Abstract: A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively. The heat exchange structure includes an exterior heat exchange surface and interior heat exchange surfaces, in which the exterior heat exchange surface is configured to receive thermal energy from heat generators that are mounted on the exterior heat exchange surface, and the exterior heat exchange surface dissipates a portion of the thermal energy received from the heat generators and transfers another portion of the thermal energy to the interior heat exchange surfaces. The interior heat exchange surfaces are in the elongated air ducts and configured to exchange thermal energy with air flowing in the air ducts, enhancing air flow in the air ducts by buoyancy of heated air.

Abstract: An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.

Abstract: A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.

Abstract: A dual protection device includes a cover, a first protection unit, a second protection unit and a base. The first protection unit includes an elastic contact piece and a first conductive member. The elastic contact piece has a first end fixed to the cover and a second end including a first contact point. The first conductive member has a second contact point to contact with the first contact point. The elastic contact piece bends to separate the first contact point from the second contact point when overloaded. The second protection unit has a second conductive member, which is respectively connected with the first conductive member and a second terminal by fuse members. A biasing member is compressed between the second conductive member and the base so as to separate the second terminal from the second conductive member when the fuse members melt.

Abstract: The present invention relates to a server device which comprises a case having two symmetric slots disposed on the top and a first handle disposed in each of the slots to make it easier to lift up the server device, a horizontal partition disposed in the case and dividing the inner space of the case into upper and lower parts, wherein the upper part is a first holding space capable of holding at least an electronic device, a first heat dissipation unit is disposed at the front of the electronic, the lower part of the case is a second holding space capable of holding at least a server, and a second heat dissipation unit may be disposed at one side of the second holding space, such that a plurality of servers, electronic devices and heat dissipation units may be integrated into the server device for easily and conveniently being moved.

Abstract: A hinge for moving two parts of an electronic apparatus relative to each other is disclosed. The hinge includes two coolant flow paths helically arranged between inlet and outlet connections as portions of the hinge are rotated relative to each other. Guide plates within the hinge independently rotate to suitably position the conduits of the coolant flow paths in a position of minimum twisting and stretching. The hinge can be incorporated into any electronic apparatus, for example a portable computer.

Abstract: A microswitch comprises a deformable membrane including two substantially parallel flexure arms, attached to a substrate via at least one end thereof and comprising thermal actuating means. An elongated contact arm, substantially parallel with the flexure arms, is arranged therebetween and attached thereto at the high deformation areas thereof. The contact arm moves in a direction substantially parallel to the substrate upon actuation of the microswitch, and comprises electrostatic holding electrodes and a conducting pad.

Abstract: A receptacle assembly includes a housing that is configured to hold an electrical module. An energy transfer element, which is held by the housing, is positioned to directly engage the electrical module. The transfer element absorbs thermal energy produced by the electrical module. The receptacle assembly also includes a heat sink that is remotely located from the transfer element. A thermally conductive member extends between the heat sink and the transfer element to convey thermal energy therebetween.

Abstract: In a temperature switch, a cut-out portion of the substrate is formed of a first cut-out portion and a second cut-out portion which are made from the side part toward the center. At a fixation part of a movable plate in the temperature switch, a pawl part and an elastic locking part having an L-shaped cross section are formed adjacent to the pawl part on the upstream side in the sliding direction. When the pawl part is fitted in the second cut-out portion, a tip of the elastic locking part abuts an end portion-top surface of the substrate and the elastic locking part reversibly warps upwardly.

Abstract: An information processing device includes: an object to be cooled (51, 52) as a heat-generating body; a cooling unit (32) that is provided on a first side of the object (51) to be in contact therewith; and a plate spring (36) disposed on a second side of the object (51) opposite to first side and attached to the cooling unit (32), the plate spring biasing the cooling unit (32) in a direction for the cooling unit (32) to be pressed to the object (51). Since the object (51) and the cooling unit (32) can be brought in closer contact with each other, the heat on the object (51) can be efficiently transferred to the cooling unit, thereby radiating the heat. Accordingly, the heat generated on the object (51) can be efficiently cooled. The object (51) is sandwiched by the plate spring (36) and the cooling unit (32), unidirectional load is not applied on the object (51), so that deformation of the object (51) can be restrained.

Abstract: A temperature control switch comprises a switch casing, which contains a springy slice, where the springy slice is provided with a thermostatic bimetal strip on its bouncing end. The thermostatic bimetal strip is provided with an electric heating device, where the first end and second end of the device are respectively connected in series between a first control terminal and the thermostatic bimetal strip. The elevated end of the thermostatic bimetal strip links one end of an uplifted metal slice to form an incompletely fixed link point, while the other end of the uplifted metal slice features a swaying contact, which corresponds to the contact point that a second control terminal joins. When subjected to heat, the one end of the thermostatic bimetal strip deforms, enabling the swaying contact to separate from the contact point, thus preventing the contact point from being damaged by the heat.

