Patents Examined by Bradley H Thomas
  • Patent number: 7633744
    Abstract: Systems and methods relating to notebook computers providing enhanced display features are described. In one instance, an exemplary notebook computer includes a housing. The housing includes a base that has a keyboard positioned on the base. The housing also includes a lid attached to the base via a hinge means and configured to swing from a transport-position against the keyboard to a user-position away from the keyboard. The notebook computer also includes a first display device positioned on the lid and generally opposing the keyboard. The notebook computer further includes a second optionally-deployable display device attached to the notebook computer and configured to deploy from a first storage-position to a second user-position in which the second optionally-deployable display device is configured to collectively create a user workspace with the first display device for a user positioned in front of the keyboard and generally opposite the hinge means.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: December 15, 2009
    Assignee: Microsoft Corporation
    Inventor: Benjamin J. Kuhn
  • Patent number: 7626485
    Abstract: A bimetallic thermostat with exchange contact is described comprising an external support covering (1) and an internal device (2) made up of a pierced base (3) provided with a packing (4) and with electric contacts (5, 15, 25, 35) with the outside, of a relay (8) electrically connected with said base (3) and of a sensitive thermostatic element (9) electrically connected with said relay (8). Said thermostat comprises in addition a printed circuit (7) interposed between the sensing element (9) and the relay (8).
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: December 1, 2009
    Assignee: Elettrotec S.R.L.
    Inventor: Adriana Sartor
  • Patent number: 7626818
    Abstract: An inverter apparatus includes heating components housed in an inverter main body and cooling fans for cooling the heating components. The inverter apparatus includes a fan unit case in which the cooling fans are housed as one integral unit, a housing space formed on an outer side of a ceiling surface of the inverter main body, and a fan cover that fixes the fan unit case. The fan unit case is slid to be housed in the housing space. The inverter apparatus makes it easier to replace cooling fans, reduce the number of components, enhance cooling efficiency, and secure high reliability.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: December 1, 2009
    Assignee: Fuji Electric Systems Co., Ltd.
    Inventors: Toshihiro Yoshida, Yoshihisa Hatozaki
  • Patent number: 7626483
    Abstract: A self-recovering current limiting fuse protecting a secondary battery having a high rated voltage thanks to its improved breakdown voltage, expanding the application range, shortening the charging time, and realizing maintenance-free. The self-recovering current limiting fuse is made by fluid-dispersing solid conductive particles into a liquid matrix between electrodes. A current limiting operation through evaporation/spreading of the solid conductive particles and a conducting state brought about through collection of the solid conductive particles between the electrodes by dielectrophoretic force of the solid conductive particles are realized repeatedly, and a current limiting operation through evaporation/spreading of the solid conductive particles by overcurrent is realized.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: December 1, 2009
    Assignee: Kyushu Institute of Technology
    Inventors: Shinya Ohtsuka, Masayuki Hikita
  • Patent number: 7619891
    Abstract: A plasma display apparatus including a plasma display panel displaying images, a chassis base arranged behind the plasma display panel, and a heat conductive member and a porous adiabatic member arranged between the plasma display panel and the chassis base.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: November 17, 2009
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Seok-Gyun Woo, Ki-Jung Kim
  • Patent number: 7616440
    Abstract: The described embodiments relate to fans units. One exemplary fan unit includes a housing supporting a motor. The fan unit also includes an impeller coupled to the motor and configured to be rotated by the motor. The impeller comprises at least a first structure configured to move air past the housing and at least one second different structure configured to force air into the housing.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: November 10, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: John P. Franz
  • Patent number: 7609525
    Abstract: A computer system includes a motherboard (10 or 50) with at least one CPU heat sink mounted thereon and a chassis (20) for mounting the motherboard therein. The chassis includes a plurality of bumps (23), and a plurality of knockdown standoffs (25). Some of the bumps are under the at least one CPU heat sink, the standoffs are mounted on the bumps under the CPU heat sink for resisting against the motherboard and supporting the CPU heat sink. Some of the bumps are spares adapted for mounting another type of motherboard to the chassis.
