Abstract: A bone plate system comprises a bone screw and a bone plate having at least two screw-receiving hole structures, at least one of the hole structures comprising an eccentric portion adjacent a first seating area for biasing bone in an inferior fusion area into dynamic compression as the screw is advanced, and a cowl portion that at least partially defines a second seating area and being positioned to enable cross-screw compression of an inferior fusion area. The screw is seatable in either the first or second seating area at the option of a surgeon. A surgical method generally comprises inserting a bone screw into the compression plate and compressing bone in an inferior fusion area by either dynamic or cross-screw compression.

Abstract: An implant for therapeutically separating bones of a joint has two endplates each having an opening through the endplate, and at least one ramped surface on a side opposite a bone engaging side. A frame is slideably connected to the endplates to enable the endplates to move relative to each other at an angle with respect to the longitudinal axis of the implant, in sliding connection with the frame. An actuator screw is rotatably connected to the frame. A carriage forms an open area aligned with the openings in the endplates. The openings in the endplates pass through the carriage to form an unimpeded passage from bone to bone of the joint. The carriage has ramps which mate with the ramped surfaces of the endplates, wherein when the carriage is moved by rotation of the actuator screw, the endplates move closer or farther apart.

Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a chip structure including a substrate and a wiring structure over a first surface of the substrate. The method includes removing a first portion of the wiring structure adjacent to the hole to widen a second portion of the hole in the wiring structure. The second portion has a first width increasing in a first direction away from the substrate. The method includes forming a first seed layer over the wiring structure and in the hole. The method includes thinning the substrate from a second surface of the substrate until the first seed layer in the hole is exposed. The method includes forming a second seed layer over the second surface of the substrate and the first seed layer in the hole.

Abstract: A semiconductor device includes a field effect transistor (FET). The FET includes a first channel, a first source and a first drain; a second channel, a second source and a second drain; and a gate structure disposed over the first and second channels. The gate structure includes a gate dielectric layer and a gate electrode layer. The first source includes a first crystal semiconductor layer and the second source includes a second crystal semiconductor layer. The first source and the second source are connected by an alloy layer made of one or more Group IV element and one or more transition metal elements. The first crystal semiconductor layer is not in direct contact with the second crystal semiconductor layer.

Abstract: A system and method for improving assembly of a modular prosthesis, particularly a femoral stem. The system and method may include implementation of assembly systems for modular prosthesis having one or more intermediate components between a pair of “end components” such as a stem and a head. Grip structures are provided on non-aligned assembly axes and holders are used for each phase to engage appropriate grip structures for joinder of components having aligned assembly axes.

Abstract: A laundry appliance includes a basket rotatably mounted within a cabinet and defining a chamber configured for receiving a load of clothes, a water supply valve for regulating a flow of water into the chamber, and a camera assembly mounted within the cabinet in view of the chamber. A controller is configured to determine that the water supply valve is open to permit the flow of water into the chamber, identify an anticipated fog condition within the chamber based at least in part on the water supply valve being open, obtaining one or more images of the chamber using the camera assembly, analyzing the one or more images of the chamber to determine an actual fog condition in the chamber, and implementing a responsive action if the actual fog condition is different than the anticipated fog condition, e.g., providing a user notification.

Abstract: An implant holder is provided with a first guide lumen and second guide lumen. The implant holder has a first position wherein the implant holder couples to an interbody implant, aligns the first guide lumen with a first hole in the interbody implant, and aligns the second guide lumen with a second hole in the interbody implant. The implant holder has a second position wherein the implant holder releases the interbody implant.

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.

Abstract: A video data cable for use with a video medical device comprising an image capture device includes a processor; data storage; logic to identify the video medical device; logic to determine which of the video medical device or the data cable have a most up-to-date set of image capture settings based on the identified video medical device; logic to transmit the most up-to-date set of image capture settings to the video medical device when it is determined that the data cable includes the most up-to-date set of image capture settings; and logic to receive the most up-to-date set of image capture settings to the video medical device when it is determined that the data cable includes the most up-to-date set of image capture settings.

Abstract: A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.

Abstract: According to one embodiment, a semiconductor storage device includes a stacked structure in which a plurality of conductive layers is stacked in a stacking direction via an insulating layer, a plurality of pillars extending in the stacking direction in the stacked structure and including a memory cell formed at an intersection between at least a part of the plurality of conductive layers and at least a part of the plurality of pillars, a plurality of first contacts arranged in the stacked structure, each of the first contacts reaching a different depth in the stacked structure and being connected to a conductive layer in a different layer among the plurality of conductive layers, and a plurality of second contacts arranged in the stacked structure separately from the plurality of first contacts, each of the second contacts being connected to a conductive layer identical to the conductive layer to which corresponding one of the plurality of first contacts is connected.