Abstract: A clip (50) for securing a heat dissipating device to a heat source comprises a spring arm (510) and an ear (530). The spring arm comprises two wires (512) substantially parallel to each other, a hook (514) formed at one end of the spring arm to connect ends of the wires and two barbs (516) each formed at another end of each of the wires. A central portion of each of the wires projects downwardly. The ear comprises a main body (530a), two notches (532) in an upside of the main body and a clamping unit (537) at a downside of the main body. Each of the notches comprises from above to below an insertion slot (5321), an elongated sliding slot (5323) and a retaining slot (5325). The spring arm engages with the ear with the barbs extending into the insertion slots, and the wires are slideable downwardly along the sliding slots to be fixed in the retaining slots.

Abstract: A computer includes a chassis, a motherboard, an air guiding member, and a fan. The chassis includes a rear wall at a rear side thereof and a sidewall at a lateral side thereof. The rear wall defines a plurality of inlet holes therein, and the sidewall defines a plurality of outlet holes therein. The motherboard is received in the chassis opposite to the sidewall, a heat sink is installed on the motherboard for dissipating heat generated by a processor mounted on the motherboard. The air guiding member is received in the chassis at a front side, for guiding air drawn into the chassis through the inlet holes toward the outlet holes. The fan is used for drawing air from outside of the chassis through the inlet holes, and blowing the air out of the chassis through the outlet holes.

Abstract: A liquid cooling device includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is received in the sealed chamber and magnetically interacts with the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. The top cover covers the motor driving unit and thermally contacts with electronic components on the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.

Abstract: A case for a liquid submersion cooled computer includes a plurality of walls defining a liquid-tight interior space. At least a portion of one of the walls is made of a material that permits viewing of objects, for example, a motherboard, within the interior space. A removable lid closes the top of the interior space. The lid forms a liquid-tight seal with the plurality of walls, and the lid includes a sealed electrical connector fixed thereto that is configured to attach to the motherboard disposed in the interior space and to provide electrical connection between the motherboard and an exterior of the case. The case can include a drain valve for draining liquid from the case. Further, the lid can have an opening for introducing liquid into the interior space, and a handle to facilitate lifting of the lid along with the motherboard connected to the lid.

Abstract: Apparatus and methods for thermal conditioning equipment. In a preferred embodiment, an equipment enclosure comprises a body, a wall, a fluid port, and a fixture. The body defines an outer plenum and an inner chamber in the latter of which the fixture retains the equipment. The wall, which is between the outer plenum and the inner chamber, isolates the thermally conditioned first fluid from a second fluid in the inner chamber. Since the wall is thermally conductive it allows heat to be transferred between the outer plenum and the inner chamber. The fluid port is in communication with the outer plenum to allow the thermally conditioned first fluid to flow into the outer plenum. Baffle plates are also provided to distribute flow of the second fluid to the equipment.

Abstract: A fuse including a fuse housing having first and second electrical terminals, a movable partition made from an electrically conductive material movably disposed within the fuse housing, a fusible structure connected between the first electrical terminal and the movable partition, a conductor connected between the movable partition and the second electrical terminal, a biasing element acting on the movable partition to maintain the fusible structure in tension and for moving the movable partition upon melting of the fusible structure and an indicator connected between the movable partition and the second electrical terminal.

Abstract: An improved MEMS thermal actuator has a cantilevered beam and a conductive circuit having two driving arms, an inner arm adjacent to the cantilevered beam, and an outer arm adjacent to the inner arm. Current flows through the inner and outer arms to heat the conductive circuit, causing it to expand relative to the cantilevered beam. A tether ties the conductive circuit to the cantilevered beam, so that upon expansion, the conductive circuit causes the cantilevered beam to deflect about its anchor point. However, only the inner arm of the driving beam is coupled to the cantilevered beam. Since the outer arm of the conductive circuit is not coupled to the cantilevered beam, the overall stiffness of the actuator may be decreased. In addition, serpentines may be placed in the outer arm of the conductive circuit, in order to further decrease the stiffness of this beam. The actuator may therefore be made more efficient, in that the deflection of the cantilevered beam may be increased for a given input current.

Abstract: Integrated access cover arrangements for use in a portable computing devices, where the portable computing devices include a processor and are configured to house a user accessible component are presented including: a base configured to be coupled to the portable computing device; an integrated access cover housing a keyboard, the integrated access cover being slidingly connected with the base and configured to be disposed in at least a closed position and an open position with respect to the base, the user accessible component being hidden from a user when the integrated access cover is disposed in the closed position, the user accessible component being accessible by the user when the integrated access cover is disposed in the open position. In some embodiments, arrangements further include: a drive mechanism for translating the integrated access cover. Advantages include the ability to utilize lower profile configurations while maintaining functionality.

Abstract: In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response to a cooling requirement of the heat sink. In an embodiment, a method of cooling an information handling system includes providing cooling by coupling a heat sink to a heat generating component. The method further provides selectably coupling a blank member to the heat sink providing cooling by a first fluid coolant. The method further provides selectably coupling a cold plate to the heat sink providing cooling by a first fluid coolant and a second fluid coolant.