Abstract: An ellipsometer measures/monitors the change in polarization of light upon reflection from a wafer sample. The temperature of the wafer substrate surface and the film thickness are then simultaneously determined in situ using ellipsometry where the true wafer temperature is determined in real-time by the computer from a calculation based on the known temperature dependence of the refractive index of the wafer. The power output to the lamps is then adjusted accordingly to raise or lower the wafer temperature within the apparatus. This process continues automatically to maintain the desired temperature and film growth rate until the desired film thickness is achieved.
Abstract: A laser hardening device for forming a hardened layer on the surface of an object irradiated by a laser beam is so arranged as to emit a laser beam which is linearly polarized in the incidence plane containing the normal to the surface and the optic axis of the laser beam irradiating the surface. The device comprises a first concave mirror for condensing the laser beam the incidence plane, and a second concave mirror for condensing the laser beam in a perpendicular plane to the incidence plane, the first concave mirror being disposed closer than the second concave mirror to the laser oscillator in the path of the laser beam. Laser beam is therefore absorbed at a high absorption rate by the object, and a hardened layer is formed without coating a laser absorption agent onto the object. The incidence angle of the laser is preferably no less than 60 degrees, and by arranging that the laser beam is parallel on the irradiated surface, a uniform, hardened layer is obtained.
Abstract: A laser machining apparatus comprises a mask, a reflecting mirror and an imaging optical system. The laser light reflected by the mask and also by the reflecting mirror passes through the mask and images on the work for machining the work. The laser machining apparatus comprises means for causing said mask to move in parallel with said work for machining the work. This laser machining apparatus is able to machine a work having a large surface using small apertured mask. Another type of laser machining apparatus comprises a mask and a platform and an imaging optical system. The mask and the work are puts in the same plane of the platform and driven so that the image of the mask is mapped on the work via the imaging optical system. The laser machining apparatus is able to machine a large area at low price and high accuracy.
Abstract: A cartesian-type machine tool, particularly but not exclusively a laser machine, includes an operating head disposed at the end of a main beam which is cantilevered on a fixed support structure and is movable, relative to the fixed structure, in the direction of its own longitudinal axis. A considerable part of the weight of the main beam is supported by an auxiliary beam movable parallel to the main beam and cantilevered on the fixed structure, by support means which transmit the substantial part of the weight of the main beam to the auxiliary beam without rigid constraints of distance between the main beam and the auxiliary beam.
Abstract: In a high power hot cathode electron beam gun with a cathode and cathode heater which are caused to float at high potential, a high voltage cable termination is provided with built-in transformer. The transformer is characterized as having an input impedance matched to the cable and output impedance matched to the cathode heater. Using this configuration, the cathode power supplies and cathode/heater control assembly can be located in remote locations.
Abstract: A method and apparatus for selectively treating the surface of a substrate with a material. The method comprises supporting a workpiece at a work station and providing a source of fluent material for treating a preselected portion of a surface of the workpiece. A stream of the fluent material is directed toward the surface of the workpiece while effecting controllable relative movement between the stream of fluent material and the workpiece to impinge a select amount of the fluent material along a preselected path on the preselected portion of the surface of the workpiece. The fluent material is bonded with the preselected portion of the surface of the workpiece to produce a predetermined physical change on the preselected portion. The apparatus of the invention includes a mechanism to effect the specific steps of the novel method.
Abstract: A laser beam machine capable of preventing contaminants from entering a machining head. A laser beam (2) is reflected by a mirror (4) in a light guide passage (12) and introduced into the machining head (5). The laser beam is then focused by a parabolic mirror (6) to be irradiated onto a spot (7a) on a surface of a workpiece (7). An auxiliary gas (10) is ejected from a gas supply section (9) and throttled by a nozzle (11) to be supplied to the workpiece (7). The surface of the workpiece (7) is melted due to interaction between the laser beam (2) and the auxiliary gas (10), whereby a laser beam machining is achieved. An impeller (20) is arranged between the parabolic mirror (6) of the machining head (5) and the workpiece (7). A motor (21) for driving the impeller (20) is secured to a side wall (51) of the machining head (5) and rotates the impeller (20) at a high speed.
Abstract: A method of producing a corrugated metal sheeting including a flat metal sheet and a corrugated metal sheet joined to each other, which sheeting is used to produce a carrier or honeycomb structure for carrying catalytic agents used for purifying exhaust gases from, for example, an internal combustion engine of an automobile. In the method, the flat and corrugated metal sheets are brought together so that corrugations of the corrugated metal sheet are successively brought into contact with the flat metal sheet in such a manner that the corrugated metal sheet is freely movable to thereby release resilient stresses therefrom, and a laser beam is incident on a contact line between the flat metal sheet and each of the corrugations of the corrugated metal sheet, to thereby weld them to each other.
Abstract: A metal sheet is attached to a ceramic substrate utilizing a weld pad formed of tungsten layer that is preformed onto the substrate and features a faying surface coated with a gold film. The sheet is superposed onto the gold film and scanned with a laser beam to fuse the sheet and the gold, without fusing the tungsten, thereby avoiding spalling of the metal and microcracking of the ceramic.
Type:
Grant
Filed:
April 2, 1992
Date of Patent:
April 26, 1994
Assignee:
Motorola, Inc.
