Abstract: A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of the heat sink and a second zone formed on a second area of the heat sink. The processor may overlap or overlie the first zone, with the second zone generally outside the footprint of the processor and optionally surrounding the processor's footprint. The first zone may have a generally smooth surface, while the second zone may have a surface rougher than the first zone. The first zone may be finished to a specific smoothness while the second zone may be finished to second particular smoothness that is generally less than the first zone.

Abstract: A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing part. The operating member has a coping and a sidewall extending downwards from an edge of the coping. The sidewall defines two locking slots engaging with the first latching leg and an elastic rib extending downwards from the coping and engaged with the first latching leg of the latching member for inhibiting any movement of the operating member in a direction along the locking slot of the sidewall.

Abstract: A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion that defines an arch chamber that accommodates the second end of the heat pipe, two press portions respectively extended from two opposite lateral sides of the protruded arch portion and pressed on the top surface of the thermal chip, and a plurality of hook portions respectively extended from the press portions and hooked on the bottom edge of the circuit board.

Abstract: A sleeve-tightening heat dissipating module includes a pillar, a sleeve, a stand, and heat sinks, wherein the pillar is a cylinder with a wider lower part, and the sleeve can be enclosed at a circumference of the pillar and is provided with a chimb at its bottom rim for allowing the stand and heat sinks to be sheathed on it. As an inner diameter of wider part of the sleeve is smaller than an outer diameter of wider part at lower end of the pillar, the sleeve will be locked on a top end of wider part of the pillar upon assembling. If the sleeve is pressed downward, the sleeve can be expanded outward to tighten the heat sinks, so as to be assembled and fixed with the heat sinks, without a need to paste with a glue, to weld, and to anodize.

Abstract: A plasma display panel (PDP) assembly with an air gap for improving heat dissipation is disclosed. In one embodiment, the PDP assembly includes: a panel assembly having a front panel and a rear panel coupled to the front panel, a chassis base supporting the panel assembly; a driving circuit unit attached on a back surface of the chassis base, and a flexible printed cable, one end of which is connected to an electrode terminal of the panel assembly and the other end connected to a connector of the driving circuit unit, configured to transmit circuitry driving signals. In addition, an air gap is formed between the panel assembly and the chassis base.

Abstract: Techniques for distributing airflow for cooling an electronic device are described. Vanes positioned immediately after a set of cooling fans direct airflow over a plurality of components within the device. For example, the vanes may be designed to segment the net fan blade travel area into equal sections—one section per component—to accomplish balanced airflow distribution. Components requiring cooling include cards, e.g., printed circuit boards and the like. A plurality of cards may form slots between the cards and the vanes may divide the airflow equally among the slots to provide consistent cooling for each of the cards. Embodiments of the invention may be directed to distributing cooling airflows within a computing device, e.g., a network router or a server.

Abstract: Disclosed is a cooling device for a folder type portable wireless terminal including a main body and an openable folder coupled with the main body. In the cooling device, a cooling plate is installed in the folder with a predetermined size, and a heat transfer element has one end connected to the cooling plate and the other end connected to a predetermined portion of a mainboard of the main body to transfer heat generated from the mainboard to the cooling plate.

Abstract: A heat sink fixing device for fixing a heat sink on a printed circuit board is disclosed. The fixing device comprises a connecting portion fixed on one side of the heat sink, an extension portion connected with the connecting portion, a first pin extended downward from partial lower edge of the extension portion for plugging into the printed circuit board, and a second pin extended downward from partial lower edge of the connecting portion and connected with the first pin for plugging into the printed circuit board. The heat sink fixing device can strengthen the pin structure, increase the tin soldering area and fix the heat sink on the printed circuit board firmly.

Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module for contacting with the heat-generating component. The base includes a plurality of first walls and a plurality of second walls. The sidewalls of the retention module enclose a periphery of the base, and the first walls and the second walls respectively abut against the sidewalls of the retention module when the base is located at a first position and a second position. A rotation of the base from the first position to the second position reduces an adhering force generated by a thermal grease located between the base and the heat-generating component.

