Patents Examined by C Nguyen
  • Patent number: 12184052
    Abstract: The present disclosure enables a cost reduction for a circuit assembly including electronic components. A circuit assembly includes: an electronic component; a conductive plate to which the electronic component is connected; and a holding member that holds the conductive plate. The conductive plate includes a mounting portion on which the electronic component is mounted, and a fiducial mark for positioning and mounting the electronic component. The fiducial mark is constituted by a hole formed in the conductive plate.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: December 31, 2024
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Shinya Hamano, Yoshikazu Sasaki, Junya Aichi, Jun Ikeda
  • Patent number: 12185479
    Abstract: A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: December 31, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Cheng-Ta Ko, Pu-Ju Lin, Shih-Chieh Chen, Chi-Hai Kuo, Jeng-Ting Li
  • Patent number: 12182873
    Abstract: Systems and methods are provided for automating property assessment using probable roof loss confidence scores. More particularly, the systems and methods may generate a base-line probable roof loss confidence score based upon buildings, roof, weather, hail, and climate data. The systems and methods may predict a specific event and a set of characteristics of the specific event. The systems and methods may predict a level of roof damage and a cost of roof damage based upon the predicted level of roof damage. The systems and methods may adjust a risk-related factor, and may further adjust policy parameters based upon the risk-related factor. A probable roof loss confidence score may be generated, as well as property insurance claims data or property insurance loss mitigation data based upon probable roof loss confidence score data.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: December 31, 2024
    Assignee: STATE FARM MUTUAL AUTOMOBILE INSURANCE COMPANY
    Inventors: Joshua M. Mast, Douglas L. Dewey, Todd Binion, Jeffrey Feid
  • Patent number: 12180945
    Abstract: The present disclosure relates to towers for wind turbines comprising a top section supporting a nacelle about a yaw axis, wherein the nacelle comprises an electric power component and a power cable for electrically connecting the electric power component to an electrical connection point in a lower section of the tower. The power cable extends downwards from the nacelle to a first height along a substantially central area of the tower, and at a first height the power cable comprises a power cable loop. The power cable loop includes an upwards curve, and a downwards curve. The power cable loop comprises a movable cable part, and a fixed cable part, and the fixed cable part comprises at least a portion of the downwards curve. The present disclosure further relates to wind turbines and to methods for arranging cables in wind turbine towers.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: December 31, 2024
    Assignee: General Electric Renovables Espana, S.L.
    Inventors: Luis Crusat Oller, Lionel Vanmarcke, Eduard Bosch Palau
  • Patent number: 12182306
    Abstract: A method for safeguarding data in dynamic relational order management involves receiving a data feed and a dynamic order with various order attributes, including a protected dataset and an unprotected dataset. The protected dataset, containing a request type and a reserve execution threshold, is obfuscated from display on a respondent system. Instructions are transmitted to the respondent system to present a proposal request dataset for executing the dynamic order, comprising the unprotected dataset and the data feed. A proposal response dataset is received from the respondent system, including first and second execution values. Adjusted values are generated based on the received data, and an execution action is performed when the adjusted execution values meet the adjusted reserve execution threshold.
    Type: Grant
    Filed: April 19, 2024
    Date of Patent: December 31, 2024
    Inventor: Stephen K. Lynner
  • Patent number: 12183758
    Abstract: Provided is a circuit board comprising a first conductor periodically arranged with a first periodic width in a first region, a second conductor periodically arranged with a second periodic width in the first region, a third conductor periodically arranged with a third periodic width in a second region, and a fourth conductor periodically arranged with a fourth periodic width in the second region. The first periodic width and the second periodic width, and the third periodic width and the fourth periodic width are in a rational number relationship, the first periodic width and the fourth periodic width are same or substantially same, the first region and the second region have a conductor structure mirror-symmetrical or substantially mirror-symmetrical in a first direction. A first power supply is connected to the first conductor and the third conductor and a second power supply is connected to the second conductor and the fourth conductor.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: December 31, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Takashi Miyamoto
  • Patent number: 12182879
    Abstract: Systems and methods provide for a computerized system for quoting home owners insurance and providing a more consultative way of delivering insurance quotes and insurance quote information. The system may present insurance consumers with an automated process of asking questions and receiving feedback. Based on the feedback, the system may provide insurance options and explanations of those options enabling consumers to make a decision that best fits their personal situation. For example, systems and methods are directed to determining and providing a deductible that fits a user based on the user's tolerance for risk and cash position. The system may also provide a description of the types of risks and damages that are covered by particular insurance coverages. The system may also provide an analysis of the insurance obtained by similarly situated individuals. The system may also provide descriptions of insurance features.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: December 31, 2024
    Assignee: Allstate Insurance Company
    Inventors: Dean Krieter, Salvador Lopez, Anastasia Hannebrink
  • Patent number: 12177965
    Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: December 24, 2024
    Assignee: AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Sebastian Sattler, Christian Vockenberger, Ahmad Bader Alothman Alterkawi
  • Patent number: 12177964
    Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: December 24, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Jun-Rui Huang, Chih-Chiang Lu, Yi-Pin Lin, Ching-Sheng Chen
  • Patent number: 12177974
    Abstract: A circuit board according to an embodiment includes an insulating layer including a first via hole; a first via disposed in the first via hole of the insulating layer; wherein the first via includes: a first via part disposed in a first region of the first via hole; and a second via part disposed in a second region other than the first region of the first via hole; wherein the second region is a central region of the first via hole, and the first region is an outer region surrounding the second region; wherein the first via part and the second via part includes: a first surface in contact with each other; and a second surface other than the first surface exposed on the insulating layer; wherein the first surface has a first surface roughness; wherein the second surface has a second surface roughness different from the first surface roughness.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: December 24, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Hun Joung, Soon Gyu Kwon, Jung Ho Hwang, Min Ji Kim, Dae Gyu An
  • Patent number: 12175538
    Abstract: The disclosure provides an early notification system to alert a driver of an approaching unsafe autonomous or semi-autonomous driving zone so that a driver may switch vehicle to a non-autonomous driving mode and navigate safely through the identified location. In response, to a determination of an upcoming unsafe autonomous or semi-autonomous driving zone, the driver or system may take appropriate actions in response to the early notification.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: December 24, 2024
    Assignee: ALLSTATE INSURANCE COMPANY
    Inventors: Surender Kumar, Timothy W. Gibson
  • Patent number: 12176135
    Abstract: A coil component includes a base body containing metal magnetic particles and a binder binding together the metal magnetic particles and having a first surface extending along a coil axis and a second surface opposing the first surface, a first external electrode, a second external electrode, and a coil conductor electrically connected to the first and second external electrodes. In one embodiment, the coil conductor has a winding portion, the winding portion has first conductor portions and one or more second conductor portions smaller in number than the first conductor portions. The first and second conductor portions alternate with and are connected to each other. A first dimension of the base body representing a dimension between the first surface and the second surface is greater than a second dimension of the base body representing a dimension of the base body between the third and fourth surface.