Inventors:
Michael P. Fleming, Celia A. Berry, Robert W. Shisler
Abstract: The invention relates to a process for the production of a metal screen by irradiating a metal basic layer with high-energy, focused radiation, wherein at least one metal basic layer (3) to be perforated to form a screen is supported in intimate contact on both opposite surfaces during the irradiation by a supporting element (1,5) adapted to the shape of the metal basic layer (3), using a release layer (2,4) between a supporting element (1,5) and the opposite surface of the metal layer (3), and after perforation the two supporting elements (1,5) and the release layers (2,4) are removed. According to the present process it is also possible to produce several screens at the same time by using a stack of metal basic layers (3,3',3"), between which release layers (2',2") are present. The metal basic layer (3,3',3") is a copper or nickel-containing compound, preferably copper.
Abstract: A laser work station has a base member, a laser head mounted on a laser head support carried on the base member for movement of the laser head relative to the base member, so that it is movable thereon in X, Y and Z axes. A guidance system effects precision movement of the laser head in the X, Y and Z axes to move the beam about a workpiece, and an optical sensor assembly comprising a light source and light sensors about the light source to detect light reflected from the surface of the workpiece. The sensor assembly is operable to detect reference formulations on the workpiece as it is moved thereabout.
Type:
Grant
Filed:
February 19, 1992
Date of Patent:
April 19, 1994
Assignee:
Trumpf Inc.
Inventors:
Friedrich Kilian, Stephen R. Bolton, Joseph J. Troiani
Abstract: A method for monitoring welding of a workpiece includes selecting light of a predetermined wavelength from that emitted by plasma produced by the welding process, generating signals indicative of the selected light's intensity, and correlating those signals with the cross-sectional area of the weld. An apparatus for monitoring welding of a workpiece includes a filter for passing selected light of a predetermined wavelength emitted by plasma, a signal generator which produces signals indicative of the intensity of the selected light, and means for correlating the signals with the weld's cross-sectional area.
Abstract: Powder feed apparatus for providing a precise flow rate of fine powder for laser welding as well as other welding operations where such precise flow of fine powder is required. The powder is metered by means of at least one wheel rotatable within a housing and having a peripheral edge with at least one plurality of cavities in the peripheral edge. The cavities are substantially evenly spaced entirely about the wheel periphery and sized to hold substantially equal volumes. The peripheral edge has a close clearance with the housing whereby to entrap for delivery to the outlet discrete precise quantities exclusively of the powder in the cavities. A velocity feed-back controlled motor connected to the wheel is provided to precisely control the flow rate of the powder by precisely controlling the motor velocity.
Type:
Grant
Filed:
February 18, 1992
Date of Patent:
April 19, 1994
Assignee:
D. A. Griffin Corporation
Inventors:
Robert Griffin, James H. Downey, Frederick K. McGee
Abstract: The present invention belongs to the field of techniques related to a laser robot and a method of controlling the same, particularly for performing weaving of a laser beam easily with high accuracy without the provision of a vibrating condenser lens at the leading edge of an arm.To solve the problems, in the laser robot (RB) of the present invention, a first inclined mirror (41a) is mounted on a motor (42a) inclined at a predetermined angle from a plane perpendicular to the direction of the rotation axis of a rotor shaft. Similarly, a second inclined mirror (41b) is mounted on a motor (42b) inclined at a predetermined angle. The laser beam (LB) emitted from a laser oscillator (8) is reflected in series by the first and second inclined mirrors (41a, 41b) and is subsequently propagated in the laser robot (RB) to be directed toward workpieces from the tip of a torch (7).
Abstract: The control of the optical operation of a laser beam welding tool is carried out, when the tool is in an out of service position, by low-power auxiliary radiation. This radiation is passed to a measuring device (64) equipped with a photoelectric cell (86) after having traversed the tool as far as a welding head (58). The control can apply to an optical channel carried by a welding iron used for welding repair sleeves in pressurized water nuclear reactor steam generator tubes.
Abstract: A hole forming method with a laser beam and a hole forming laser apparatus improves the efficiency of hole formation without deterioration in the quality of the formed hole. In a hole forming method for forming holes in a plurality of articles by irradiation with a condensed laser beam, the laser beam is switched in succession to plural working optical axes, thereby forming holes in succession in the articles positioned respectively on the working optical axes.
Abstract: A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7).
Abstract: An arrangement and method for establishing an electrical and mechanical connection between electrically conductive members. The arrangement includes an electrically conductive connecting member, two electrically conductive metallic members disposed opposite each other, flanking the connecting member, and clamping the connecting member therebetween, and a source of laser energy oriented such that an output beam therefrom is incident on an outer surface of one of the metallic members and directed towards the underlying connecting member to establish a weld connection at zones of mutual contact between the connecting member and the respective metallic members. The connecting member includes a cable or the like and the metallic members include contact terminals, busbars or the like.
Abstract: A method and apparatus for concentrating the heat energy of a laser beam by directing the laser beam to an optical device, such as a planar mirror, located at a first focal point of a reflector having a curved surface approximating that of an ellipsoid. The optical device redirects the laser beam to the curved surface of the reflector which reflects and focusses it to a second focal point of the reflector. The optical device is driven to cause the laser beam to successively scan different portions of the curved surface of the reflector while the latter surface reflects the laser beam substantially to the second focal point where the object to be heated is located.
Abstract: An optical element manufacturing method comprises steps of: preparing a wafer having opposite surfaces the extension of which intersecting each other at a predetermined angle; irradiating the wafer with a laser beam to form fringes on the wafer and displaying the fringes on a display for observation; determining cutting lines on the wafer with reference to the positions of the fringes; and cutting the wafer along the cutting lines to obtain a plurality of optical elements. By using method mentioned above, a nonlinear optical crystal element having an inclined plane can be produced in quantities.