Abstract: A method for coating a substrate 11 is disclosed. The method includes at least the following steps: depositing a first base layer 22 comprising a nitride of at least Al and Cr on the substrate 11 by physical vapor deposition at a gradually increasing substrate bias voltage from a first substrate bias voltage to a second substrate bias voltage; depositing a second base layer 23 comprising a nitride of at least Al and Cr on the first base layer 22 by physical vapor deposition at a constant substrate bias voltage that is greater or equal to the second substrate bias voltage; and depositing an outermost indicator layer 24 on the second base layer 23, wherein the outermost indicator layer 24 comprises a nitride of Si and Me, wherein Me is at least one of Ti, Zr, Hf, and Cr, wherein the outermost indicator layer 24 is deposited by physical vapor deposition at a substrate bias voltage that is less than the constant substrate bias voltage applied during deposition of the second base layer 23.

Abstract: A method for coating products is provided. The method includes the steps of applying a coating liquid to a product and removing excess coating liquid from the product. It is desirable to provide a method for efficiently and reliably coating delicate or easily deformable products, such as products molded from a pulp fiber slurry. The method includes fixing the product to a receiving portion of a product carrier that is configured in the same shape as the product, such that an exterior surface of the product abuts the interior concave surface of the receiving portion of the device. A coating liquid is applied to the product in the product carrier. The product carrier is affixed to a centrifuging device and the coating liquid is dispersed over the surface of the product using centripetal force.

Abstract: The present invention relates to a method for manufacturing a membrane-electrode assembly and a membrane-electrode assembly manufactured thereby, and more specifically, to a method for manufacturing a membrane-electrode assembly by using a nano-dispersed ionomer binder under supercritical conditions in a mixed solvent comprising alcohol and water, and a membrane-electrode assembly manufactured thereby and a fuel cell or water electrolysis device comprising same.

Abstract: Methods and systems for depositing vanadium nitride layers onto a surface of the substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process, depositing a vanadium nitride layer onto a surface of the substrate. The cyclical deposition process can include providing a vanadium halide precursor to the reaction chamber and separately providing a nitrogen reactant to the reaction chamber. The cyclical deposition process may desirably be a thermal cyclical deposition process.

Abstract: A method is provided and includes: determining a temperature distribution pattern across a substrate or a support plate of a substrate support; determining, based on the temperature distribution pattern, a number of masks to apply to a top surface of the support plate, where the number of masks is greater than or equal to two; and determining patterns of the masks based on the temperature distribution pattern; and applying the masks over the top surface. The method further includes: performing a first machining process to remove a portion of the support plate unprotected by the masks to form first mesas and first recessed areas between the first mesas; removing a first mask from the support plate; performing a second machining process to form second recessed areas and at least one of second mesas or a first seal band area; and removing a second mask from the support plate.

Abstract: The problem of the present invention is to provide a plating stack (a stack of plating films) for applying on surface of conductor circuits or the like, the plating stack can maintain high bond strength when solder is bonded on that and can be produced stably. In the method for producing a plating stack of the present invention, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of palladium is deposited on the plating layer A, and then a plating layer C mainly composed of nickel is deposited on the plating layer B by a redox reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum or silver.

Abstract: Compositions and processes for forming barrier coatings to prevent hydrogen embrittlement of an underlying material are disclosed. The coating can be made up of composite structures of metal and oxide that are alternately deposited onto a substrate for creating a multilayer coated substrate. Such multilayer coating can be incorporated into many contexts in which hydrogen permeation prevention is desired, such as pipelines and manufacture of advanced automotive steels. The process involves depositing a metal layer onto the substrate followed by a metal oxide layer thereon. The interface of the metal layer and the oxide layer can form space-charge zones that decrease hydrogen permeability therethrough.

Abstract: The present disclosure relates, in part, to an apparatus for controlling the concentration of a component within a gas mixture. In particular embodiments, the component is a vaporized liquid component, such as a vaporized stabilizer or a vaporized precursor. Also described are systems thereof and methods for such control.

Abstract: A method for depositing a silicon oxide film is provided. In the method, a silicon oxide film is deposited on a substrate by Atomic Layer Deposition with plasma while heating the substrate to a first temperature of 600° C. or higher. The silicon oxide film is annealed at a second temperature higher than the first temperature after completing the depositing the silicon oxide film.

Abstract: A coated part includes a metallic substrate, a thermal barrier comprising a ceramic material and covering the metallic substrate, wherein the coated part further includes a protective coating covering the thermal barrier, the protective coating including, in a first region, a first MAX phase, denoted PZ2, of formula (ZrxTi1-x)2AlC or a first MAX phase, denoted PC2, of formula (CrxTi1-x)2AlC with x non-zero and less than or equal to 1 in the MAX phases PZ2 and PC2, and the protective coating includes, in a second region covering the first region, a second MAX phase of formula Ti2AlC.

