Abstract: A method of forming a package is provided. The method comprises assembling on a carrier a stack of chip layers including a plurality of first chip layers and a second chip layer; encapsulating the stack of chip layers in a molding compound; removing the carrier to form a package main body; forming a redistribution layer on an exposed side of a first chip layer; and dividing the package main body to form a plurality of packages. Each first chip layer includes first chips and chip couplers. A chip package includes at least one chip stack and at least one chip coupler stack on a singulated redistribution layer. Each chip stack includes at least one chip from each chip layer, and each chip coupler stack includes at least one chip coupler and/or at least one chip coupler segment from each of the first chip layers.

Abstract: A chip packaging method includes: providing a wafer, on which multiple bumps are formed; cutting the wafer into multiple chip units, wherein multiple vertical heat conduction elements are formed on the wafer or the chip units; disposing the chip units on a base material; and providing a package material to encapsulate lateral sides and a bottom surface of each of the chip units, to form a chip package unit, wherein the bottom surface of the chip unit faces the base material; wherein, in the chip package unit, the bumps on the chip units abut against the base material, and wherein the vertical heat conduction elements directly connect to the base material, or the base material includes multiple through-holes and the vertical heat conduction elements pass through the multiple through-holes in the base material.

Abstract: A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

Abstract: A display substrate and a display device are provided. The display substrate includes a base and subpixels. The subpixel includes: a data line pattern; a power source signal line pattern including a portion extending in the first direction; and a subpixel driving circuitry. The subpixel driving circuitry includes two switching transistors, a driving transistor, and a storage capacitor. First and second electrode plates of the storage capacitor are coupled to a gate electrode of the driving transistor and the power source signal line pattern respectively. Second electrodes of the two switching transistors are coupled to a first electrode of the driving transistor. An orthogonal projection of the second electrode of at least one of the switching transistors onto the base at least partially overlaps an orthogonal projection of the power source signal line pattern onto the base, and at least partially overlaps an orthogonal projection of the second electrode plate of the storage capacitor onto the base.

Abstract: Subject matter regards generating a 3D point cloud and registering the 3D point cloud to the surface of the Earth (sometimes called “geo-locating”). A method can include capturing, by unmanned vehicles (UVs), image data representative of respective overlapping subsections of the object, registering the overlapping subsections to each other, and geo-locating the registered overlapping subsections.

Abstract: Various embodiments include combined lens and safety enclosure apparatuses and methods for forming the apparatuses. In one example a combined lens and safety enclosure apparatus for a light-emitting diode (LED) module is disclosed. The enclosure apparatus includes at least one plastic-material-based optical-lens element mounted over a plurality of LED elements, where a distance between the optical-lens element and any portion of any one of the plurality of LED elements is spaced away from each other by at least 0.8 mm. A driver-on-board (DoB) subsystem, including an electronic circuit configured to provide power to the plurality of LED elements, has a plastic-material-based optical enclosure mounted over the DoB subsystem. A distance between the optical enclosure and any portion of any of the electronic circuit is spaced away from optical enclosure by at least 0.8 mm. Other devices and methods are described.

Abstract: A sputtering target and a method for fabricating an electronic device using the same are provided. A sputtering target may include a carbon-doped GeSbTe alloy, wherein, for the carbon-doped GeSbTe alloy, an average grain diameter of a GeSbTe alloy after sintering is in a range of 0.5 ?m to 5 ?m, and a first ratio of an average grain diameter of carbon after the sintering is Y (?m) to the average grain diameter of the GeSbTe alloy after the sintering may be in a range of greater than 0.5 and equal to or less than 1.5. Alternatively, for the carbon-doped GeSbTe alloy, a condition of Y=X×(Z/100) may be satisfied, where an average grain diameter of a GeSbTe alloy after sintering is X (?m), an average grain diameter of carbon after the sintering is Y (?m), and a content of carbon is Z (at %).

Abstract: A system and methods for a CODEC driving a real-time light field display for multi-dimensional video streaming, interactive gaming and other light field display applications is provided applying a layered scene decomposition strategy. Multi-dimensional scene data is divided into a plurality of data layers of increasing depths as the distance between a given layer and the plane of the display increases. Data layers are sampled using a plenoptic sampling scheme and rendered using hybrid rendering, such as perspective and oblique rendering, to encode light fields corresponding to each data layer. The resulting compressed, (layered) core representation of the multi-dimensional scene data is produced at predictable rates, reconstructed and merged at the light field display in real-time by applying view synthesis protocols, including edge adaptive interpolation, to reconstruct pixel arrays in stages (e.g. columns then rows) from reference elemental images.

