Patents Examined by C. L. Albritton
  • Patent number: 5262614
    Abstract: A circuit board is manufactured by a method having the steps of depositing a metal pattern on a ceramic board, depositing a thin layer of a high polymer material on the ceramic board formed with the metal pattern, depositing a protective layer of a high polymer material on the thin layer of the high polymer material, and directing a laser beam toward and onto the protective layer and the thin layer deposited on a plating region of the metal pattern and a cutting region of the ceramic board thereby selectively removing part of those layers. The laser beam has a wavelength range of from 150 nm to 400 nm, an energy density range of from 0.5 J/cm.sup.2 to 5.0 J/cm.sup.2, and a pulse width range of from 100 ps to 1 .mu.s.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: November 16, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Kaoru Katayama, Hidetaka Shigi
  • Patent number: 5262613
    Abstract: A laser assembly adapted to retrofit industrial mechanical engravers to convert the mechanical engraver to a laser engraver.
    Type: Grant
    Filed: September 24, 1991
    Date of Patent: November 16, 1993
    Assignee: General Laser, Inc.
    Inventors: Richard A. Norris, Steven D. Allred
  • Patent number: 5262615
    Abstract: A trimmable resistor is provided which can be trimmed with a single movement of a laser beam without requiring intermitted deenergizations of the beam accompanied by measurements of the resistance to determine additional material removal steps. The procedure of the present invention begins the material removal at a location within the body of the resistor and displaced from all edges of the resistor body by a predetermined amount. The energization of the laser immediately begins to remove material at its initial location and, as the laser is moved to a second location, a single cut is made to calibrate the resistor wherein the entire cut is located within the body of the resistor and no part of the cut intersects any edge of the resistor body.
    Type: Grant
    Filed: November 5, 1991
    Date of Patent: November 16, 1993
    Assignee: Honeywell Inc.
    Inventor: Peter G. Hancock
  • Patent number: 5260542
    Abstract: A laser marking apparatus comprises a pulse laser oscillator which emits a linearly polarized laser beam; a transmission type liquid crystal mask which displays a pattern to be marked on an article in one of a positive pattern display mode and a negative pattern display mode by dots arranged in a matrix form and which allows to pass the emitted laser beam but differentiates the polarization plane of the laser beam which has passed through masked portions from that through unmasked portions; a polarized beam splitter disposed downstream the transmission type liquid crystal mask for selectivity passing the laser beam to be irradiated on the article to be marked from the transmission type liquid crystal mask; a TV camera for detecting a discriminator indicating the thermal conductivity of the article to be marked; a recognition unit which determines the thermal conductivity of the article to be marked based upon the detected discriminator; and a control unit which controls the transmission type liquid crystal ma
    Type: Grant
    Filed: November 29, 1991
    Date of Patent: November 9, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Kouji Ishiguro, Minoru Fujimoto, Kiyoshi Okumura, Kiyoshi Saito, Kouji Kuwabara, Makoto Yano, Hiroo Ohkawa
  • Patent number: 5257706
    Abstract: A method is disclosed for ablating a target surface and cleaning an ablated target surface resulting in the reduction of ablation debris accumulation.
    Type: Grant
    Filed: September 29, 1992
    Date of Patent: November 2, 1993
    Assignee: Bausch & Lomb Incorporated
    Inventor: Kevin J. McIntyre
  • Patent number: 5256852
    Abstract: A laser beam (2) is carried to the vicinity of a working point (10), on which it is focused, and spectral analysis of the light emitted at the working point during the laser working is carried out. Application to laser welding in small diameter tubes.
    Type: Grant
    Filed: October 10, 1991
    Date of Patent: October 26, 1993
    Assignee: Framatome
    Inventor: Cecile Boudot
  • Patent number: 5256850
    Abstract: An azimuth adjusting method for a magnetic head, which includes the steps of forming first and second depressions respectively on a main surface and a reverse surface of the main surface of a magnetic head base for a magnetic head including a magnetic head chip and the magnetic head base so as to reduce thickness of the magnetic head base, projecting heat rays to the first depression to obtain a displacement in a direction opposite to the projecting direction, also projecting the heat rays to a flat plane portion at a bottom of the second depression which is laterally neighboring the first depression so as to effect the azimuth adjustment of the magnetic head, with a reduced thickness of the magnetic head base in a direction of depth for the projection of heat rays due to formation of the depression at the reverse face side of the projection, and also effecting the azimuth angle adjustment in the reverse direction by laterally exchanging the first and second depressions for the projection of heat rays.
