Patents Examined by Binh B Tran
  • Patent number: 11256306
    Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
    Type: Grant
    Filed: January 18, 2020
    Date of Patent: February 22, 2022
    Assignee: Apple Inc.
    Inventors: Eugene A. Whang, Christopher J. Stringer, Brett W. Degner, David H. Narajowski, Patrick Kessler, Eric R. Prather, Caitlin Elizabeth Kalinowski, Adam T. Stagnaro, Daniel L. McBroom, Matthew P. Casebolt, Michael D. McBroom
  • Patent number: 11259433
    Abstract: The invention discloses an apparatus for using regulating components for communicating radio frequency signals. The apparatus is equipped with a plurality of regulating components. At least two of the regulating components are connected through a connecting part, and one of the connected regulating components is in a feed connection with the circuit board. In use, the regulating components are used for communicating radio frequency signals.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: February 22, 2022
    Assignee: SHENZHEN SUNWAY COMMUNICATION CO., LTD.
    Inventors: Hongwei Liu, Suganthan Shanmuganathan, Kiran Vanjani
  • Patent number: 11259419
    Abstract: A display device includes a display panel, a first circuit board, a second circuit board, a first adhesive element, and a conductive element. The display panel includes a non-bending region and a bending region that is bent from the non-bending region. The bending region includes a curvature region having a specific curvature and a facing region facing the non-bending region in a thickness direction of the display module. The first adhesive element is disposed to combine the first circuit board with the second circuit board, and the conductive element is disposed to electrically connect the first circuit board to the second circuit board.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: February 22, 2022
    Inventors: Seongsik Ahn, Kijong Kim, Minki Kim, Seunghwan Baek, In-su Baek, Gyunsoo Kim
  • Patent number: 11252829
    Abstract: An electronic device includes a casing, a main circuit board, a detachable component and a flexible circuit board. The main circuit board is disposed in the casing. The main circuit board includes a processor and a memory, wherein the memory stores data. The detachable component is disposed in the casing. The flexible circuit board includes a first end portion, a second end portion, a middle portion and a first detection loop, wherein the first detection loop is disposed at the first end portion and the middle portion. The first end portion is electrically connected to the main circuit board and the second end portion is fixed on the detachable component. When the detachable component is detached from the casing, the middle portion breaks, such that the first detection loop is cut off. When the first detection loop is cut off, the processor erases the data stored in the memory.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: February 15, 2022
    Assignee: Qisda Corporation
    Inventor: Hsueh-Chun Yang
  • Patent number: 11252825
    Abstract: A voice-activated electronic device including a first portion with a first internal surface having a first attachment structure, and a second portion with a second internal surface having a second attachment structure. The first and second internal surfaces have compatible shapes that permit the first and second portions to be moved from a separated position to a joined position, where when the first portion and the second portion are in the joined position the first and second internal surfaces form a nested arrangement. The first and second attachment structures form a secure but separable connection to one another when the first and second portions are in the joined position. The first and second portions are configured to be joined securely and separated through manual human manipulation of one or both of the first portion and the second portion to move the first and second portions between separated and joined positions.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: February 15, 2022
    Assignee: Google LLC
    Inventors: Jung Guen Tak, Amy Martin, Willard McClellan
  • Patent number: 11245191
    Abstract: A method of fabricating a near-field antenna for transmitting radio frequency (RF) power transmission signals includes selecting a set of dimensions for one or more cutouts to be defined through a conductive plate of the near-field antenna. The conductive plate has opposing first and second planar surfaces. The method includes forming the one or more cutouts through the first and second surfaces of the conductive plate in a predefined arrangement. Each of the one or more cutouts has the set of dimensions. The method includes coupling an insulator to the first surface of the conductive plate, and coupling a feed element to the insulator.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: February 8, 2022
    Assignee: ENERGOUS CORPORATION
    Inventors: Evangelos Kornaros, Saman Kabiri, Alister Hosseini, Chryssoula Kyriazidou
  • Patent number: 11246223
