Patents Examined by Bradley Thomas
  • Patent number: 8310333
    Abstract: Modular fuse holder assemblies for configurable panelboards are specifically adapted to meet the needs of photovoltaic fuses and solar powered systems. Fuse rejection features, safety features, and remote monitoring features are further provided.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: November 13, 2012
    Assignee: Cooper Technologies Company
    Inventors: Joseph James Ventura, Matthew Rain Darr, Xuecheng Zhang
  • Patent number: 8310832
    Abstract: A cooling system for rack mount electrical or electronic equipment comprises a hollow, box-shaped exhaust shelf having a vent on at least one end face thereof. The exhaust shelf may be configured for rack mounting. A side duct, open on its inner side, is mounted between the exhaust shelf and a top rail adapted to be mounted between a front post and an opposing rear post in a four-post rack mount enclosure. A plenum in the side duct is in fluid communication with the interior chamber of the exhaust shelf. A chassis having a side-facing exhaust for cooling air may be mounted on or over the exhaust shelf such that warm air exiting the chassis is collected in the plenum of the side duct and channeled into the exhaust shelf and out through the vent. In this way, the desired front-to-back cooling air flow within a rack mount enclosure may be maintained even if one or more individual chassis mounted in the enclosure have side cooling air exhausts.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: November 13, 2012
    Assignee: Brocade Communications Systems, Inc.
    Inventors: Anthony Siebe Vanderveen, Daniel Kiernan Kilkenny
  • Patent number: 8305736
    Abstract: A system and method for connecting supply power to motor control components includes use of a motor control center subunit with moveable supply power contacts. After a motor control center subunit is secured into a motor control center compartment, the supply power contacts may be advanced to engage supply power buses. For disconnection, the supply power contacts may be refracted and isolated from the buses before physical removal of the subunit.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: November 6, 2012
    Assignee: Eaton Corporation
    Inventors: Edgar Yee, Robert A. Morris, Scott E. McPherren, Neal Edward Rowe
  • Patent number: 8305761
    Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: November 6, 2012
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Peteris K. Augenbergs, Frank Liang, Amaury J. Heresztyn, Dinesh Mathew, Thomas W. Wilson, Jr.
  • Patent number: 8289713
    Abstract: A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational position sensor. A metal electromagnetic wave shielding member is fixed to a casing body of a casing. The electromagnetic wave shielding member includes a first portion that is connected to an opposed wall portion of the casing body to face a circuit substrate and a cylindrical second portion that is extending from a peripheral end of the first portion and along a peripheral wall portion of the casing body without being in contact with a housing. A heat conductive member having electrical insulating and heat conductivity properties as well as flexibility is disposed between the circuit substrate and the electromagnetic wave shielding member to closely contact both of the plurality of electronic components and the first portion of the electromagnetic wave shielding member.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: October 16, 2012
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Toshihito Miyashita, Hiroshi Hioki, Masakazu Chikyu
  • Patent number: 8289123
    Abstract: A fused conductor includes a first conductor portion, a second conductor portion, and a fuse element in electrical communication with the first and second conductor portions via at least one dual metal wire, the fuse element protected by a glass body bonded chemically to the dual metal wire.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: October 16, 2012
    Assignee: Littelfuse, Inc.
    Inventors: Stephen J. Whitney, Gordon Todd Dietsch, Christian Garcia, Daniel Onken, Janus Pagharion, Phil Shaw, Robert G. Swensen
  • Patent number: 8284542
    Abstract: Electrical circuit breakers in an electrical panelboard are equipped with tie-down devices to secure the circuit breakers to the panelboard. Each circuit breaker includes a standard housing or case having a raised portion that forms a pair of end walls and a slot at the base of each of the end walls. The panelboard includes mounts for attaching the tie-down devices to the panelboard. Each tie-down device includes (1) a breaker-attachment portion adapted to be mounted on the circuit breaker housing around the raised portion and having a pair of mounting hooks adapted to fit into the slots for attaching the tie-down device to the circuit breaker housing, and (2) a panelboard attachment portion extending beyond the circuit breaker housing for attachment to the panelboard mount.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: October 9, 2012
    Assignee: Schneider Electric USA, Inc.
    Inventors: Randy L. Siebels, William J. Broghammer
  • Patent number: 8274355
    Abstract: A trip device is disclosed, the device comprising: a power source side heater connected to a power source side of a molded case circuit breaker (MCCB) to receive current; a load side heater connected to a load side of the MCCB to receive the current; and a bimetal including a direct heat unit contacting the power source side heater and an indirect heating unit facing the power source side heater, wherein the bimetal is partially fixed between the power source side heater and the load side heater and is curved when over-current or short-circuited current flows in the MCCB.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: September 25, 2012
    Assignee: LS Industrial Systems Co., Ltd.
    Inventor: Young Min Jun
  • Patent number: 8270169
    Abstract: A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: September 18, 2012
    Assignee: Raytheon Company
    Inventors: Jeffrey Paquette, Scott R. Cheyne
  • Patent number: 8267915
    Abstract: A port for implantation within a body, comprises a housing having proximal and distal surfaces and a side surface wherein, the proximal surface faces outward toward the skin, the distal surface faces inward away from the skin and the side surface extends between the proximal and distal surfaces. A first well formed within the housing includes a first opening in the proximal surface and a second well formed in the housing adjacent to the first well has a second opening formed in the proximal surface. First and second outlet openings formed on the side surface of the port are in fluid communication with the first and second wells, respectively, and are separated from one another by a distance substantially equal to a distance separating lumens of a dual lumen catheter to which the port is to be connected.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: September 18, 2012
    Assignee: Navilyst Medical, Inc.