    Type: Grant
    Filed: September 18, 1992
    Date of Patent: October 26, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaaki Maegawa, Akio Murata, Hideaki Mukae, Masaru Higashionji
  • Patent number: 5256853
    Abstract: A method for shaping the surface of an optical target, said method comprising the steps of: addressing a ring of laser radiation to the surface of the optical target domain, said laser radiation being of sufficient fluency and energy to photoablate the material forming the body of said optical target domain, sweeping the optically functional portion of said target domain with said laser ring by effectively changing the radius of said ring in a prescribed fashion within the range of the radius of the optical target domain and zero.
    Type: Grant
    Filed: July 31, 1991
    Date of Patent: October 26, 1993
    Assignee: Bausch & Lomb Incorporated
    Inventor: Kevin J. McIntyre
  • Patent number: 5256848
    Abstract: Apparatus for working by laser, especially for the decontamination of a pipe of a nuclear reactor, comprising a laser source (18); an optical fiber (21) whose input is connected to the output of the laser source; a laser beam amplifier (20) whose input is connected to the output of the optical fiber; and a device (5) for transporting the laser beam emitted by the amplifier through the air to a working point.
    Type: Grant
    Filed: September 12, 1991
    Date of Patent: October 26, 1993
    Assignee: Framatome
    Inventors: Jean-Pierre Cartry, Georges Clar, Alain Martin
  • Patent number: 5256849
    Abstract: Method and apparatus for increasing the index of refraction, n, by several orders of magnitude. Pumping and probing radiation excite the various atomic levels of a material, and establish coherence between such levels. Index of refraction can thereby be increased while, concomitantly, absorbence of the material is minimized.
    Type: Grant
    Filed: October 3, 1991
    Date of Patent: October 26, 1993
    Assignee: Biolight, Inc.
    Inventor: Marlan O. Scully
  • Patent number: 5254833
    Abstract: The brittle material cleavage-cutting apparatus of the present invention comprises a placing stand for holding a brittle material and beam scanning device for deflecting a laser beam from a laser source so that a brittle material placed on the placing stand is scanned along a planned cleavage-cutting line. By the beam scanning device, the laser-beam irradiation position on the brittle material is repeatedly moved in short cycles along the planned cleavage-cutting line.
    Type: Grant
    Filed: August 27, 1992
    Date of Patent: October 19, 1993
    Assignee: Soei Tsusho Company, Ltd.
    Inventor: Toshihiro Okiyama
  • Patent number: 5254832
    Abstract: Ultrafine particles (9) are produced from a target 30) by laser beam evaporation. The laser beam (1) is directed to the target in such a manner that the removal of the target material takes place in the direction of movement of the laser beam. The ultrafine particles thus manufactured are preferably used for the manufacture of single or multi-component materials or moulded bodies from such materials; by coating substrates (15) with said ultrafine particles.
    Type: Grant
    Filed: January 8, 1991
    Date of Patent: October 19, 1993
    Assignee: U.S. Philips Corporation
    Inventors: Georg Gartner, Hans Lydtin
  • Patent number: 5254834
    Abstract: A method of manufacturing an electrical connector housing for mounting a plurality of connector elements. Such a housing mounts elements to be engaged by corresponding contacts of an integrated circuit device which are disposed in an array. The method includes the steps of providing a block made of an appropriate material such as a polyamide. The block provided has a relatively thin wall which is defined by two oppositely facing surfaces. Typically, the thickness of the wall is less than about 0.15 inches. A trough, generally conforming in size and shape to the size and shape of the contact array of the integrated circuit, is formed in at least one of the two oppositely facing, spaced surfaces defining the wall. Such a trough is intended to receive a connector element support. In manufacturing the housing for mounting the connector elements, each trough is filled with a rod, generally conforming in cross-section to a cross-section of the trough.
    Type: Grant
    Filed: June 2, 1992
    Date of Patent: October 19, 1993
    Assignee: JohnsTech International Corporation
    Inventor: David A. Johnson
  • Patent number: 5254831
    Abstract: Method of manufacturing a sewing machine bobbin having flanges at both ends, which is characterized by integrally welding bobbin parts by means of laser beam irradiation. Aluminum is suitable for bobbin material except having comparatively low melting point, which has conventionally made it difficult to use aluminum material for bobbin. Described is the method of welding alminum bobbin parts by means of laser beam irradiation, which is also available for welding other materials.
