Patents Examined by Boris L. Chervinsky
  • Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow
    Patent number: 7492593
    Abstract: Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: February 17, 2009
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Computer enclosure
    Patent number: 7492590
    Abstract: A computer enclosure includes an airflow guide (10), a chassis (20) for mounting the airflow guide therein, a fan 30 mounted in the airflow guide, and a side panel (27) for covering the chassis. The chassis includes a rear panel (25) and a motherboard (21) mounted therein, a heat sink (23) is mounted on the motherboard, a plurality of openings (253) for dissipating heat and a fixing slot (251) are defined in the rear panel. The fan aligns with an area of the openings of the rear panel. The airflow guide encases the heat sink therein and includes a catch (1371) engaging in the fixing slot of the chassis. The side panel covers the chassis and abuts against the airflow guide for preventing the catch disengaging from the fixing slot.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: February 17, 2009
    Assignees: Hong Fu Jin Pecision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Yu-Ming Xiao
  • Heat dissipating apparatus for equipment chassis
    Patent number: 7492592
    Abstract: A heat dissipating apparatus includes a bracket mounted in an equipment chassis, a fixing plate, a fan installed on the fixing plate, a rotating device mounted in the bracket and rotatably connecting with the fixing plate, and a circuit board fixed in the bracket. The circuit board includes a control circuit for controlling the rotating device to rotate the fixing plate to thereby change orientation of the fan.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: February 17, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zhen-Xing Ye, Xiao-Zhu Chen
  • Heat sink clip
    Patent number: 7489511
    Abstract: A heat sink assembly (100) which has a heat sink clip (20) is provided. The heat sink clip includes a pin (22) and a spring (24) disposed around the pin. The pin has a head (222) and a clamping portion (224) at opposite ends thereof. An abutting portion (226) in the form of an annular flange is formed between the head and the clamping portion. The spring is located between the head and the abutting portion. The pin includes an upper section (22a) and a lower section (22b) having a diameter smaller than that of the upper section. The flange extends radially outwardly from an outer surface of the lower section of the pin. The abutting portion is for engaging with a bottom surface of a heat sink (10) when the clip is mounted to the heat sink.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: February 10, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Hao Yang
  • Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling
    Patent number: 7486513
    Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: February 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Shawn A. Hall, Shurong Tian, Paul W. Coteus, John P. Karidis, Evan G. Colgan, Robert W. Guernsey, Jr.
  • Heat dissipation apparatus utilizing empty component slot
    Patent number: 7480147
    Abstract: A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: January 20, 2009
    Assignee: Dell Products L.P.
    Inventors: Shawn P. Hoss, Paul T. Artman
  • Boost spring holder for securing a power device to a heatsink
    Patent number: 7480142
    Abstract: A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined distance from a lower surface of the casing. A spring is seated within the cavity such that a lower portion of the spring protrudes outwardly a predetermined distance from the lower surface of the casing. A heatsink is positioned below a heat generating component such that the spring of the retaining device forces the heat generating component against the heatsink.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: January 20, 2009
    Assignee: Cummins Power Generation IP, Inc.
    Inventor: Allen Carney
  • Folded-sheet-metal heatsinks for closely packaged heat-producing devices
    Patent number: 7474529
    Abstract: A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: January 6, 2009
    Assignee: International Business Machines Corporation
    Inventors: Shurong Tian, Shawn A. Hall, Paul W. Coteus
  • Auxiliary cooling device for memory chips
    Patent number: 7471514
    Abstract: An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: December 30, 2008
    Assignee: CompTake Technology Inc.
    Inventor: Wei-Hau Chen
  • Meter with reduced internal temperature rise and associated method
    Patent number: 7471516
    Abstract: An utility meter is provided. The meter includes a base and a first barrier operably associated with the base. The base and the first barrier define a first compartment between the base and the first barrier. The meter also includes a heat generating component positioned in the first compartment and operably associated with the base. The meter also includes a second barrier extending from the base. The second barrier and the first barrier define a second compartment between the second barrier and the first barrier. The meter further includes an arrangement for moving heat connected to the heat generating component and extending from the first compartment to the second compartment.
    Type: Grant
    Filed: October 14, 2006
    Date of Patent: December 30, 2008
    Assignee: Landis+Gyr, Inc.
    Inventor: John T. Voisine
  • Compact enclosure for SONET multiplexer cards and SONET multiplexer card having front panel access to electrical and optical connectors
    Patent number: 7468891
    Abstract: A reduced size multiplexer and, in particular, a reduced size SONET multiplexer module is provided for use in a reduced size enclosure. The SONET multiplexer module has electrical and optical connectors on its faceplate to provide ease in access without having to remove the SONET multiplexer from the enclosure. The SONET multiplexer circuit is configured in a standard Type 400 mechanics circuit board arrangement. The SONET multiplexer module therefore can be inserted into an enclosure in a direction opposite to that in which the coaxial connector projects from the face plate, so that the coaxial connector remains freely accessible outside of the enclosure when the SONET multiplexer module is fully loaded into the enclosure. Coaxial cables and optical fibers can thus be easily coupled to the coaxial and optical connectors, respectively, when the SONET multiplexer circuit is fully loaded into the enclosure.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: December 23, 2008
    Assignee: Hubbell Incorporated
    Inventors: Bruce Lipski, Gary M. Miller, David O. Corp
  • Power distribution panel with selectable output voltages
    Patent number: 7468883
    Abstract: An electric power distribution panel includes a plurality of slots for supplying power to circuit breakers, a first input bus for coupling to a first power source, a second input bus for coupling to a second power source, and a plurality of circuit breaker carriers. Each carrier is positioned in one of the slots and selectably movable in its slot between a first position for coupling a circuit breaker to the first input bus, and a second position for coupling a circuit breaker to the second input bus.