    Abstract: A package apparatus comprises a first wiring layer, a first dielectric material layer, a first conductive pillar layer, a first buffer layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface opposite to the first surface. The first dielectric material layer is disposed within partial zone of the first wiring layer. The first conductive pillar layer is disposed on the second surface of the first wiring layer. The first buffer layer is disposed within partial zone of the first conductive pillar layer. The second wiring layer is disposed on the first buffer layer and one end of the first conductive pillar layer. The protection layer is disposed on the first buffer layer and the second wiring layer.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: February 8, 2022
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventor: Shih-Ping Hsu
  • Patent number: 11237410
    Abstract: A substrate carries electrical components. It is bent into a non-planar shape to fit into a contact lens. For example, the substrate may be constructed from a flexible circuit board. The circuit board has certain regions for mounting electrical components. The flexible circuit board is bent into a three-dimensional shape that fits into the contact lens. The regions used to mount electrical components remain flat.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: February 1, 2022
    Assignee: Tectus Corporation
    Inventors: Donald Arthur Ice, Benjamin Lyle Hackett
  • Patent number: 11229390
    Abstract: Disclosed is an electrode device for measuring an electric biosignal. The electrode device includes a flexible PCB (printed circuit board) having a flexible support layer and a trace layer on a first side. The trace layer includes at least two electrode pads for skin contacts and, for each electrode pad, a solder pad and a conducting trace forming a galvanic connection between the electrode and the solder pad. The flexible PCB further includes an opening defining a flexible, elongated cantilever in a central portion of the flexible PCB, having a base end connected to the central portion and a free end separated from the central portion. The solder pads are located at the free end. The electrode device further includes a connector component on the second side, soldered to the solder pads on the free end of the cantilever.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: January 25, 2022
    Assignee: BITTIUM BIOSIGNALS LTD
    Inventor: Juha Matti Myllykangas
  • Patent number: 11231778
    Abstract: A bidirectional self-healing neural interface includes a first elastic substrate; a neural electrode disposed on the first elastic substrate and comprising a conductive polymer composite; and a second elastic substrate disposed on the neural electrode. The conductive polymer composite includes a matrix formed of a self-healing polymer material; and a plurality of electrical conductor clusters distributed in the matrix. Each of the electrical conductor clusters includes particles of a first electrical conductor; and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor, and having sizes that are smaller than those of the particles of the first electrical conductor. The first electrical conductor is a source for generating the second electrical conductor.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: January 25, 2022
    Assignee: Korea Institute of Science and Technology
    Inventors: Hyunseon Seo, Inchan Youn, Hyojin Lee, Kang-Il Song, Donghee Son
  • Patent number: 11224127
    Abstract: A flexible printed circuit board and an electronic device using the same are provided. The electronic device includes a first casing, a second casing, and a printed circuit board combination. The printed circuit board combination includes a first printed circuit board, a second printed circuit board, and a flexible printed circuit board. The flexible printed circuit board includes a body portion, a first extending end, and a second extending end. The body portion defines an opening. The first extending end bends from a first side of the body portion toward the body portion and extends toward a first direction after passing through the opening to connect the first printed circuit board. The second extending end extends from a second side of the body portion toward a second direction to connect the second printed circuit board.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: January 11, 2022
    Assignee: PEGATRON CORPORATION
    Inventors: Mao-Hsiang Huang, Wei-Chih Hsu, Pen-Uei Lu
  • Patent number: 11212916
    Abstract: The present invention is directed to flexible printed circuits for dermal applications that include a synthetic polymer membrane 702 and at least one electrically conductive trace 705. In an alternative embodiment, the electrically conductive trace is located on both sides of the microporous synthetic polymer membrane. The electrically conductive trace may be located on the surface of or be imbibed into the pores and through the thickness of a microporous synthetic polymer membrane. The flexible printed circuits may be electrically coupled to an electronic component to form a flexible printed circuit board and adhered to the skin 701 by a dermally acceptable adhesive. The flexible printed circuit or the flexible printed circuit board may be coupled to an electronic module 703 to form a hybrid flexible printed circuit board. The flexible printed circuit, flexible printed circuit board, and hybrid flexible printed circuit board achieve a balance of comfort, flexibility, and durability for on-skin use.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: December 28, 2021