    Type: Grant
    Filed: December 30, 1992
    Date of Patent: October 19, 1993
    Inventor: Masahiro Seki
  • Patent number: 5252805
    Abstract: A laser beam machining method for cutting a workpiece in accordance with a machining program composed of a succession of move commands and laser output commands. An angle of a machining path is calculated on the basis of a move command under execution and a subsequent read out move command (S2, S3). The angle of the machining path is compared with a preset angle (S4), and when the angle of the machining path is more acute than the preset angle, the movement for machining based on the move command under execution is decelerated and stopped (S5). In this case, the laser output command is changed from a cutting condition to a piercing condition, to carry out a piercing operation, and when the piercing operation is completed, the movement for machining is restarted in accordance with the subsequent move command. When the movement for machining is restarted, the laser output command is changed from the piercing condition to the cutting condition in accordance with the movement for machining.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: October 12, 1993
    Assignee: Fanuc Ltd
    Inventors: Yoshinori Nakata, Etsuo Yamazaki, Norio Karube, Tsuyoshi Nagamine
  • Patent number: 5252803
    Abstract: A vehicle suspension member such as leaf spring (50) is provided having at least one plate (3) having an irradiation exposed region (R) therein that is generally parallel to a longitudinal axis ("L/A") extending between opposite ends of plate (3) and operative to provide a metallurgical discontinuity extending therealong between opposite ends thereof that is effective to divert crack propagation in a direction generally parallel to axis ("L/A").
    Type: Grant
    Filed: June 22, 1992
    Date of Patent: October 12, 1993
    Assignee: Eaton Corporation
    Inventor: Bohdan Lisowsky
  • Patent number: 5250783
    Abstract: Metal sheets having different thicknesses are abutted to define an abutment line and then are laser-welded. During laser welding, the laser beam is directed to a line (a weld line) which is apart from the abutment line on a thicker sheet side. The distance between the abutment line and the weld line is preferably in the range of 0.1 mm to 0.4 mm. Preferably, the laser beam weaves from side to side with respect to the weld line. As a result, a sharp edge is removed from the thicker sheet and a smooth transient surface is formed on the weld bead. The resulting one-piece sheet can be used as a press material without any pre-pressing processing, such as grinding.
    Type: Grant
    Filed: September 2, 1992
    Date of Patent: October 5, 1993
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Eiji Nishi, Taminori Yanagisawa, Toshiyuki Takasago, Kouichi Arima
  • Patent number: 5250785
    Abstract: The joining web of a pair of molded wiper blades is successfully laser slit to produce a pair of sharp, square cornered edges. The wiper blade pair is first securely supported in a fixture beneath the laser lens housing. The laser beam is oriented with the focal point slightly above the surface of the web, rather than at or below it. The laser is set with a low power setting and short pulse length, all designed to minimize the otherwise harmful heat effects. When the beam is run straight down the web, too acceptably sharp edges are produced.
    Type: Grant
    Filed: September 14, 1992
    Date of Patent: October 5, 1993
    Assignee: General Motors Corporation
    Inventors: Scot A. Blommel, Harvey J. Lambert
  • Patent number: 5250782
    Abstract: A method for the closing, by laser, of packages of electronic circuits, notably hybrid circuit packages, said method minimizing mechanical stresses. The soldering is done along a soldering path on the lid of the package. The soldering path is divided into segments and two consecutive segments are never soldered one after the other. The method can be applied to the closing of large-sized hybrid packages.
    Type: Grant
    Filed: August 17, 1992
    Date of Patent: October 5, 1993
    Assignee: Thomson-CSF
    Inventors: Christian Cordelle, Florence de Reynal, Dominique Goujard, Michel Sergent
  • Patent number: 5250784
    Abstract: At least one laser beam is focused on one side of an assembly to be cut at a point on the side which is part of the cutting profile and which is called the point of impact of the beam on side side, in order to cause at that point a disintegration of the material of the assembly. The laser beam is moved in relation to the assembly so that the impact point describes a trajectory which corresponds to the desired cutting profile, while maintaining a controlled atmosphere in the area around the impact point. Uses particularly include cutting solid polymer electrolyte lithium thin film electrochemical generators, or cutting precursors of such generators.
    Type: Grant
    Filed: October 24, 1991
    Date of Patent: October 5, 1993
    Assignees: Societe Nationale Elf Aquitaine, Hydro-Quebec
    Inventors: Daniel Muller, Bruno Kapfer