Abstract: A load balancer includes: a request queue that stores a request scheduled to be transmitted to a server; a transmission unit that transmits a request read from the request queue to the server capable of processing the request; a reception unit that receives a completion message indicating that processing of the request is completed; and a completion list that stores the completion message, and the transmission unit discards a request for which the completion message is stored in the completion list without transmitting the request to the server, and transmits, to the server, a request for which the completion message is not stored in the completion list and stores the request again in the request queue.

Abstract: An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole extends through the dielectric layer, and a layer of nonconductive material covers the at least one hole, wherein the nonconductive material is glass-free. A conductive plate layer is disposed over the nonconductive material layer to form a via connection in the structure.

Abstract: An electronics box for insertion into a wall box includes a housing having walls that define an inner volume. One wall includes an edge having part disposed along an outer surface of that wall, and a tab disposed within the inner volume at a distance from the outer surface of the wall and extending along a direction parallel to the outer surface of the wall. Another wall includes an edge having a part along an outer surface of that wall, and an opening completely surrounded by the wall at a distance from the edge of the wall. Upon the parts of the edges of the walls being brought in contact, the tab is inserted into the opening. The tab and the opening are dimensioned such that the tab securely fits into the opening and secures together the walls.

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers and having a cavity penetrating through a portion of the plurality of insulating layers, a passive component disposed in the cavity and including an external electrode electrically connected to at least one of the plurality of wiring layers, and a bridge disposed on the passive component in the cavity and including one or more circuit layers electrically connected to the external electrode.

Abstract: A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.

Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.

Abstract: An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.

Abstract: According to certain embodiments, an electronic device comprises: a housing; an electronic component disposed in the housing, wherein the electronic component generates heat during operation; a support cover disposed on the electronic component; a metal member overlapping with the electronic component while interposing the support cover between the metal member and the electronic component; a switching unit selectively forming or disconnecting an electrical connection path of the support cover and the metal member; and at least one processor configured to select an antenna tuning code, based at least in part on whether the switching unit forms or disconnects the electrical connection path, wherein the switching unit includes: a receiving member electrically connected to the support cover and providing a receiving space; a thermally deforming member received in the receiving space, wherein the thermally deforming member deforms based on a temperature; and an elevating member configured to move upwardly to elec

Abstract: In one embodiment, webpage data for a webpage is downloaded by a web browser executed by a client device. The client device inserts instrumentation into the webpage data to collect event metrics for events associated with the webpage. The client device selects, based on a user-defined policy, a set of event metrics from among the collected event metrics to be shared with a proxy service. The client device sends the selected set of event metrics to the proxy service. The proxy service provides access to the set of event metrics to one or more collectors registered with the proxy service.

Abstract: An embodiment provides a method, including: obtaining, via a server, a set of event data corresponding to a milestone; automatically determining, using a central service implemented in the server processor and without additional user input, an overlap between said set of event data and a predetermined scheduling milestone indicating an event overlap; identifying, using the central service a processor, one or more display elements impacted by the event overlap; and automatically updating, using the central service and in real-time during the patient procedure, the one or more display elements according to the overlap. Other embodiments are described and claimed.

Abstract: Systems and methods related to transferring (e.g., large) files over a network are disclosed. In at least one embodiment, a client-server framework establishes a QUIC connection between a server application and a client application. Source files are processed by the server application to divide the source files into a number of chunks. Differential file transfer can be implemented between the client application and the server application by comparing metadata for chunks of the source file with metadata of local chunks of a destination file already stored in a local storage associated with the client application. Missing chunks can be requested from the server application and transferred to the client application using HTTP/3 messages.

Abstract: A pixel electrode or a common electrode is a light-transmissive conductive film; therefore, it is formed of ITO conventionally. Accordingly, the number of manufacturing steps and masks, and manufacturing cost have been increased. An object of the present invention is to provide a semiconductor device, a liquid crystal display device, and an electronic appliance each having a wide viewing angle, less numbers of manufacturing steps and masks, and low manufacturing cost compared with a conventional device. A semiconductor layer of a transistor, a pixel electrode, and a common electrode of a liquid crystal element are formed in the same step.

