Patents Examined by Bot Ledinh
  • Patent number: 5194694
    Abstract: To seal the gaps and openings in the housing of an electrical component, the outside wall of the base of the housing is provided with filling reservoirs from which lead distributing channels leading to sealing locations to be sealed by sealing compound. The distributing channels are subdivided into sub-channels by centrally extending distributing ribs so that the sub-channels provide an increased capillary action for sealing compound deposited into the filling reservoirs.
    Type: Grant
    Filed: June 10, 1991
    Date of Patent: March 16, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventors: Horst Hendel, Herbert Mitschik, Dietrich Schwarz
  • Patent number: 5189257
    Abstract: A transformer having an integral cabinet with an apparatus for hinging and clamping the cover of the cabinet onto its base is provided. The hinge is formed by an L-shaped member extending from a lip surrounding a planar top formed in the cover. A flange having rearward and downward extending portions extends from the rear wall of the cabinet base. The hinge engages a slot formed in the downward extending portion of the flange. The distance from the hinge to the cover top is less than the distance from the slot to the upper edge of the rear wall on which the cover top rests. Thus, rotation of the cover into the closed position with the hinge engaged causes elastic deformation of the hinge, thereby creating a spring force which clamps the cover onto the base. Elastic deformation in the flange imparts addition clamping force. Sufficient clearance is provided for this elastic deformation by either sloping the rearward extending portion of the flange or sloping the planar top of the cover.
    Type: Grant
    Filed: March 5, 1991
    Date of Patent: February 23, 1993
    Assignee: ABB Power T&D Company, Inc.
    Inventors: Virgil L. Borgmeyer, Chester F. Trice, Dale A. Tempco, Thomas F. Clark, William J. Ritter, Leo H. Huests
  • Patent number: 5177324
    Abstract: A printed circuit board providing RF shielding. An electrically insulating material serves as a substrate (10) with two opposed sides. At least one side of the substrate (10) has an electrically conductive layer (12) formed in a pattern that defines a printed circuit. An insulating dielectric layer (14) covers at least a portion of the printed circuitry, leaving at least one portion (16) of the circuitry exposed. A radio frequency (RF) shielding layer (18) is formed by depositing an electrically conductive polymer on at least a portion of the insulating dielectric layer. The RF shielding layer (18) also lies over a portion of the exposed electrical circuitry (16), providing electrical connection to the electrically conductive layer (12). The RF shielding layer (18) is formed from a silverfilled polymer thick film ink and is applied by screen printing, stencilling, roller coating, spraying, or other equivalent methods.
    Type: Grant
    Filed: August 19, 1991
    Date of Patent: January 5, 1993
    Assignee: Motorola, Inc.
    Inventors: Jonathan D. Carr, David A. Tribbey, Allen D. Hertz
  • Patent number: 5175397
    Abstract: A hermetically sealed package for one or more integrated circuit chips that is made of three metal, thick-film layers, and one dielectric, thick-film layer to form a mounting surface for the chip. The first applied metal layer includes the power plane, and the fan-out leads including power and ground leads. The dielectric layer overlays the power plane and includes an annular rectangle overlaying a portion of all the leads of the first layer and an outer boundary strip overlaying extreme ends of the leads. The second screened metallic layer serves as the ground plane, and electrically engages the ground leads of the first metallic layer and the extreme outer ends of the signal leads.
    Type: Grant
    Filed: December 24, 1990
    Date of Patent: December 29, 1992
    Assignee: Westinghouse Electric Corp.
    Inventor: Frank A. Lindberg
  • Patent number: 5170008
    Abstract: A grommet provides a surrounding conductive elastomer connection to a stripped portion of an external cable shield. The cable is inserted through the central passage of the grommet and placed in a U-shaped opening in an enclosure frame. The open side of the U is closed with another metal member to complete a 360 degree termination around the shield. A one piece metal band within the grommet provides a direct low resistance path from the cable shield to the enclosure frame. The band has an interference fit in the outer groove of the grommet and utilizes the elasticity of the grommet to hold the band in place.
    Type: Grant
    Filed: August 29, 1991
    Date of Patent: December 8, 1992
    Assignee: International Business Machines Corp.
    Inventors: Robert T. Evans, Richard E. Trogisch, Robert E. Wagner
  • Patent number: 5120903
    Abstract: In an electromagnetic shielding member, an upper structure and a lower structure are connected integrally by attaching a connecting member covered with a conductive member onto the gripping member of the lower structure. A thin metal strip is inserted as the connecting member between the upper structure and the lower structure. Since the upper structure provides a sufficient resilience against a cover member of an enclosure to which the electromagnetic shielding member is fitted, the gap between the cover member and the enclosure is small, thereby enhancing an electromagnetic shielding effect. The lower structure has a double coated adhesive tape to connect to the enclosure. Instead of using the double coated adhesive tape, the lower structure can have a cavity for receiving an edge of the enclosure at its wall surface. When the enclosure edge engages the cavity of the lower structure, a spring member in the cavity of the lower structure deflects according to the thickness of the edge.
    Type: Grant
    Filed: April 12, 1991
    Date of Patent: June 9, 1992
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Khing H. Tam
  • Patent number: 5121289
    Abstract: An encapsulatable sensor assembly includes an external housing with internal support components for retaining an active sensor element and associated electrical circuitry in a predetermined relationship while providing a plurality of internal sequentially interconnected cavities for facilitating a flow of an encapsulating material from an encapsulating material injection port to a vented overflow to assure a complete fill of the internal cavities to restrain the internal components. The sensor assembly provides a structure for a void free encapsulation and internal leadwire stress relief concurrently with location control of the internal components while also providing a combination which is easily adaptable to automatic assembly and encapsulation techniques.
    Type: Grant
    Filed: January 31, 1990
    Date of Patent: June 9, 1992
    Assignee: Honeywell Inc.
    Inventor: Michael A. Gagliardi
  • Patent number: 5121300
    Abstract: A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip support. The one end of at least one of the plurality of leads includes a first lead portion extending in a direction toward the chip support and a second lead portion contiguous with the first lead portion. The second lead portion extends in a direction away from the chip support so that the one of the lead has a bent shape.
    Type: Grant
    Filed: January 25, 1990
    Date of Patent: June 9, 1992
    Assignee: Hitachi, Ltd.
    Inventor: Ichio Shimizu