    Inventors: Katie Daly, Kristian DiMatteo, Eric Houde
  • Patent number: 8264317
    Abstract: A protector for a three-phase electric motor has a container with a housing and a metal plate secured thereto. A protrusion is provided in the housing. Three conductive terminal pins, each with a fixed contact, protrude into the housing through the metal plate. A thermally responsive plate is connected to the three moveable contacts. The thermally responsive plate is dish shaped and reverses its direction of curvature at a predetermined temperature. Three moveable contacts are secured to the thermally responsive plate. An elastic member extends between the protrusion and the thermally responsive plate. A rotation member prevents the thermally responsive plate from rotating, thereby maintaining the moveable contacts in opposition to the fixed contacts. The conductive terminal pins are located at a neutral point side of phase windings of a three-phase motor so that AC current flowing into the three-phase motor is interrupted.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: September 11, 2012
    Assignee: Ubukata Industries Co., Ltd.
    Inventor: Isao Higashikata
  • Patent number: 8257325
    Abstract: A venous access port assembly having a housing base with a discharge port, a septum and a cap. An interior reservoir is defined by a well in the housing base and a bottom of the septum, and a passageway extends from the reservoir through the discharge port. The housing base includes a base flange having integrally molded therein indicia identifying an attribute of the assembly. The indicia could be formed of base flange material, or could be formed by voids in the base flange material. If of plastic material, the molded indicia could be applied with a radiopaque agent, thereby allowing the indicia (“CT”) to appear on an X-ray of the patient in a manner informing a practitioner of a particular attribute of the assembly.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: September 4, 2012
    Assignees: Medical Components, Inc., Innovative Medical Devices, LLC
    Inventors: Timothy M. Schweikert, Raymond R. Bizup, Kevin E. Sanford, Kenneth M. Zinn
  • Patent number: 8258913
    Abstract: A fuse element includes a first conductive part and a second conductive part, and a fusible body which electrically connect the first conductive part and the second conductive part, and fuses when an overcurrent flows itself. The fusible body is formed in a plate shape. The fusible body has a first connection portion, a second connection portion and a fusing member, both ends of the fusing member being connected to the first connection portion and the second connection portion respectively. The fusing member is displaced from the first connection portion and the second connection portion in a first direction being intersect with a second direction in which the first and second connection portions are arranged.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: September 4, 2012
    Assignee: Yazaki Corporation
    Inventor: Norio Matsumura
  • Patent number: 8254128
    Abstract: A heat-transfer mechanism which transfers heat of a heat-generating component mounted on a board to a housing includes a heat-transfer plate having a bottom face portion which has contact with the heat-generating component, a first heat-transfer portion which is screwed near one end portion of the housing and a second heat-transfer portion which is screwed near the other end portion of the housing.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: August 28, 2012
    Assignee: Ricoh Company, Ltd.
    Inventor: Maiko Yasui
  • Patent number: 8248801
    Abstract: Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: August 21, 2012
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8248760
    Abstract: A switch arrangement for an electrical switchgear comprising a first bus, a second bus and a load connection. The switch arrangement comprises a breaker; wherein said breaker is moveable in said switchgear between a first position and a second position, such that in use, when said breaker is in said first position and closed it electrically connects said first bus to said load connection, and when said breaker is in said second position and closed it electrically connects said second electrical bus to said load connection, with said first electrical bus disconnected from said load connection.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: August 21, 2012
    Assignee: Eaton Corporation
    Inventors: Michael H. Abrahamsen, Jon C. Beaver, Robert Yanniello
  • Patent number: 8246576
    Abstract: Described herein is a medical device that has a collapsed configuration and an expanded configuration wherein one or more polymeric network layers are applied to the substrate and microparticles embedded in the polymeric network. The polymeric network layer or layers is/are configured to retain the microparticles when the device is in a collapsed configuration and to release the microparticles when the device is in an expanded configuration. Methods for delivering a therapeutic agent using the device and making the device are also disclosed.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: August 21, 2012
    Assignee: SurModics, Inc.
    Inventor: Joram Slager
  • Patent number: 8248806
    Abstract: A system and method are provided for directly coupling a chassis and a heat sink. A circuit board is provided with at least one processor mounted thereon. Additionally, a heat sink is provided, the heat sink being mechanically coupled to at least one of the circuit board and the processor for providing thermal communication between the heat sink and the circuit board. Furthermore, a mount is provided, the mount being coupled to the heat sink for providing a direct mechanical coupling with a chassis.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: August 21, 2012
    Assignee: NVIDIA Corporation
    Inventor: Ludger Mimberg
  • Patent number: 8235971
    Abstract: A catheter connection system is disclosed. In one embodiment, a catheter connection system may include at least two components and a deformable sealing element positioned between the at least two components configured to allow, upon deformation, fluid flow through the at least two components. In another embodiment, the catheter connection system may include a sealing element positioned between at least two components, wherein the components are coupled to one another by a locking member.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: August 7, 2012
    Assignee: C. R. Bard, Inc.
    Inventors: Mark A. Christensen, William R. Barron
  • Patent number: 8237536
    Abstract: Various embodiments include a thermal protector, including the rear end of a movable plate fixed to one end of a resin base and a pair of terminals for connection with an external circuit fixed to the other end thereof. Fixed contacts are formed on the fixed portions of the terminals, and the movable contact of the movable plate is disposed opposed to the fixed contacts. A bimetal element engaged with the center of the movable plate is set to project upward at normal temperature, thus bringing the movable contact into pressure contact with the fixed contacts with prescribed contact pressure. The bimetal element consists of an inversion area wherein the inversion area has no portion overlapping the conduction path area of load current.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: August 7, 2012
    Assignee: Uchiya Thermostat Co., Ltd.
    Inventor: Hideaki Takeda