Abstract: A method can include receiving a first request from a third party computing system. The method can include generating a passcode based the first request. The method can include transmitting the passcode to the third party computing system. The method can include receiving a second request for payment of a bill. The method can include generating a user interface to receive a passcode input and a cash deposit selection. The method can include receiving the passcode input and the cash deposit selection. The method can include receiving a user selected payment amount. The method can include initiating a cash deposit mechanism. The method can include receiving cash from the third party customer. The method can include counting the cash. The method can include determining that cash matches the user selected payment amount. The method can include transmitting a notification to the third party computing system.

Abstract: An optical package includes: a Printed Circuit Board including a plurality of cut-out sections; a lens, including a first plurality of protrusions corresponding respectively to the plurality of cut-out sections, wherein when the lens is placed under the PCB, the protrusions will pass through the cut-out sections; and a sensor for attaching on to the lens and the PCB. The first plurality of protrusions has a shape from the group including: snap features, guide posts and guide posts with tight-fit ribs.

Abstract: An electronic device according to the present invention comprises: a first multi-layer printed circuit board (PCB) including a transceiver circuit; a second multi-layer PCB including an antenna; and a connector configured to connect the first multi-layer PCB and the second multi-layer PCB to each other, wherein the first and the second multi-layer PCB include signal transmission lines configuring a vertical connection for signal transfer between different layers, and include multiple adjacent ground patterns configuring a vertical ground connection between the different boards. In order to improve the matching characteristic between the vertically connected signal transmission lines, window regions from which a metal pattern is eliminated are formed at the same positions in different layers of the first and the second multi-layer PCB between the adjacent ground patterns.

Abstract: A display substrate includes: a base substrate (100); a plurality of sub-pixels (R, G, B) located on the base substrate (100), every two rows of sub-pixels (R, G, B) constituting a pixel group; a plurality of first gate lines (Gate1) located at first row gaps between the pixel groups, two first gate lines (Gate1) being arranged at each first row gap; and a plurality of photosensors (101), the orthographic projection of each row of photosensors (101) on the base substrate (100) completely covering a second row gap in the pixel group and partially overlapping with the orthographic projections of the sub-pixels (R, G, B), thereby avoiding the bright and dark difference between adjacent rows and ensuring the aperture ratio.

Abstract: A display panel includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed on the pad area, and an insulating layer disposed between adjacent ones of the plurality of pad electrodes and including a heat absorbing particle. A laser is irradiated to heat the insulating layer, and the heat absorbing particle in the insulating layer absorbs the heat and cures an anisotropic conductive film by heat transfer to electrically connect the plurality of pad electrodes to a plurality of bump electrodes.

Abstract: A sample holder includes a base comprising a support structure and a printed circuit board (PCB) in contact with the base. The PCB includes: a dielectric; a front-surface ground (GND) formed on a front surface of the dielectric; a back-surface GND formed on a back surface of the dielectric; a through hole penetrating from the front-surface GND to the back-surface GND, the through hole in which a chip is disposed, and a conductor that electrically connects the front-surface GND and the back-surface GND on an end face of the through hole. At least a part of the base below the through hole has a cavity. The support structure that supports a surface of the chip and is electrically connected to the base. The support structure is disposed in the cavity.

Abstract: A join is provided that has an electrically insulating component and two joining partners secured to one another and electrically insulated from one another by the electrically insulating component. The electrically insulating component has a surface that extends between the two joining partners. The surface defines a structure selected from a group consisting of an elevation, a depression, and any combinations thereof. The structure elongates a direct path along the surface. The structure completely surrounds at least one of the two joining partners. The electrically insulating component and/or the structure includes a glass that is at least partially crystallized.

Abstract: The present application discloses a display module and a display device. The display module includes a light grating assembly. The light grating assembly includes alternately arranged first regions and second regions, and liquid crystal molecules and dye molecules distributed in the first regions and the second regions. Arrangement of the liquid crystal molecules and the dye molecules are controlled to make the first regions light-transmissive and the second regions light-transmissive under a first mode and not light-transmissive under a second mode to form alternately light and dark stripes under the second mode.