Abstract: A high frequency, low cost power semiconductor device (60) is provided by combining a semiconductor die (46) with a leadframe (10,12) having a coplanar upper surface (36) with thin external leads (18,20) and a thicker central die bond region (24) whose upper face (16) and sides (42) are covered by an encapsulation (52) but whose lower face (54) is exposed. The leadframe (10,12) desirably has an "H" pattern with the arms (18,20) extending laterally from opposed sides of the encapsulation (52) and down-formed to have their lower surfaces (62) coplanar with the exposed lower face (54) of the central die bond region (16,24) which forms the cross-bar of the "H". The leadframe is monolithic and preferably formed by skiving. The device is especially suited for surface-mounting.

Abstract: A composite leadframe is provided. The leadframe comprises a rigid metal portion electrically interconnected to a flexible multi-layer portion. When sealed within an electronic package, the composite leadframe provides a higher lead density than achieved by rigid metal leadframes and better electrical and mechanical properties than achieved with flexible leads. The package may comprise a discrete base and cover component with the leadframe disposed between or a monolithic block of plastic encapsulating the electronic device and a portion of the leadframe.

Abstract: The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.

Abstract: A computer casing connector comprising an electrically conductive U-shaped body, one limb of which has a plurality of snap catches to snap on one piece of a computer casing and the other limb of which has a plurality of resilient arcuate members to contact with the other piece of the computer casing when the casing is assembled so as to provide an electrical connection between the casing pieces and, thus, prevent the radiation of electromagnetic waves out of the casing.

Abstract: A kit for the assembly of an adhesively sealed package designed to encase an electronic device is provided. The kit comprises a metallic base and cover components which are adapted to receive a polymeric adhesive. At least those portions of the base and cover component which will contact the polymeric adhesive are provided with a coating of a second metal or oxide. In one embodiment, first, second and third dry film adhesives are tacked to the base and cover components.

Abstract: An integral box attached to harpoon-shaped projections in the bottom of a channel-like duct member for electrical wiring by way of a fixed appendage and a pivotable locking tab. The latter has a lower portion extending below the base of the box and an upper portion. The lower portion is provided with a retaining appendage for a harpoon-shaped projection and the upper portion is provided with a locking mechanism.

Abstract: An improved electromagnetic wave shielding panel and wall structure includes a plate member of electrically nonconductive material and an electrically conductive foil applied to at least one surface thereof, with an electrically conductive net laid on the electrically conductive foil with its fringe portion extending beyond the edge of the plate member. The use of an electrically conductive net which extends beyond the edge of the plate member, facilitates electrical connection at the joint between adjacent panels and enhances electromagnetic shielding at both low and high impedance levels. Necessary electrical connections can be made simply by abutting the adjacent side surfaces of the panels against each other with their net fringe portions sandwiched therebetween.

Abstract: A casing structure adapted for accommodating an electronic equipment or instrument generally comprises a body and a lid which are to be mated together. The inner surfaces of the walls of the body and the lid are coated with conductive coating materials and the conductive coats of the body and the lid are maintained to be at equal potential through a conductive member. The side wall of the body is provided with an inward-projecting edge for defining the opening of the body and an outward recess and the side wall of the lid is provided with an inward recessed edge for defining the opening of the lid and an outward-projecting portion, the recessed edge of the lid being mated with the projected edge of the body when they are connected.

Abstract: A high current feedthrough package comprising a plurality of alternating rings respectively comprising a thermally conductive material and an electrically conductive material. The thermally conductive rings comprise a thermally conductive ceramic material such as aluminum nitride, while the electrically conductive rings comprise a material such as molybdenum, or one of its alloys, for example. The package is thus comprised of alternating rings or laminations of aluminum nitride and molybdenum, for example, that are stacked or layered to form a wall. The layered wall is brazed in a single step onto a base. The molybdenum rings act as high current feedthroughs and comprise tabs on the inner and outer perimeter which are available for interconnection to devices disposed within the enclosure and to external circuits. The aluminum nitride rings provide electrical isolation between the feed-through rings.

Abstract: The invention relates to a method and a shielding housing for shielding a printed circuit board, or a part of it, from disturbances caused by electromagnetic interference (EMI). In the method, during the manufacturing phase of the printed circuit board there are cut in the board slots (U) through the printed circuit board (pc), the length of the slots being L. The first part (2) of the housing is soldered to the printed circuit board (pc) in such a way that it approximately interconnects the ends of the cut slots (U). This first part constitutes one side wall of the shielding housing. The second part (1) of the shielding housing is made up of a cover (5) and three side walls, in which there is formed an inside groove having a height which corresponds to the thickness of the printed circuit board.

Abstract: An apparatus for electromagnetically shielding electronic equipment has a first and second spaced apart housing members having a gap between them. A rigid member having a plurality of openings is interposed between them. A spring member connected to the rigid member has a plurality of spring fingers extending through openings in the rigid member. A cover member has a cam which forces the first housing member against one side of the spring member to extend the spring finger into the second housing member in order to cause an electrical connection between the first and second housing members.

Abstract: An improved radio-wave insulating device for a high frequency signal distributor, comprising a cover 2a and a case body 3a. The case body 3a is provided with a plurality of protuberances 32a which slightly outsizes the corresponding notches 22a of the cover 2a. Thus when the cover 2a is mounted in place in the case body 3a, a force, which results from the deformation of the protuberances 32a in the notches 22a, is provided parallel to the corresponding side of the cover, thus ensuring a firm engagement between the cover and the case body, without causing the bulging-out of the case body.

Abstract: A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate and a layer of conductive material adjacent the ceramic base substrate to serve as a ground plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground plane but physically separated therefrom. Incorporation of a ground plane into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.

Abstract: An electric circuit assembly includes a copper pin (310) extending through aligned apertures (304, 314) in a directly bonded ceramic substrate (302) and copper lead frame (312), and directly bonded to the substrate (302). The pin (310) has an enlarged flange head (322) at one end, and is thermally deformed and enlarged at the other end (324) during the direct bonding. In another embodiment, one end (342) of a copper pin (340) extends out of an aperture (334) in a ceramic substrate (332) and slightly beyond the substrate surface (336). A lead frame (346) is directly bonded to the substrate surface (336) and droops around the protruding end (342) os the pin (340) and conforms thereto during the heating during the direct bonding. The lead frame (346) has a humped configuration over the aperture (334) in the substrate (332) and engages the protruding end (342) of the pin (340) and is deformed and raised thereby away from the substrate surface (336).

Abstract: A gasket, and method of making same, is shown to consist of a substantially solid core of silicone rubber supporting an electrically conductive coating primarily made from a polythioether impregnated with particles of nickel, the coating also containing an oxidizing inhibitor.

Abstract: A structure for attenuating the passage of electromagnetic energy includes at least two panels made of electromagnetic energy-attenuating material having adjacent edges thereof either abutting or overlapping one another to form a portion of an enclosure. A shielding tape defining transverse waveguide channels either straddles the seam between the two panels in the abutting mode, or is sandwiched between the overlapping edges of the panels in the overlapping mode. In either mode, the shielding tape operates not to create complete conductive continuity between the two panels at every point, as do previous tapes and techniques, but rather to define a multiplicity of small waveguides which are operating beyond cutoff, and are of such an impedance relative to the impedance of the incoming electromagnetic energy that in the frequency range in question, the energy is attenuated by the channel waveguides to levels 50 dB to greater than 100 dB.