Abstract: An electronic device such as a portable computer is shielded against electromagnetic interference using a flexible envelope that surrounds a circuit card within the housing of the device. The flexible envelope forms a shielding enclosure and has an electrically insulating flexible sheet, for example of polyethylene, and a sheet of conductive fibers embedded in the flexible sheet so as to leave a nonconductive face oriented toward the circuit card. The conductive fibers can be metallized nylon and are sufficiently dense to obtain a resistivity of 10.sup.-1 to 10.sup.-2 .OMEGA./.quadrature.. The enclosure forms a hollow envelope with the conductive fibers coupled electrically across a seam, for example by cutting the flexible sheet and embedded fibers using heat. For use with a portable computer having a pivoting screen, a neck extension of the enclosure carries conductors through the area of the pivot.

Abstract: A plurality of separators are formed on a connector member for separating contacts provided on said connector member so as to render these contacts to be space apart with one another. A plurality of grooves are formed on a plug member into which the separators formed on the connector member are inserted. Said contacts provided on the connector member and said contacts provided on the the plug member are adapted to be electrically connected by the engagement of said separators of the connector member with said grooves of the plug member.

Abstract: Disclosed is a stacked die carrier assembly and method for packaging and interconnecting silicon chips such as memory chips. The carrier is constructed from a metalized substrate onto which the chip is attached. The chip is wire bonded to the conductor pattern on the substrate. Each conductor then is routed to the edge of the substrate where it is connected to a half-circle of a metalized through hole. A frame is attached on top of this substrate. This frame has also a pattern of half-circle metalized through holes that aligns with the holes on the bottom substrate. The combination of the bottom substrate with the silicon die, and the frame on top, forms a basic stackable unit. Several such units can be stacked and attached on top of each other. The top unit can finally be covered with a ceramic lid that also has a matching half-circle metalized through hole pattern along its edge.

Abstract: A terminal box comprising a block of non-conductive material such as polystyrene or other comparable material having a first bus bar embedded therein with terminal connections to connect the live or hot wire of a first circuit leading to an electrical source, of a second circuit leading to a first load, and of a third or more circuits leading to a second or more load, a second bus bar embedded therein with terminal connections to connect the neutral wire of the first circuit leading to the electrical source, of the second circuit leading to the first load, and of the third or more circuits leading to a second or more load, and a third bus bar embedded therein with terminal connections to connect the ground wire of the first, second, third or more circuits.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when the contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: An electrical circuit (101) that is disposed on a substrate (103) employs a method and apparatus for providing electromagnetic shielding of the electrical circuit (101). One or more compressible, electrically conductive contacts (107), each of which includes a substantially planar portion (201), are coupled at their respective planar portions (201) to a receptacle area (105) on the substrate (103) that substantially encircles the electrical circuit (101). A shielding enclosure (109) having a top portion (110) and a plurality of side portions (111) is positioned upon the compressible, electrically conductive contacts (107) such that the side portions (111) compress at least some of the compressible, electrically conductive contacts (107) to substantially enclose the electrical circuit (101).

Abstract: A front panel for mounting a printed circuit board in a card cage. A central frame is formed with an integral extrusion from which integral printed circuit board mounting brackets can be formed on one surface of the central frame. Ejector assemblies mount at each end of the central frame and include an extruded mounting bracket that attaches to the central frame, an extruded ejection handle with legs that straddle the mounting frame and a solid handle portion with a pivot that mounts to a solid pin captured in the assembled structure. Rotating the extraction handle causes the legs to bear against the card cage and fully extract the printed circuit board from a back plane. When adjacent printed circuit boards are fully seated, the extraction handles align parallel the central plane and can support identifying labels in a clear and secure fashion.

Abstract: A low cost package uses non-ceramic materials to environmentally seal an air chamber for an electronic component. The package includes a base formed by a plurality of essentially flat terminals molded in a polyphenylene sulfide resin so as to provide a planar surface for surface mounting to a circuit board. A component placement area on the base receives a cap which covers and seals the area from contaminants.

Abstract: A support assembly, and associated method, for permitting a reduced-sized, card member to be received by a standard-sized, card reader assembly of a radio telephone. The support assembly is comprised of a frame formed of a standard-sized, card member having a through-hole extending therethrough. The through-hole is of dimensions corresponding to the card member of the reduced dimensions. A thin, support sheet covers a portion of an opening formed by the through-hole on a top surface of the frame to form a front joist thereby, and the thin, support sheet is folded about an edge of the frame similarly to form a rear joist over an opening formed upon a bottom face surface of the frame by the through-hole. The front joist and the rear joist together form a pocket for supporting the card member of the reduced dimensions within the through-hole.

Abstract: An electrical connection between an electric conductor and an oxide superconductor is effected without the intermediary of a thin insulating layer that is formed by leaving the oxide superconductor in the atmosphere. This electrical connection is formed by removing the thin insulating layer that is formed by leaving the oxide superconductor in the atmosphere, and by electrically connecting the electric conductor and an exposed surface of the oxide superconductor.