Abstract: Disclosed is a gas-insulated switchgear device, in which a space for dismantlement and inspection work which facilitates the dismantlement and inspection work of circuit breakers at the time of the occurrence of accidents of the circuit breakers are provided and an installation area for the gas-insulated switchgear device can be reduced. The gas-insulated switchgear device includes a pair of spaced apart main bus lines, three circuit breakers connected between the main bus lines, a common space for dismantlement and inspection work provided between two of the three circuit breakers, and branch bus lines provided above the common dismantlement and inspection work space using the common dismantlement and inspection work space and disposed in such a manner that insulatedly leading-out directions of the branch bus lines cross in order to balance voltage.

Abstract: A once-through forced air-cooled heat sink according to the present invention comprises: a heat sink portion which is configured to be attached to an object that is to be cooled; and a blower for introducing cooling air into the heat sink portion. The heat sink portion comprises: an air inlet; an air outlet; and fins for dissipating heat in the object with the aid of cooling air which is supplied by the blower. The air inlet, the air outlet, and the fins are arranged such that the cooling air is introduced from the air inlet, then cools the fins and flows to the air outlet in a once-through pattern.

Abstract: An electric connection box provided with a circuit structure, a casing for accommodating the circuit structure therein, a plurality of bus bar terminals disposed on a cabling path crossing the casing in a horizontal direction and electrically connecting the circuit structure and an external connecter to each other, and a terminal support portion for supporting a horizontal portion crossing the casing in the horizontal direction in the plurality of bus bar terminals from below, in which a first rib capable of contact with the horizontal portion from below are projected on a surface opposite to the horizontal portion in the terminal support portion, and a space between the first rib is a first groove portion recessed downward.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

Abstract: A rack system is disclosed that includes a plurality of electrical modules (48), a frame (10) supporting the plurality of electrical modules (48) that includes a plurality of frame members (16, 18, 20, 22, 26, 38, 39, 40) and a plurality of locations (52) for supportably receiving one of the plurality of electrical modules (48), a first frame member (16) of the plurality of frame members including a first bore (68) for transporting a liquid along a length of the first frame member (16) and having a plurality of openings extending through the first frame member (16) between a sidewall of the bore (68) and an exterior surface of the frame member (68), and a plurality of first connectors (64) mounted in the plurality of openings, wherein one of the plurality of electrical modules (48) includes a cooling liquid pathway (84) and at least one second connector (86) providing access to the cooling liquid pathway (84) detachably engaging the first connector (64) to provide fluid communication between the first bore (6

Abstract: A mechanical set of plates is able to simultaneously and quickly removably secure and remove one or more printed circuit boards (PCBs) in an enclosure in one single motion, and act as a heat sink to conduct heat away from the PCBs. The PCBs are removably secured through a clamping mechanism that may be a screw type or cam lever action by clamping down on the exposed card edges, thus allowing thermal transfer to begin on all cards. The apparatus may be used with any enclosure requiring thermal transfer from PCBs to the enclosure, including cages and enclosures that may or may not use forced airflow (fans or blowers) for heat dissipation.

Abstract: Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.

Abstract: A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.

Abstract: An electrostatic chuck includes; a base made of ceramics, in which an electrode generating electrostatic attractive force is embedded; a cooling member which contains metal; a bonding material which bonds the base and the cooling member to each other; a gas providing passage which penetrates the base, the bonding material, and the cooling member; and an engagement member and a bolt member, which are fixing members mechanically fixing the base and the cooling member to each other.

Abstract: A quick change mechanism is provided for a meter socket assembly including a base member structured to be coupled to a meter, a number of electrical bus members extending outwardly from the base member, and at least one electrical connector electrically connectable to a corresponding one of the electrical bus members. The quick change mechanism includes a foundation and a receiving portion disposed generally opposite and distal from the foundation and including a number of apertures. Each aperture receives a corresponding one of the electrical bus members. Resilient protrusions extend outwardly from the receiving portion and are operable between an undeflected position in which the resilient protrusion secures the electrical connector on such electrical bus member, and a deflected position in which the resilient protrusion is deflected away from the electrical connector in order that the electrical connector is removable from such electrical bus member.