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: Mark D. Edmundson, Paul D. Gassler
  • Patent number: 11196174
    Abstract: Deployable reflector antenna includes a fabrication hub in which at least one additive fabrication unit disposed. The additive fabrication unit is configured to form at least one rigid structural element of a reflector antenna system. In a stowed condition, an RF reflector material comprised of a flexible webbing is disposed in a stowed configuration proximate to the fabrication hub. A fabrication control system controls the additive fabrication unit so as to form the at least one rigid structural element. The RF reflector material is arranged to transition during the additive fabrication process from the stowed configuration in which the flexible webbing material is furled compactly at the fabrication hub, to a deployed configuration in which the flexible webbing material is unfurled.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: December 7, 2021
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Robert M. Taylor, Philip J. Henderson
  • Patent number: 11197376
    Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: December 7, 2021
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11189910
    Abstract: An antenna and cap, in an example implementation, can include a system, comprising a computing device, a clearance region coupled to the computing device, and an antenna comprising a first antenna portion and a second antenna portion. The first antenna portion can be coupled to the computing device and to the clearance region, and the second antenna portion can be coupled to the clearance region. The system can include a first cap coupled to the second antenna portion via a first interconnection, and a second cap coupled to the second antenna portion via a second interconnection. The first cap and the second cap can be coupled to the computing device.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: November 30, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sung Oh, Philip Wright
  • Patent number: 11184976
    Abstract: Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: November 23, 2021
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Joseph Wang, Rajan Kumar, Ying Shirley Meng, Jae Wook Shin, Lu Yin
  • Patent number: 11178768
    Abstract: Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: November 16, 2021
    Assignee: Intel Corporation
    Inventors: Khang Choong Yong, Stephen H. Hall, Tin Poay Chuah, Boon Ping Koh, Eng Huat Goh
  • Patent number: 11178751
    Abstract: A printed circuit board includes a differential signal via pairs to route differential signal between layers of the printed circuit board. A first differential signal via pair is oriented in a first orientation and a second differential signal via pair is oriented perpendicular to the first orientation. The second differential signal via pair is located such that a midpoint of a first line segment drawn between centers of first and second vias of the second differential signal pair intersects a first ray drawn from a center of a first via of the first differential signal via pair through a center of a second via of the first differential signal via pair. Further, the second differential signal via pair is located such that the midpoint of the first line segment is at a characteristic via-to-via pitch distance for the printed circuit board from the center of the second via of the first differential signal via pair.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: November 16, 2021
    Assignee: Dell Products L.P.
    Inventors: Vijendera Kumar, Sanjay Kumar, Arun R. Chada, Mallikarjun Vasa, Bhyrav M. Mutnury
  • Patent number: 11140770
    Abstract: Printed circuit board assembly (PCBA) technology is disclosed. A PCBA can include a printed circuit board (PCB). The PCBA can also include a capacitor operably mounted on a side of the PCB. In addition, the PCBA can include a damper material coupled to the PCB and operable to dissipate kinetic energy generated by the capacitor during operation. An electronic system including a capacitor and damping material, and a method for minimizing acoustic vibration in an electronic system are also disclosed.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventor: Chia-Pin Chiu
  • Patent number: 11133656
    Abstract: A cable manager includes one or more cable manager units. Each cable manager unit includes a pair of side cable guides, each comprised of a plurality of finger-like projections extending forwardly from a support column. At least one of the pair of support columns has a socket arranged at a side thereof. Each cable manager unit further includes a separate midsection member capable of insertion into the socket for interconnecting the pair of side cable guides.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: September 28, 2021
    Assignee: Chatsworth Products, Inc.
    Inventors: William Krietzman, Joshua James Young, D. Brian Donowho