Abstract: The silicon carbide semiconductor device includes: a silicon carbide layer; a silicon dioxide layer provided above the silicon carbide layer and containing nitrogen; and a transition region arranged between the silicon carbide layer and the silicon dioxide layer, and containing carbon, oxygen, and nitrogen, wherein the maximum nitrogen concentration in the transition region is 1.0×1020 cm?3 or higher. The maximum nitrogen concentration in the transition region is five or more times higher than the maximum nitrogen concentration in the silicon dioxide layer.

Abstract: The present invention relates to a process for manufacturing an optoelectronic device, wherein a layer of a formulation containing a silazane polymer and a wavelength converting material is applied to an optoelectronic device precursor, precured by exposure to radiation and then cured. There is further provided an optoelectronic device, preferably a light emitting device (LED) or a micro-light emitting device (micro-LED), which is prepared by said manufacturing process.

Abstract: A display substrate and a manufacturing method thereof, and a display device are provided. The display substrate includes a base substrate, a pixel drive layer, a light-emitting device, an encapsulation layer, a first insulation layer, and a covering layer. The base substrate includes a display region and a peripheral region, the peripheral region includes a first peripheral region and a second peripheral region. The first insulation layer is in the second peripheral region, and includes a first notch, a side edge of the first notch away from the display region overlaps with the edge of the base substrate. The covering layer is at least partially filled in the first notch, and an orthographic projection of the covering layer on the base substrate at least partially overlaps with an orthographic projection of the first notch on the base substrate.

Abstract: Embodiments of the disclosure provide a lateral bipolar transistor structure with inner and outer spacers, and related methods. A lateral bipolar transistor structure may have an emitter/collector (E/C) layer over an insulator. The E/C layer has a first doping type. A first base layer is on the insulator and adjacent the E/C layer. The first base layer has a second doping type opposite the first doping type. A second base layer is on the first base layer and having the second doping type. A dopant concentration of the second base layer is greater than a dopant concentration of the first base layer. An inner spacer is on the E/C layer and adjacent the second base layer. An outer spacer is on the E/C layer and adjacent the inner spacer.

Abstract: Spinal bone anchor attachment device for improving the attachment of a bone screw to skeletal portions of a patient, the device reducing the risk of screw failure, and improving patient outcomes. The device is composed of a biomaterial compatible with bone and provides an enhanced surface area on outer surfaces of the device for engaging the bone, and an enhanced surface area within the device for engaging the bone screw. The device may also have a guiding slanted tip with a bias element for facilitating the placement of the device into bone tissue and rescuing an improper tract. The device may further be used to secure the placement of pedicle screws, and as a component of an intervertebral stabilization system commonly used in spinal fusion surgeries.

Abstract: An electronic component evaluation method of evaluating a state of an electronic component includes acquiring reference point information, with respect to at least one terminal, reference point information including at least one of position information and first height information of a plurality of corresponding reference points on the terminal from imaging data obtained by image-capturing the electronic component including a component body and a plurality of terminals attached to the component body, and determining a state according to a shape of the electronic component based on a plurality of pieces of the reference point information.

Abstract: A semiconductor device has a substrate and a first component disposed over a first surface of the substrate. A connector is disposed over the first surface of the substrate. A first encapsulant is deposited over the first component while the connector remains outside of the first encapsulant. A shielding layer is formed over the first encapsulant while the connector remains outside of the shielding layer. A second component is disposed over a second surface of the substrate. A solder bump is disposed over the second surface of the substrate. A second encapsulant is deposited over the second surface of the substrate. An opening is formed through the second encapsulant to expose the solder bump. A solder ball is disposed in the opening. The solder ball and solder bump are reflowed to form a combined solder bump.

Abstract: A bone anchor system can comprise a fastener, a rod housing and a first directional component configured for connection to the fastener. The fastener can comprise a shaft having a shaft diameter, an anchoring projection on the shaft, and a head at an end of the shaft. The rod housing can be connected to the head of the fastener. The first directional component can comprise a first body portion having a first outer diameter larger than the shaft diameter, a first bore extending through the first body portion, the first bore sized to receive the shaft diameter, and a first locking component extending from the first body portion configured to engage the rod housing to limit movement of the housing.

Abstract: A method with video segmentation may include: acquiring, over time, a video sequence including a plurality of image frames, the plurality of image frames including a second image frame corresponding to a time t of the video sequence and a first image frame corresponding to a time t?1 before the time t; extracting a second feature vector from the second image frame; generating second hidden state information corresponding to the second image frame, based on first hidden state information corresponding to the first image frame and second fusion information in which the second feature vector is fused with information related to the second image frame stored in a memory; generating a second segmentation mask corresponding to the second image frame, based on an output vector corresponding to the second hidden state information; and outputting the second segmentation mask.