Patents Examined by Bradley Thomas
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Patent number: 8902037Abstract: A thermally responsive switch includes a hermetically sealed container including a metal housing and a header plate, at least one conductive terminal pin hermetically fixed in a through hole, a fixed contact fixed-to the terminal pin in the container, a thermally responsive plate having one end connected via a support to an inner surface of the container and reversing a curvature direction at a predetermined temperature, and at least one movable contact electrically conductively secured to the other end of the thermally responsive plate. Each contact includes a silver-tin oxide-indium oxide system contact. The container is filled with a gas containing helium ranging from 50% to 95% so that an internal pressure of the container ranges from 0.3 to 0.6 atmosphere at room temperature.Type: GrantFiled: August 8, 2007Date of Patent: December 2, 2014Assignee: Ubukata Industries Co., Ltd.Inventors: Yoshihisa Ueda, Takeo Koike, Mitsuhiro Urano, Shigemi Sato
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Patent number: 8902038Abstract: A thermally responsive switch includes a container including a metal housing and a header plate, at least one conductive terminal pin inserted through a hole of the header plate, a fixed contact fixed to the terminal pin, a thermally responsive plate having one of two ends conductively connected via a support to an inner surface of the container and reversing a direction of curvature at a predetermined temperature, and at least one movable contact electrically conductively secured directly to the other end of the thermally responsive plate. Each contact is comprised of a silver-cadmium oxide system contact. The container is filled with a gas containing helium ranging from 50% to 95% so that an internal pressure of the container ranges from 0.38 atmosphere to 0.68 atmosphere at room temperature such that arc generated during opening of the contacts moves on surfaces of the contacts without spreading from the contacts.Type: GrantFiled: August 8, 2007Date of Patent: December 2, 2014Assignee: Ubukata Industries Co., Ltd.Inventors: Yoshihisa Ueda, Takeo Koike, Mitsuhiro Urano, Shigemi Sato
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Patent number: 8897016Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.Type: GrantFiled: October 2, 2012Date of Patent: November 25, 2014Inventors: Brett W. Degner, Peteris K. Augenbergs, Frank Liang, Amaury J. Heresztyn, Dinesh Mathew, Thomas W. Wilson
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Patent number: 8885343Abstract: A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.Type: GrantFiled: June 17, 2009Date of Patent: November 11, 2014Assignee: Robert Bosch GmbHInventors: Andre Lischeck, Thomas Wiesa
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Patent number: 8866027Abstract: The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.Type: GrantFiled: January 16, 2008Date of Patent: October 21, 2014Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.Inventors: Yoshio Oka, Jinjoo Park, Kazuyuki Maeda, Narito Yagi, Tetsuya Shimomura, Junichiro Nishikawa
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Patent number: 8848372Abstract: A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material includes carbon nanotube material that enhances the thermal conductivity thereof The interface material flows between an integrated circuit device and a thermally conductive device. The carbon nanotube material conducts heat from the integrated circuit device to the thermally conductive device.Type: GrantFiled: November 4, 2005Date of Patent: September 30, 2014Assignee: NXP B.V.Inventors: Chris Wyland, Hendrikus Johannes Jacobus Thoonen
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Patent number: 8842426Abstract: An adjustable buffer and a multi-media storage device module are provided. The module includes a multi-media storage device, multiple adjustable buffers and multiple fasteners. Each buffer including a supporting unit, a body having a second assembling portion pivoted to the first assembling portion and multiple extension units, a cover having an opening and multiple second locking structures and a fixing cap is installed at two opposite sidewalls of the device. The supporting unit has a main portion, a first assembling portion and multiple first locking structures disposed at the body surrounding the first assembling portion. The second locking structures pass through the body to lock the first locking structures and the first assembling portion in the opening contacts the extension units. The cap is assembled to the first assembling portion and presses the second assembling portion. The fasteners pass through the first assembling portion and are screwed into the device.Type: GrantFiled: January 5, 2012Date of Patent: September 23, 2014Assignees: Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc.Inventor: Chien-Tsai Chou
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Patent number: 8830026Abstract: A thermal trip unit for a circuit breaker having a primary conductive path for conducting a load current is provided. The thermal trip unit comprises a shape memory alloy (SMA) member adapted to change from a first shape to a second shape at a predetermined thermal condition, a holding member coupled electrically in series with the circuit breaker primary conductive path, said holding member arranged to operatively support said SMA member, wherein said SMA member is configured and disposed within the circuit breaker to trigger a trip response of the circuit breaker at said predetermined thermal condition.Type: GrantFiled: December 30, 2010Date of Patent: September 9, 2014Assignee: General Electric CompanyInventors: Brian Frederick Mooney, Thomas Frederick Papallo, Brent Charles Kumfer
