Abstract: A semiconductor device of the present invention accommodates a large semiconductor chip in a downsized package without impairing its reliability. The semiconductor chip is bonded on a relatively small die pad. Common inner leads and a plurality of inner leads are disposed opposite and spaced from the semiconductor chip by a gap ranging from 0.1 mm to 0.4 mm and the gap between the semiconductor chip and the common inner leads and the plurality of inner leads is filled with a resin which forms part of a resin package.

Abstract: An integrated circuit package characterized by an interposer including a thin, flexible, planar insulator having a plurality of substantially radial traces provided on one side thereof. The other side of the insulator is attached to the die attach pad of a lead frame, and an integrated circuit die is attached within a die attach area of the assembly. A first set of wires couples bonding pads of the die to the traces, and a second set of wires couples the traces to bonding fingers of the lead frame. The bonding fingers, interposer, die, and both sets of wires are then encapsulated in plastic. The interposer can be advantageously manufactured in a tape automated bonding (TAB) process to provide a low cost, high performance, and versatile lead frame assembly.

Abstract: A semiconductor package comprising a semiconductor chip received in and attached to a cavity of a base made of a ceramic or aluminum, by means of an adhesive, a lid fixedly attached to the upper surface of the semiconductor chip, the lid having a plurality of solder bumps being in contact with bonding pads of the semiconductor chip and a plurality of metal contacts formed on the solder bumps of the lid. The lid comprises an insulating polyimide film or a rectangular plate made of a nonconductive ceramic material. The semiconductor package eliminates the use of a lead frame and metal wires, thereby enabling the manufacture thereof to be simplified. It also achieves a simplification, a lightness, a thinness, a compactness in construction. With the simplified construction, a reduction in manufacture cost and an improvement in productivity are achieved. In manufacturing semiconductor devices, the semiconductor package also provides an improvement in the degree of dense integration.

Abstract: An integrated circuit package that permits high density packaging of circuit chips. The integrated circuit package has a base substrate support member with an upper and a lower surface. A cavity is located in its upper surface and a similar cavity is located in its lower surface. Two circuit chips are located in each cavity that are connected together in back to back relationship. The cavities are closed or sealed by lids that are bonded to mounting surfaces that are located on the base substrate support member and surround the cavities. A series of terminating leads are located on two sides of the base substrate support member that are electrically connected to the circuit chips. A single cavity embodiment is also set forth that is designed for use when a lesser density is acceptable or desired.

Abstract: An insulting-liquid immersed electrical machine comprises an electrical machine, a hermetically sealed tank containing the electrical machine, and insulating liquid arranged between the electrical machine and the tank, wherein the tank includes a deformable member through which gas and liquid cannot pass and whose shape is variable so that a receiving volume capable of receiving the insulating liquid between the tank and the electrical machine is variable. The insulating liquid completely fills the receiving volume in the tank, and a pressurizing arrangement is provided for adjusting the shape of the deformable member so that the pressure of the insulating liquid in the tank is kept at a suitable degree for preventing the insulating liquid from vaporizing.

Abstract: An enclosure is constructed of electromagnetic radiation shielding material for housing and supporting circuitry that emits electromagnetic interference. Symmetrical top and bottom covers are fabricated of a generally U-shaped configuration, with a downwardly extending tab on one side region of the upper cover and an upwardly extending tab on an opposite side region of the lower cover, these tabs for covering a butt joint between the upper and lower covers. Symmetrical front and rear covers are each constructed having inwardly extending sides also for covering the butt joints, with a lip on each of these side regions. Slots in these lips support circuit boards in the enclosure. Segmented lips on upper and lower sides of the front and rear covers contact upper and lower regions of the upper and lower covers. Constructed as such, there are no significant gaps in the enclosure to radiate electromagnetic radiation.

Abstract: Disclosed is a directly solderable circuit board assembly including a main circuit board directly connected to an auxiliary circuit board without the use of interfacing terminals. The main circuit board has a slot formed therein and the auxiliary circuit board has a projection which is received in the slot of the main circuit board. Conductive pads are formed on both circuit boards at substantially right angles adjacent the intersection of the two circuit boards. A solder fillet is formed bridging the copper pads on each circuit board to provide electrical and mechanical connection.

Abstract: A CCD package and a method for assembling a CCD package utilizing a TAB process. The method comprises the steps of preparing a tape for TAB which has outer leads, inner leads and die bonding paddles, bonding a chip on the paddles and then bonding the free ends of the inner leads on the bonding pads of the chip, connecting the inner leads and the outer leads through insulations, adding a light shield layer beneath the chip, and attaching a glass lid to the surface portions of the inner leads positioned just above the chip. Accordingly, packages of light, laminated and simple structure can be obtained, thereby advantageously enabling the compactness of products utilizing CCD elements. Also, the process is also simplified, thereby decreasing the cost of producing CCD elements.

Abstract: A corrector ring maintains the coplanarity of the tips of the leads of a quad flat pack QFP package during shipping and handling. A first snap-fit or adhesively-fixed ring member has an inner peripheral surface which engages the lower walls of the QFP package. The ring member also has an outer peripheral surface which engages the inner surfaces of the resilient leads of the QFP package. A second snap-fit adhesively-fixed ring member is held in place over the outer surfaces of the leads.