Abstract: A method of consolidation includes placing a fibrous preform in the shaping recess of a shaping tool, and supplying the shaping tool with a gas phase to obtain a deposit in the fibrous preform, the shaping tool for the vapor phase chemical infiltration including first and second portions, having respectively first and second shaping zones surrounded by a first and second edge zones, the first and the second shaping zone defining a shaping recess to receive the fibrous preform. A gas injection port is present at least partially in the first or second edge zone and a gas outlet port is present at least partially in the first or second edge zone, the gas injection port and the gas outlet port placing the shaping recess in fluid communication with the outside of the shaping tool. Outer faces of the first and second portion are impermeable to gas.

Abstract: By interposing a hard mask between a dielectric and photo-sensitive material it is possible to form fine via in the dielectric by dry etching without damaging the remaining surface of the dielectric.

Abstract: A method of improving surface roughness of ceramic matrix composites (CMCs) is provided. The method includes completing a formation of the CMCs and a chemical vapor infiltration (CVI) process to initially coat the CMCs, inspecting a CMC surface, identifying, from a result of the inspecting, a defect in the CMC surface that negatively impacts a surface roughness characteristic thereof, locally targeting and ablating the defect and re-inspecting the CMC surface to ensure that the defect is correct.

Abstract: Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.

Abstract: The present invention relates to an abutment of a dental implant system for connecting a dental implant and a suprastructure, said abutment comprising an abutment basic body extending from an apical end to a coronal end arranged opposite to the apical end. The abutment basic body comprises a dental implant connecting portion facing the apical end and adapted to fit with a corresponding abutment connecting portion of the dental implant and/or an intermediate part to be directly or indirectly connected with the dental implant. It further comprises a support portion facing the coronal end and designed such to allow the suprastructure to be mounted directly or indirectly. According to the invention, the abutment further comprises nanostructures formed on at least a portion of the outer surface of the abutment basic body, said nanostructures extending in at least two dimensions to 200 nm at most.

Abstract: A reactor for coating particles includes a vacuum chamber configured to hold particles to be coated, a vacuum port to exhaust gas from the vacuum chamber via the outlet of the vacuum chamber, a chemical delivery system configured to flow a process gas into the particles via a gas inlet on the vacuum chamber, one or more vibrational actuators located on a first mounting surface of the vacuum chamber, and a controller configured to cause the one or more vibrational actuators to generate a vibrational motion in the vacuum chamber sufficient to induce a vibrational motion in the particles held within the vacuum chamber.

Abstract: A method for manufacturing a semiconductor device is provided. In the method, a silicon-containing gas is supplied to a substrate having a recess in a surface thereof at a predetermined film deposition temperature, thereby depositing a first silicon film in the recess. Chlorine and hydrogen are supplied to the substrate while maintaining the predetermined film deposition temperature, thereby etching the first silicon film deposited in the recess to expand an opening width of the first silicon film. The silicon-containing gas is supplied to the substrate while maintaining the predetermined film deposition temperature, thereby further depositing a second silicon film on the first silicon film in the recess.

Abstract: A manufacturing method is provided. During this method, a preform component for a turbine engine is provided that includes a substrate. A meter section of a cooling aperture is formed in the substrate. An external coating is applied over the substrate. At least a portion of the substrate and the external coating is scanned with an imaging system to provide scan data indicative of an internal structure of the portion of the substrate and the external coating. A diffuser section of the cooling aperture is formed in the external coating and the substrate based on the scan data.

Abstract: A humidity sensitive material includes a lanthanum-doped barium titanate (BaTiO3) co-doped with an alkali hydroxide. A polymeric liquid binder is used as a vehicle to deliver the humidity sensitive material to a substrate or electrode via a 3D-printing process. The humidity sensitive material is highly sensitive to changes in humidity and exhibits rapid and large changes in capacitance and impedance for just a relatively small change in humidity. The humidity sensitive material exhibits significantly large changes in impedance and capacitance over the entire 10-90% RH range. As a result of the high sensitivity of the humidity sensitive material, the log-linear response is significantly easier to calibrate in humidity sensing devices that use the humidity sensitive material.

Abstract: A substrate processing method includes forming a pre-coat film on an in-chamber part disposed in a chamber, and subsequently processing one or more substrates. The forming a pre-coat film includes forming a first film on the in-chamber part without using plasma or by using a first plasma generated under a condition that sputtering is suppressed on the in-chamber part, and forming a second film on a surface of the first film by using a second plasma.