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Patent number: 8817454Abstract: A system and method are provided for coordinating the installation and removal a motor control center subunit with the power connection and interruption thereof. A system of interlocks and indicators causes an operator to install a motor control center subunit into a motor control center, and connect supply and control power thereto, in a particular order. Embodiments of the invention may prevent actuation of line contacts of the bucket, and shield the line contacts, until the bucket is fully installed in the motor control center. Other embodiments also prevent circuit breaker closure until the line contacts are engaged with a bus of the motor control center.Type: GrantFiled: March 30, 2007Date of Patent: August 26, 2014Assignee: Eaton CorporationInventors: Robert A. Morris, Scott E. McPherren, Daniel J. Leeman
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Patent number: 8803652Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position, enabling a speedy and precise blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to a power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. In addition, the protection element is provided with a protrusive stripe portion 20 which is formed on an interior face of the insulation cover 14 in opposite to the soluble conductor 13 and in which a stepped portion 20a for retaining the flux 19 is formed at a predetermined position while in contact with the flux 19.Type: GrantFiled: January 14, 2010Date of Patent: August 12, 2014Assignee: Dexerials CorporationInventors: Yuji Kimura, Takahiro Asada, Kazuaki Suzuki
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Patent number: 8797741Abstract: A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.Type: GrantFiled: October 21, 2010Date of Patent: August 5, 2014Assignee: Raytheon CompanyInventor: David H. Altman
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Patent number: 8787035Abstract: An electrical interconnect device includes a frame having frame walls that define a socket that extends along a socket axis between an open top and an open bottom of the frame. The socket is configured to receive an electronic package through the open top. The electrical interconnect device also includes a contact assembly having an insulative carrier that holds an array of conductive elastomeric columns with each of the elastomeric columns having opposite first and second ends. The elastomeric columns are internally conductive between the first and second ends. The elastomeric columns are configured to electrically interconnect the electronic package to a second electronic component. The insulative carrier is configured to float within the frame in a direction generally parallel to the socket axis.Type: GrantFiled: April 5, 2011Date of Patent: July 22, 2014Assignee: Tyco Electronics CorporationInventors: Jeffery W. Mason, Wayne S. Alden, III, William B. Murphy
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Patent number: 8787004Abstract: A Medium Voltage Circuit Breaker (CB) comprising an electronic protection and control unit having: a base, fixed to the CB, comprising a main body having fixing means for fixing to the CB, a first side of said main body comprising a confined space including connections to the CB and internal accessories thereof, a second side of said main body comprising a plurality of first power and/or signal connection means; a removable unit comprising a casing, a first part of said casing hosting one or more Intelligent Electronic Devices, a second part of said casing being removably coupled to said base and comprising a plurality of second power and/or signal connection means connected to said first power and/or signal connection means.Type: GrantFiled: March 13, 2009Date of Patent: July 22, 2014Assignee: ABB Technology AGInventors: Luciano Di Maio, Massimo Bresciani
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Patent number: 8779886Abstract: A device, such as a switch structure, is provided. The switch structure can include a contact and a conductive element each respectively disposed on a substrate. The conductive element can be composed substantially of metallic material, and can be configured to be deformable between a first position, in which the conductive element is separated from the contact by a separation distance, and a second position, in which the conductive element contacts the contact and stores mechanical energy. The conductive element can be further configured such that, subsequent to being deformed into the second position at a temperature between about room temperature and about half of a melting temperature of the metallic material for a cumulative time of at least 107 seconds, the separation distance in the absence of external forces varies by less than 20 percent over the cumulative time. Associated methods are also provided.Type: GrantFiled: November 30, 2009Date of Patent: July 15, 2014Assignee: General Electric CompanyInventors: Marco Francesco Aimi, Shubhra Bansal, Christopher Fred Keimel, Kuna Venkat Satya Rama Kishore, Sairam Sundaram, Parag Thakre