    Type: Grant
    Filed: May 7, 2007
    Date of Patent: December 23, 2008
    Assignee: Emerson Network Power, Energy Systems, North America, Inc.
    Inventor: Raymond A. Mann
  • Apparatus for air cooling of an electronic device
    Patent number: 7466547
    Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: December 16, 2008
    Assignee: Apple Inc.
    Inventors: Steven Holmes, Douglas L. Heirich
  • Method and apparatus for thermal dissipation in an information handling system
    Patent number: 7466551
    Abstract: A thermal dissipation apparatus includes a primary heat sink. The primary heat sink includes a first base member including a component coupling surface and a secondary heat sink coupling surface, and a plurality of fins extending from the first base member. A secondary heat sink may be provided such that the primary heat sink is operable to provide thermal dissipation in a low profile form factor chassis while the secondary heat sink may be coupled with the primary heat sink to provide more optimal thermal dissipation in a high profile form factor chassis.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: December 16, 2008
    Assignee: Dell Products L.P.
    Inventor: Paul Artman
  • Power inverter
    Patent number: 7463489
    Abstract: The object of the invention is a power inverter, the bottom of the housing (1) of the power inverter being configured to be stepped, cooling bodies (10, 11) being disposed on the exterior face of the stepped bottom, at least two printed circuit boards (6, 8) that overlap each other and communicate with the respective one of the cooling bodies (10, 11) through semiconductor components being provided.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: December 9, 2008
    Assignee: SMA Solar Technology AG
    Inventors: Andreas Falk, Nafiz Yasat
  • Circuit board housing and circuit board assembly
    Patent number: 7463485
    Abstract: A circuit board assembly comprises a circuit board having a connector or contact pad, and a housing. The housing includes a casing having an open end, an end cover sealing the open end of the casing and having a conductor, a coolant inlet for introducing a coolant into the housing, a coolant outlet for discharging the coolant from the housing, an inside connector connected to an inside surface of the conductor of the end cover, and an outside connector connected to an outside surface of conductor. The conductor of the end cover extends from an inside surface of the end cover to an outside surface of the end cover.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: December 9, 2008
    Assignee: Yamaichi Electronics U.S.A., Inc.
    Inventor: Takeshi Nishimura
  • Wiffle tree components, cooling systems, and methods of attaching a printed circuit board to a heat sink
    Patent number: 7460371
    Abstract: In one embodiment, there is disclosed apparatus having a printed circuit board (PCB); a heat sink device for disposition adjacent the bottom surface of the PCB; at least one wiffle tree component disposed adjacent the top surface of the PCB, having a base portion with a plurality of legs extending therefrom; and at least one mechanism to generate a clamping force between the at least one wiffle tree and the top surface of the PCB, and between the bottom surface of the PCB and the heat sink. There is disclosed a method of attaching a printed circuit board (PCB) to a heat sink. In an embodiment, the method includes providing at least one wiffle tree component; disposing one of the at least one wiffle tree component adjacent to the PCB; and securing the one of the at least one wiffle tree component with a fastener. Other embodiments are also disclosed.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: December 2, 2008
    Assignee: Agilent Technologies, Inc.
    Inventors: John William Andberg, Romi Mayder
  • Counterflow microchannel cooler for integrated circuits
    Patent number: 7460369
    Abstract: A plurality of channels are formed in a base, e.g., a substrate of an integrated circuit, each channel extending between edges of the base. Two pairs of manifolds are provided, the first pair communicating with a first group of channels and the second pair communicating with a second group of channels, the first group of channels and the first pair of plena isolated from the second group of channels and the second pair of plena. Each of the pairs of manifolds includes multiple branches coupled to the channels and a common plenum. Cooling fluid is injected into the channels from different sides of the base, causing fluid to flow in different directions in the two groups of channels, the channels in thermal contact with the integrated circuit.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: December 2, 2008
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Richard C. Blish, II
  • Power distribution panel with modular elements
    Patent number: 7460360
    Abstract: A power distribution panel having circuit elements such as KTK and GMT fuses removably mounted to a unit housing by means of module members, thereby allowing for ease of customization of the circuit elements of the power distribution panel.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: December 2, 2008
    Assignee: ADC Telecommunications, Inc.
    Inventors: David E. Schomaker, Carlos Arroyo Gonzalez, Delfino Hernandez, Luis Manuel Sanchez Aguilar, Narciso Delgado Guevara, Celsa Mora Curiel
  • Heat dissipation assembly
    Patent number: 7460370
    Abstract: A heat dissipation assembly (100) is provided. The heat dissipation assembly (100) comprises a chassis (20) of an electronic product, a heat sink (10) having a bottom portion thereof being insert-molded with the chassis (20) so that the heat sink (10) and the chassis (20) are integrally connected together as a single piece, a base (30) secured to the chassis (20) and having a top surface (32) thermally connecting with a heat generating electronic unit of the electronic product and a bottom surface (34) thermally connecting with the chassis (20), a fan (40) used for cooling the heat sink (10), and a heat pipe (50) having an evaporator section (52) connected with the base (30) and a condenser section (54) connected with the heat sink (10).
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: December 2, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Nien-Tien Cheng, Chen-Shen Lin