Abstract: A bone screw cutting system can include a cutting assembly having a plurality of blades. The system can further include a position adjustment assembly coupled to the cutting assembly and configured to receive a bone screw blank and position the bone screw blank relative to the cutting assembly. The cutting assembly is configured to cut a bone screw blank received by the position adjustment assembly and to form a self-tapping end portion at a cut end of a resulting cut bone screw.

Abstract: The present disclosure provides for a bone screw that may include a first portion extending from a first end to a second end in a longitudinal direction, for example. The first portion may have a head that defines the first end and a shank that defines the second end. Additionally, the first portion may include a metallic material and/or be formed of a metallic material, for example Titanium. The second portion may be mechanically coupled to the first portion and surround the shank, for example the second portion is screwed to the first portion or the second portion may be directly formed to the first portion by an overmold process. The second portion may have an exposed thread pattern and an exposed leading tip. Additionally, the second portion may include a thermoplastic material and/or be formed of a thermoplastic material such as PEEK.

Abstract: A pneumatic vacuum, cleaner includes an external body shell having an internal chamber defined therein and a dustbin carried within the internal chamber of the external body shell. The cleaner also includes an impeller housing positioned below the dustbin and having an inlet coupled to the dustbin. In addition, the cleaner includes an impeller within the impeller housing and is configured to pressurize air exiting the impeller housing. A manifold is mounted to the impeller housing and includes a plurality of air nozzles configured to direct air downward and away from the manifold to entrain debris into the air and simultaneously use the pressurized air to lift the cleaner. A concentric passageway is formed adjacent an inside surface of the external body shell and is configured to recirculate the pressurized air from the plurality of air nozzles back to the dustbin and the impeller housing via the concentric passageway.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Abstract: A fiber-based surgical implant stabilized against fraying, includes a thermally crimped flat-knitted fabric of a biocompatible, optionally biodegradable, polymer material having a glass transition temperature or other thermally induced secondary conformational mobility threshold in the temperature range of from 20° C. to +170° C. Also disclosed is a corresponding fabric and methods of producing the implant and the fabric.

Abstract: A pivotal bone screw assembly includes a receiver having a central bore with a bottom opening and a channel for receiving an elongate rod, with the central bore including a partial spherical internal surface adjacent the bottom opening and a horizontally-extending recess with a cylindrical sidewall surface. The assembly also includes a shank with a capture structure for positioning within the central bore and an anchor portion for attachment to the bone, with the capture structure having a partial spherical lower surface configured to slidably engage the internal surface of the central bore to provide for pivotal motion of the shank with respect to the receiver, together with an insert with a rod seating surface and an outwardly-projecting radiused structure, with the insert being downwardly displaceable within the central bore until the radiused structure snaps into the recess to prevent upward movement of the insert with respect to the receiver.

Abstract: A variable length headless compression screw insertion system includes a compression screw and a driver assembly for driving the compression screw into a bone. The compression screw has a bone screw and a compression sleeve coupled to the bone screw. The bone screw includes a proximal end having an external threading threadably received in the compression sleeve, and the compression sleeve includes a proximal end having a predefined drive feature and an external threading. The driver assembly includes a sleeve coupler adapted to threadably receive the external threading of the compression sleeve. A ram driver is coupled to the sleeve coupler and has a predetermined length such that its distal end is shaped to contact the proximal end of the bone screw to prevent translation of the bone screw relative to the compression sleeve.

Abstract: Devices and methods for performing a surgical step or surgical procedure with visual guidance using an optical head mounted display are disclosed.

Abstract: A packaged semiconductor device includes a molded interconnect substrate having a signal layer including a first channel and a second channel on a dielectric layer with vias, and a bottom metal layer for providing a ground return path. The signal layer includes contact pads, traces of the first and second channel include narrowed trace regions, and the bottom metal layer includes a patterned layer including ground cut regions. DC blocking capacitors are in series within the traces of the first and second channel for providing AC coupling that have one plate over one of the ground cuts. An integrated circuit (IC) includes a first and a second differential input channel coupled to receive an output from the DC blocking capacitors, with a bump array thereon flip chip mounted to the contact pads to provide first and second differential output signals.

Abstract: A method includes coating a release film over a carrier. The carrier includes a first material having a first Coefficient of Thermal Expansion (CTE), and a second material having a second CTE different from the first CTE. The method further includes placing a device die over the release film, encapsulating the device die in an encapsulant, and planarizing the encapsulant until the device die is revealed.

Abstract: Systems for variable angle insertion of surgical fasteners relative to an orthopedic plate with locking of the surgical fastener relative to the plate upon insertion. The systems may include a pivot member secured relative to either the orthopedic plate or the fastener. In either regard, the pivot member may provide locking engagement with the plate to lockingly engage the fastener relative to the plate.

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.