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Patent number: 8766760Abstract: A switchgear unit switches high DC voltages, particularly for interrupting of direct current between a direct current source and an electrical device. The switchgear unit contains two connections which project from a housing and which are electrically conductively coupled by a conductor path, a contact system which is arranged between the first and second connections and an isolating apparatus that can be tripped by a thermal fuse. The thermal fuse contains a melting location which is arranged in the conductor path and which is connected first to the contact system and second via a moving conductor section to the first connection. The isolating apparatus is tripped and the connection between the conductor section and the contact system is broken at the melting location when an arc produced when the contact system is opened has caused the melting temperature of the melting location to be reached or exceeded.Type: GrantFiled: June 29, 2012Date of Patent: July 1, 2014Assignee: Ellenberger & Poensgen GmbHInventors: Waldemar Weber, Klaus Werner, Hubert Harrer, Wolfgang Schmidt
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Patent number: 8749952Abstract: The invention relates to a supercapacitor with a double electrochemical layer that comprises at least two complexes (2, 3) and at least one spacer (4) between the two complexes (2, 3), the complexes (2, 3) and the spacer (4) being spirally wound together in order to form a coiled member (10), characterized in that it further comprises at least another complex (1) and at least another spacer (4), the other complex (1) and the other spacer (4) being spirally wound together around the coiled member (10) in order to form at least one subsequent coiled member (20), the consecutive coiled members (10, 20) being separated by an electronic insulation space.Type: GrantFiled: February 12, 2009Date of Patent: June 10, 2014Assignee: BatscapInventors: Philippe Azais, Olivier Caumont, Jean-Michel Depond
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Patent number: 8743548Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.Type: GrantFiled: September 23, 2011Date of Patent: June 3, 2014Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Atushi Kawabata
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Patent number: 8729389Abstract: An apparatus is disclosed including a rack; a component mounted to the rack and a cable connected at one end to the component. A cable management assembly for managing the cable has a first end fixed relative to the component and a second end fixed relative to the rack. The cable management assembly includes a first support member having a cable attachment portion that supports the cable along a first length; and, a second support member having a cable attachment portion that supports the cable along a second length. The support members are arranged to pivot with respect to each other about a pivot axis as the component moves between received and withdrawn positions in the rack. The first and second lengths of cable are offset from each other in the direction of the pivot axis.Type: GrantFiled: September 23, 2009Date of Patent: May 20, 2014Assignee: Xyratex Technology LimitedInventors: Aaron Hallett, Graham Dovell, Nicholas Coram
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Patent number: 8717776Abstract: An assembly for connection of an electronic equipment item to wiring of an aircraft, in which the item of electronic equipment is disposed in a support means and includes connection means configured to be connected to the wiring, a connection interface disposed between the wiring and the connection means to provide connection of the item of electronic equipment to the wiring, the connection assembly configured to change over from a connected state in which the connection means are connected to the connection interface to a disconnected state in which the connection means are free. The connection interface is fastened to the structure of the aircraft; whether the connection assembly is in the connected or disconnected state. The support means is movable and includes an at least partially open face turned toward the connection interface and onto which the connection means emerge.Type: GrantFiled: February 4, 2011Date of Patent: May 6, 2014Assignee: AIRBUS Operations S.A.S.Inventors: Emile Colongo, Pierre Salles
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Patent number: 8686825Abstract: Embodiments of the invention are related to oxidative opening switches and related methods, amongst other things. In an embodiment, the invention includes a switch assembly including a first terminal, a second terminal, and an oxidative switch element in electrical communication with the first terminal and the second terminal, the switch element comprising a conductive material and an oxidizer, the switch element configured to interrupt electrical communication between the first terminal and the second terminal as a result of an oxidation reaction between the conductive material and the oxidizer. In an embodiment, the invention includes a fast opening switch for pulse power applications. Other aspects and embodiments are provided herein.Type: GrantFiled: July 8, 2011Date of Patent: April 1, 2014Assignee: JPA, Inc.Inventors: Richard F. Johnson, Randy Berg, Stanley E. Wood