Abstract: Electrical parasitic parameters can lead to reflections and switching noise in a circuit causing signal distortions. A stripline configuration semiconductor device (10) can be manufactured to reduce the overall parasitic parameters, especially inductance, of a device. In one embodiment, a semiconductor die (12) having a grounded backside (20) is directly bonded with an electrically conductive adhesive (22) to a metal base (16), thus grounding the metal base. The die is also electrically connected to a leadframe (14) by wire bonds (24). An electrically insulating adhesive (28) is used to seal a metal lid (18) to the metal base with the die and leadframe disposed between the lid and base, thus forming a protective package body. The lid is grounded to a ground lead (26) of the leadframe with a solder bridge (30). An additional advantage to having a metal package body is that it provides shielding for the device.

Abstract: An electromagnetic shielding clip for providing an electrical connection between two mating surfaces. The clip of the present invention comprises an electrically conductive sheet. The sheet is curved into a series of interconnected arc-shaped sections, each oriented opposite to the arc-shaped section adjacent to it. Two of the arc-shaped sections appear at opposite ends of the clip and are used to attach the clip to a mating surface through two parallel slots. Another arc-shaped section curves away from the parallel slots for contract to another mating surface. The present invention also includes a tool and method for inserting the clip.

Abstract: Terminal block for automation device, notably for programmable controller, mounted movably and electrically connected to an interface module. The lateral wall of the body of the terminal block which is situated on the side of the openings for passage of the flexible leads connected the units of the automated system comprises a pivoting flap.

Abstract: A semiconductor package comprising a connection pad device for electrically connecting at least a part of chip pads of a semiconductor chip with the corresponding inner leads of a lead frame. The connection pad device comprises a film as a connection pad device body, a plurality of copper foil wirings each having one end positioned to correspond to each chip pad of the semiconductor chip and the other end positioned to correspond to each inner lead of the lead frame, a plurality of first jumper pads protruded from the film, each of the first jumper pads being connected to one end of each corresponding copper foil wiring and wire-bonded to each corresponding chip pad, and a plurality of second jumper pads protruded from the film, each of the second jumper pads being connected to the other end of each corresponding copper foil wiring and wire-bonded to each corresponding inner lead.

Abstract: The drain hole core for a drain seal fitting includes an elongated elastomeric member having a handle on one end, a rod-like member on the other end, and a integral plug between the handle and rod-like member. The drain hole core is inserted into the drain opening of the drain seal fitting such that the rod-like member extends up into the bore extending through the drain seal fitting and the plug seals the drain opening. A dam seals that area between the electrical wiring and the internal circumferential wall of the lower portion of the drain seal fitting. A sealing compound is then poured into an access opening in the side of the drain seal fitting so as to seal the bore of the drain seal fitting and to cover a portion of the rod-like member. Once the rod-like member is removed, it acts as a mold and provides a drain path from that portion of the bore above the sealing compound to the drain opening. The drain opening is then closed with a drain fitting.

Abstract: Intended for fitment to the electric motor of a motorized valve, the terminal box (1) is modular in design and can be utilized in different mounting positions to suit the direction from which power supply and control system wiring is routed to the valve.

Abstract: After a semiconductor die is placed onto a leadframe and electrically connected to the die, the die and the ends of the leads adjacent to the die are encased in a packaged body. The exposed ends of the leads are trimmed so that the leads are of desired lengths for leadforming, or for connection to substrates or sockets. The ends of the leads are enclosed in a protective body, so that when the package is tested and handled, the protective body reduces undesirable bending of the leads. By trimming the leads before forming the protective body, the leadframe used need, not be larger than those normally used.

Abstract: A protective casing for optical instruments, particularly a weatherproof casing with a casing shell (2), a casing axis A--A, a front wall (3) and a backwall (4) located on each end of the casing shell, and a casing support (9) located on the underside, which is attached to a stationary base (12). With at least one electric cable (23a) leading to a connector plug (11) located on the backwall (4). A detachable cable casing (20) is provided to house the cables out of sight, which extends from the base (12) to the connector plug (11), and together with the wall elements of the protective casing forms a closed cable conduit (21). At least one electrical cable (23a) runs inside the cable casing (20). A particular advantage is that the cable casing first runs between the casing support (9) and the cable casing (20) parallel to the surface of the casing shell (2), forming the first segment (21a) of the cable conduit (21), and then is led in an angle around the back bottom edge (22) of the backwall (4).

Abstract: An apparatus for screening a magnetic field including a number of panels having a panel core of carrier material and at least one screening layer of soft magnetic material adhered to the panel core, where adjacent panels are secured in rigid, load-bearing relation to one another.

Abstract: A package for the encapsulation of an electronic component (50) includes a bottom (40), lateral faces (41) positioned around a main axis of the package and an open face (42) opposite the bottom (40). Each lateral face (41) includes guides (48) for guiding connection wires (45) of the component (50). These guides (48) are distributed evenly around the main axis of the package. The sides of the bottom (40) are equal.

Abstract: To seal the gaps and openings in the housing of an electrical component, the outside wall of the base of the housing is provided with filling reservoirs from which lead distributing channels leading to sealing locations to be sealed by sealing compound. The distributing channels are subdivided into sub-channels by centrally extending distributing ribs so that the sub-channels provide an increased capillary action for sealing compound deposited into the filling reservoirs.