. At least some of the via holes are different in planar shape from each other.Type: GrantFiled: October 15, 2013Date of Patent: February 9, 2021Assignee: TDK CORPORATIONInventor: Kazutoshi Tsuyutani
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Patent number: 10917999Abstract: The present disclosure provides a power module, a power module assembly and an assembling method thereof. The power module assembly includes a housing, a resilient bracket, a circuit board, a power device and a fastening unit. The housing includes a first heat-dissipation surface. The resilient bracket is pre-fastened on the housing. The resilient bracket is located near the first heat-dissipation surface and configured with the first heat-dissipation surface to form an accommodating space. The circuit board is configured to assemble on the housing. The power device is plugged in the circuit board and accommodated in the accommodating space. The fastening unit is pre-fastened on the housing and pressing the resilient bracket. While the resilient bracket pushes against the power device, the power device is attached to the first heat-dissipation surface.Type: GrantFiled: April 13, 2018Date of Patent: February 9, 2021Assignee: DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITEDInventors: Zhenrong Huang, Peiai You, Hao Sun
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Patent number: 10910126Abstract: An aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer void measurement region in a shape of a rectangle having a short side length of 30 ?m and a long side length of 50 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 30 ?m in a depth direction, and a total cross-sectional area of voids in the surface-layer void measurement region is equal to or less than 2 ?m2.Type: GrantFiled: April 4, 2017Date of Patent: February 2, 2021Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
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Patent number: 10912222Abstract: A cooling system includes: a cooling device; a pump coupled to the cooling device; and a waste heat device coupled to the cooling device, wherein the cooling device includes: a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.Type: GrantFiled: September 4, 2019Date of Patent: February 2, 2021Assignee: FUJITSU LIMITEDInventors: Satoshi Inano, Hiroyuki Fukuda, Minoru Ishinabe, Yukiko Wakino
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Patent number: 10910802Abstract: A pedestal housing for utility connections includes a lower section having a plurality of walls, an upper surface, and a bottom opening. A first rim is formed on the lower section positioned below the upper surface. A second rim is formed on the lower section positioned below the first rim. An upper section includes a plurality of walls and a top. The upper section is releasably connected to the lower section to form a housing for receiving one or more utility components. The upper section is configured to mate with one of the first rim or the second rim.Type: GrantFiled: April 20, 2017Date of Patent: February 2, 2021Assignee: Hubbell IncorporatedInventors: Jeffrey Scott Huffstetler, Robert Wilton Fox
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Patent number: 10908270Abstract: An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.Type: GrantFiled: January 18, 2018Date of Patent: February 2, 2021Assignee: FUJIFILM SONOSITE, INC.Inventor: Rahul Gupta
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Patent number: 10910131Abstract: An electrical cable assembly, comprising a first electrical circuit further comprising a first plurality of insulated conductors longitudinally disposed to one another, wherein the first plurality of insulated conductors are cabled together in a bundle. The electrical cable assembly further comprises a second electrical circuit longitudinally disposed to the first electrical circuit, the second electrical circuit comprising a second plurality of insulated conductors longitudinally disposed to one another and cabled together in a bundle and a nonmetallic jacket surrounding the second plurality of insulated conductors and wherein the nonmetallic jacket isolating the first electrical circuit from the second electrical circuit. The electrical cable assembly further comprises a flexible interlocking metallic armor encasing the first and second electrical circuits.Type: GrantFiled: February 13, 2020Date of Patent: February 2, 2021Assignee: Encore Wire CorporationInventors: Troy D. Skidmore, Paul Abernathy, David W. Maxey, William T. Bigbee, Jr.
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Patent number: 10906481Abstract: A protector includes a case configured to accommodate a wire harness, wherein the case is provided with an insertion hole configured such that the wire harness is inserted through the insertion hole, a rib is provided on an inner surface of the case, the inner surface defining the insertion hole, and the rib protruding inwardly from the inner surface, and the rib is configured to: be fitted in a groove portion provided in an outer peripheral surface of a corrugated tube that is externally mounted on the wire harness; and hold a plug configured to close the insertion hole.Type: GrantFiled: March 4, 2019Date of Patent: February 2, 2021Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, Yazaki CorporationInventors: Kouichi Inoue, Takahiro Kitagawa, Kunihito Ogura
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Patent number: 10910133Abstract: A linear shape member is composed of a linear shape electrical insulating body comprising irregularities on a surface, and a plating layer coating the surface of the electrical insulating body. An average irregularities spacing Sm of the irregularities is not more than 20.0 ?m.Type: GrantFiled: January 9, 2020Date of Patent: February 2, 2021Assignee: HITACHI METALS, LTD.Inventors: Kazufumi Suenaga, Hideyuki Sagawa, Takahiro Sugiyama
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Patent number: 10912229Abstract: A cooling system and a multi-function heat exchanger design for electronics racks has one or more liquid-to-liquid heat exchangers (or their functions) and one or more liquid-to-air heat exchangers (or their functions). Each liquid-to-liquid heat exchanger has a rack-liquid channel, and an external-liquid channel, the rack-liquid channel and the external-liquid channel being fluidly isolated from each other, and thermally coupled to each other to transfer thermal energy between rack-liquid that circulates through the rack-liquid channel and external-liquid that circulates through the external-liquid channel. The one or more liquid-to-air heat exchangers each have an air path that circulates air between the electronics racks and ambient space around the electronics racks, the air path being thermally coupled to an external-liquid channel of the liquid-to-air heat exchanger to transfer thermal energy between the air and the external-liquid.Type: GrantFiled: August 15, 2019Date of Patent: February 2, 2021Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 10905028Abstract: A cold plate is provided and includes fins defining first channels, a plenum adjacent to an upstream end of each of the first channels, a lid, ribs and a blocking element. The lid defines an inlet fluidly communicative with the plenum. The ribs extend between the lid and the fins to define second channels oriented transversely relative to the first channels. The second channels include a proximal second channel fluidly communicative with the plenum. The blocking element is configured to normally encourage coolant flowing through the inlet to flow toward the plenum and the upstream end of each of the first channels and to normally discourage the coolant from flowing into the proximal second channel.Type: GrantFiled: May 7, 2019Date of Patent: January 26, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Xiangfei Yu, Dustin Demetriou
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Patent number: 10902978Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb—Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.Type: GrantFiled: December 18, 2019Date of Patent: January 26, 2021Assignee: H.C. STARCK INC.Inventors: David B. Smathers, Paul Aimone
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Patent number: 10897826Abstract: A cover window of a flexible display device includes a base substrate including an out-folding area, an in-folding area, and peripheral areas disposed on opposing sides of at least one of the out-folding area and the in-folding area, a first hard coating layer at a top surface of the base substrate, the first hard coating layer having a substantially uniform thickness, and a second hard coating layer at a bottom surface of the base substrate opposite to the top surface, the second hard coating layer having a thickness different from the thickness of the first hard coating layer. A thickness of a first area of the second hard coating layer that overlaps with the out-folding area and the in-folding area of the base substrate is less than a thickness of a second area of the second hard coating layer that overlaps with the peripheral areas of the base substrate.Type: GrantFiled: July 25, 2019Date of Patent: January 19, 2021Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jae-Hoon Jung, Jong-Whan Cho, Suk-Man Yang, Young-Sik Yoon, Jong-In Lee