    Type: Grant
    Filed: November 29, 2023
    Date of Patent: December 24, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Hidenori Aoki, Tomoo Kashiwa
  • Patent number: 12171065
    Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.
    Type: Grant
    Filed: August 25, 2023
    Date of Patent: December 17, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sangwon Ha, Subyung Kang, Sanghoon Park, Soohyun Seo, Yongjin Woo, Yeomoon Yoon
  • Patent number: 12169341
    Abstract: Provided are a display panel and a manufacturing method thereof, a display device and a spliced display device. The display panel includes: a color filter substrate (11), an array substrate (12) and a first conductive portion (13), where a display region (AA) and a peripheral region (NA) are formed on the display panel, and the peripheral region (NA) surrounds the display region (AA); the array substrate (12) includes pixel circuits and a second conductive portion (14), where the pixel circuits are located in the display region (AA), and the second conductive portion (14) is located in the peripheral region (NA); the second conductive portion (14) is connected with the pixel circuits; the first conductive portion (13) is located on a side surface of the array substrate (12) and a side surface of the color filter substrate (11), and the first conductive portion (13) is connected with the second conductive portion (14).
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: December 17, 2024
    Assignees: Beijing BOE Display Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Bin Wu, Wei Zhong, Xiaodi Sun, Haijun Shi, Bochang Wang, Chunguang Tian, Hongbo Feng
  • Patent number: 12170285
    Abstract: Provided is a display device.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: December 17, 2024
    Assignee: TOVIS CO., LTD.
    Inventor: Yong Min Park
  • Patent number: 12170603
    Abstract: A network device may include a packet processing pipeline. The packet processing pipeline may include a parser configured to parse packet information in a transit packet received at an input interface of the network device. The packet processing pipeline may include packet sampling information storage circuitry configured to store sampled packet information obtained based on the parsed packet information. The packet processing pipeline may include a processing engine configured to modify a payload of a sampling information accumulation packet to include the sampled packet information for the transit packet. The payload of the sampling information accumulation packet may include the sampled packet information for multiple transit packets.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: December 17, 2024
    Assignee: Arista Networks, Inc.
    Inventors: Navdeep Bhatia, Hugh Holbrook, Michael Chih-Yen Wang
  • Patent number: 12164190
    Abstract: According to one embodiment, a camera module includes a liquid crystal panel, an image sensor and an optical system. The liquid crystal panel is configured to display a coded aperture pattern. The optical system is interposed between the liquid crystal panel and the image sensor. The liquid crystal panel includes a liquid crystal layer containing liquid crystal molecules and dichroic dye molecules aligned following the liquid crystal molecules.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: December 10, 2024
    Assignee: Japan Display Inc.
    Inventors: Koichi Igeta, Kasumi Hase, Yoshiro Aoki
  • Patent number: 12164128
    Abstract: An article including a thin film interference pigment; and a coating including a colored selectively absorbing nanoparticles is disclosed. The article can exhibit a change in hue, lightness, and/or chroma as compared to the thin film interference pigment alone. Methods of making the article are also disclosed.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: December 10, 2024
    Assignee: VIAVI SOLUTIONS INC.
    Inventors: Alberto Argoitia, John Edward Book, Jaroslaw Zieba
  • Patent number: 12166339
    Abstract: A circuit structure includes a first busbar constituted by a cladding material, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, and an electronic component provided on the first busbar and the second busbar so as to straddle the insulating portion. The electronic component has a connection terminal bonded to the first busbar.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: December 10, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Akira Haraguchi
  • Patent number: 12167307
    Abstract: A method and a device are disclosed including one or more plug-in or Add-on Software Components (ASC) provided by a Social Business Platform (SBP) to deliver configuration information for the integration of various applications, services, and functionality from other platforms in an integrated environment. Each ASC may deliver a particular type of configuration information usable to configure and/or integrate services from various platforms, the services including data tiles and data streams, storage and document management services, single-function applications, core applications like communication and task management services, and other application-specific add-ons. In various embodiments, the configuration information may be distributed as packages of one or more files, which describe the configuration to be applied to the integrated services.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: December 10, 2024
    Assignee: Jive Software, Inc.
    Inventors: Edward John Venaglia, Murali V. Ponnuraj, Alberto Aron Cirilo Racho, Benjamin Gene Cheung