Abstract: A data card is provided which has an electrically conductive rail (70, 72 FIG. 2 ) extending along its opposite sides and part of its rear, and connected to the ground plane (60) of a circuit board (46) of the card, to provide EMI (electromagnetic interference) shielding along the perimeter of the card. The rail has top and bottom edge portions (94, 96 FIG. 6 ) that are each bent into a U shape to extend around top and bottom ridges at the side of the card body to lock the rail in place. One edge portion includes a projecting tab (110) which is bent to extend inwardly and engage the ground plane (60) of the circuit board. The molded card body has a through hole (114) in its side portion, and the tab can extend into that hole before extending inwardly to the circuit board ground plane.

Abstract: An EMI/RFI gasket provides a barrier to EMI and RFI radiation transmission to and from electronic circuits within an electronic system chassis having receptacles that receive electrical connectors and an electrically grounded cover plate that connects the chassis to an electrical ground. The EMI/RFI gasket helps to provide a 360.degree. EMI/RFI barrier for the electronic system chassis. The EMI/RFI gasket is a flexible, electrically-conductive material with sufficient surface area to adhere and electrically connect to the cover plate. The EMI/RFI gasket has a receiving slot that is symmetrical about a longitudinal axis and a latitudinal axis of the gasket plate. A plurality of deflected teeth formed from the gasket plate are positioned around the receiving slot and deflected from the gasket plate to contact the connector at points separated by not greater than a predetermined distance. The predetermined distance is at least in part a function of the expected EMI and RFI radiation wavelengths.

Abstract: A laminated groundplane structure for shielding electrical equipment such as printed circuit boards has a conductive sheet sandwiched between a soft foam layer and a rigid foam layer. A connection pin coupled to the printed circuit board or the like pierces the soft foam layer to engage in the conductive sheet. The groundplane can include, in order, laminated layers of soft closed cell foam, an insulating dielectric layer, a conductive fabric defining the conductive sheet, and a relatively rigid foam for maintaining a shape in the groundplane structure. The connection pin includes a conductive post protruding toward the groundplane, and a movable conductive shaft which is spring biased to protrude axially relative to the conductive post for piercing the conductive sheet through the soft foam layer The movable shaft resembles a twist drill with an enlarged or barbed head, which passes through the conductive sheet to engage in filaments of the conductive sheet.

Abstract: A ceramic package for containing a semiconductor chip including a heat radiating plate, a base plate for wiring, and a ceramic package for containing a semiconductor chip. The package contains a ceramic board, a ceramic cap and a metal lead frame. The heat radiating plate and the ceramic board are made of silicon nitride sintered body, which is characterized in that the number of grain boundaries per a 10 .mu.m straight line drawn in an arbitrary section of the sintered (polycrystal) body is 20 or fewer.

Abstract: A semi-conductor package having an insulator formed by a supporting portion, a mounting portion and connecting members, and a layer of electrically conductive material on the insulator in a pattern forming a pad and inner leads connected to the pad by supporting bars. A chip is attached on the pad, and the inner leads are wire-connected to the chip. The pad is vertically offset from the inner leads and the chip is supported in recessed fashion on the pad which shortens the length of the connecting wires whereby the wire-connecting efficiency and the structural stability are improved.

Abstract: A system for the establishment and control of an electromagnetic signal propagation environment containing a particular set of desirable radio frequency characteristics within a bounded area. The bounded area is typically either a business office environment or a residential environment. The electromagnetic signal propagation control system provides interference rejection by preventing electromagnetic interference signals from entering an enclosure to interfere with an enclosed communications system or by preventing signals generated by the enclosed communications system from exiting the enclosure and interfering with another nearby communications system. The system also customizes the electromagnetic signal environment to improve communications within interior areas otherwise blocked from signal propagation and to absorb signal reflections from interior surfaces that may cause interference for the enclosed communications system.

Abstract: A superconductive tube for magnetic shielding has a cylindrical substrate composed of at least two members, an intermediate medium placed upon a surface of the inner and/or the outer wall of the substrate, and a layer containing a superconductive oxide, placed upon the intermediate medium, which are integrally formed in a cylindrical shape.

Abstract: An aluminum foil strip is provided with adhesive strips on one face surrounding the strip of foil. The strip of foil is then positionable and attachable to an electronic cabinet frame over exposed raw metal areas for intimate electrical contact when the cabinet door is closed. This strip of foil provides electrical continuity between the frame and door as well as a seal against EMI/RFI at the cabinet/door interface.

Abstract: A heat-resistant package for electrical components comprises a housing composed of a plurality of independent side walls made of heat resistant ceramic material. Sealed-in leads are provided in one or more of the side walls. After, the leads are installed the ends of the side walls are brazed together to form a closed ring and that ring is brazed to the housing bottom wall. Also, a continuous metal ring may be brazed to the tops of the side walls. The brazings provide hermetic seals between the housing walls and they, along with the seal ring, provide compliance between the walls making the housing resistant to thermal shocks.

Abstract: A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized surface. Each mechanical/electrical connection between the lead frame or edge clip and the contact pads includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.