    Type: Grant
    Filed: December 9, 2006
    Date of Patent: October 27, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chen-Lu Fan, Li-Ping Chen
  • Patent number: 7599173
    Abstract: Certain exemplary embodiments comprise a system comprising an enclosure structure configured to restrict access to an electrical meter. The system can comprise a meter cover configured to cover and/or restrict access to the meter. One of the meter cover and the enclosure structure can comprise an opposing pair of prongs. Each of the prongs can be configured to be received by a corresponding dogleg slot from a pair of dogleg slots. Each of the prongs, when engaged with the corresponding dogleg slot, can be configured to restrain motion of the meter cover.
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: October 6, 2009
    Assignee: Siemens Energy & Automation, Inc.
    Inventors: Fan Zhang, James Tirrell
  • Patent number: 7593229
    Abstract: A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively. The heat exchange structure includes an exterior heat exchange surface and interior heat exchange surfaces, in which the exterior heat exchange surface is configured to receive thermal energy from heat generators that are mounted on the exterior heat exchange surface, and the exterior heat exchange surface dissipates a portion of the thermal energy received from the heat generators and transfers another portion of the thermal energy to the interior heat exchange surfaces. The interior heat exchange surfaces are in the elongated air ducts and configured to exchange thermal energy with air flowing in the air ducts, enhancing air flow in the air ducts by buoyancy of heated air.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: September 22, 2009
    Assignee: Hong Kong Applied Science & Technology Research Institute Co. Ltd
    Inventor: Geoffrey Wen-Tai Shuy
  • Patent number: 7580264
    Abstract: A power supply of an image forming device with a heatsink fixed on a circuit board using an iron rivet is described. The rivet is fastened using a riveter. A crimped portion at a tip of the rivet, a bottom face of the heatsink, an end portion of a flange of the rivet and a land portion of the circuit board are firmly connected to each other to stabilize their electrical connection. The rivet is electrically connected to the land portion by the binding strength of the rivet and the dipped solder. Thus, the heatsink is securely connected to a grounding line of the circuit board in a simple process.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: August 25, 2009
    Assignee: Funai Electric Co., Ltd.
    Inventor: Yoshihide Tanimoto
  • Patent number: 7570481
    Abstract: A base assembly is provided for a power pedestal including an elongated housing and a plurality of electrical conductors enclosable by the elongated housing. The elongated housing has a first end and a second end disposed opposite and distal from the first end. The base assembly includes a power pedestal base member having a first end and a second end disposed opposite and distal from the first end. The second end of the base member is structured to be coupled to a platform. A connecting mechanism, such as a hinge assembly, is disposed at or about the first end of the base member and removably couples the first end of the elongated housing to the base member without a number of separate fasteners, thereby facilitating removal of the elongated housing from the base member. An electrical bus mount may be removably coupled to a mounting surface of the base member.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: August 4, 2009
    Assignee: Eaton Corporation
    Inventors: Paul D. Seff, Alston G. Brooks, Gregory S. Nailler
  • Patent number: 7561433
    Abstract: In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged, each semiconductor chip has a heat sink spring-loaded against the semiconductor chip. Posts coupled to one board engage posts located on the other board. The engagement of the posts orients and secures the relative positions of the two boards. A clip is provided that secures the relative position of the two boards when the two sets of posts are engaged. To uncouple the two boards, a pressure on the side of the clip permits the two boards to separate.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: July 14, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Nathan W. Wright, Ronnie R. Schkade, Noel T. Gregorio, Richard J. Karr, Charles R. Engle
  • Patent number: 7558064
    Abstract: The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the water converted into mist onto the upper surface of a device attached to a socket of a burn-in board. The heat generated by the device is removed via the mist and air that falls on the upper surface. When a burn-in test is conducted the cooling apparatus adjusts the water and air supply so that the device is cooled to the target temperature.
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: July 7, 2009
    Assignee: Espec Corp.
    Inventors: Kazuhiro Nakamura, Tetsuya Shimada, Katsuhiko Watabe
  • Patent number: 7558068
    Abstract: An apparatus and system are disclosed for securing a heat sink against a central processing unit. The present invention teaches a heat sink securement device having a vertical retention arm that substantially encompasses a heat sink in a vertical direction, a horizontal retention arm that substantially encompasses a heat sink in a horizontal direction, and a tension arm coupled to the vertical and horizontal retention arms and pivotally coupled to the frame, the tension arm simultaneously adjusts a tension on the vertical retention arm and the horizontal retention arm in response to moving the tension arm. In certain embodiments, the retention arms are coupled to the tension arm via coupling member that is offset from pivot point of the tension arm. In other embodiments, the coupling member may include a different coupling member for the vertical and horizontal retention arms, both coupling members offset from the pivot point.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: July 7, 2009
    Assignee: International Business Machines Corporation
    Inventors: Richard M. Barina, Dean F. Herring, Paul A. Wormsbecher
  • Patent number: 7551436
    Abstract: In an electronic apparatus in which plural substrates are arranged in a perpendicular direction between plural cooling fans in a lower part of a case and plural temperature sensors in an upper part of the case, any temperature variation by 2° C. in three seconds detected by any one of the temperature sensors is determined to be abnormal, and thermal energy is caused to be discharged from surfaces of substrates on two sides of a flame by raising air flow rates of fans. Expansion of the flame to other substrates is thereby prevented.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: June 23, 2009
    Assignee: Hitachi Communication Technologies, Ltd.
    Inventors: Koji Hata, Takashi Funada, Seiji Asai, Susumu Miyagawa, Hiroshi Kuwaki, Takeshi Kiyose
  • Patent number: 7542300
    Abstract: The present invention is a computing appliance chassis assembly which may support an integration of a plurality of removable modules, including fan modules, power supplies, and a controller module. The computing appliance chassis assembly may also include detachable handles which may allow transport of the computing appliance chassis assembly. A controller chassis may be installed within the computing appliance chassis assembly. A controller chassis assembly may house a controller module and may include rotatable side panels which allow easier access to the components of the controller module. A fan chassis assembly may also be installed within the computing appliance chassis and may house a fan module.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: June 2, 2009
    Assignee: Network Appliance, Inc.
    Inventors: Kwok Lui, Dan Ho, David Willheim, Salvatore Bondi
  • Patent number: 7532101
    Abstract: A temperature protection device is provided, which comprises with a polymeric positive temperature coefficient (PTC) device 1 having a conductive polymer 5 placed between two electrodes 6 and 7, and a metal member 2 bonded to one of the electrodes 7 of the polymeric PTC device, and which, when the ambient temperature exceeds a prescribed temperature, terminates the current-flowing state between the other electrode 6 of the polymeric PTC device 1 and the metal member 2. The conductive polymer 5 expands thermally when the ambient temperature exceeds the prescribed temperature, and a material is selected for the metal member 2 that will melt as a result of the heat generated by the conductive polymer during the thermal expansion.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: May 12, 2009
    Assignee: Tyco Electronics Raychem K.K.
    Inventor: Katsuaki Suzuki
  • Patent number: 7532464
    Abstract: An access system for a portable device provides a portable computer having a bottom surface. The portable computer is accessed through an active user interface on the bottom surface of the portable computer.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: May 12, 2009
    Assignee: Apple Inc.
    Inventors: Chris Ligtenberg, Greg Springer, Bartley K. Andre, Brett William Degner, Jonathan P. Ive
  • Patent number: 7532481
    Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5, as an amount of boron measured by fluorescence X-ray analysis, where the amount of boron is defined as a value obtained by an expression: (a peak height of B-K?/a peak height of X-K?) x 100000 and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: May 12, 2009
    Assignee: Mitsubishi Materials Corporation
    Inventors: Toshiyuki Nagase, Yoshiyuki Nagatomo, Kazuaki Kubo, Takeshi Negishi
  • Patent number: 7518483
    Abstract: An apparatus for the cutting of an electrical conductor has an electrical conductor arranged in a housing, a pyrotechnic drive and a cutting device. After the triggering of the drive, the cutting device enters into engagement with the conductor to cut it.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: April 14, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Uwe Brede, Uwe Albrecht