Abstract: A method for manufacturing a circuit redistribution structure includes the following steps. A first dielectric is formed on a carrier. Conductive blind vias are formed in the first dielectric. A first circuit redistribution layer is formed on the first dielectric. A second dielectric is formed on the first dielectric. First and second holes are formed on the second dielectric. A trench is formed in the second dielectric to divide the second dielectric into first and second portions. A first portion of the first circuit redistribution layer and the first hole are disposed in the first portion of the second dielectric, and a second portion of the first circuit redistribution layer and the second hole are disposed in the second portion of the second dielectric. Conductive blind vias are formed in the first and second holes, and a second circuit redistribution layer is formed on the second dielectric.

Abstract: A capacitive touch sensitive device includes a matrix of pads patterned in a first electrically conductive material on a substrate. Horizontally adjacent pads within each even row of the matrix are electrically coupled to one another via channels to form a plurality of horizontally arranged electrodes. Insulators are positioned over respective channels. Conductive links are formed over respective insulators and are configured to electrically couple vertically adjacent pads between odd rows of the matrix to form a plurality of vertically arranged electrodes. The dimensions of the channels and the conductive links are configured such that an RC time-constant (RCtc) of each of the vertically arranged electrodes substantially matches an RCtc of each of the horizontally arranged electrodes.

Abstract: The present invention is a method for manufacturing a multilayer wiring board having (1) a step of providing with a hole for a via hole from a metal foil for an upper layer wiring pattern to an inner layer wiring pattern by using a conformal method or a direct laser method, and (2) a step of forming a via hole by forming electrolytic filling plating layers in the hole for a via hole, wherein the formation of the electrolytic filling plating layers in the step (2) is carried out by repeating change in electric current density of temporarily decreasing the electric current density of electrolytic filling plating in the middle of the electrolytic filling plating and then increasing it again, two or more times before the electrolytic filling plating layers block an opening of the hole for a via hole.

Abstract: The present invention provides a nozzle seamless splice mechanism and an adjustment method for the same, and belongs to a field of printing machinery technology. The nozzle seamless splice mechanism and the adjustment method for the same may solve the problems of nozzles orifices stagger, reduced printing width or blankness exposed in the middle caused by the causes such as the fabrication error, the personal error, etc with respect to the existing nozzles. The nozzle seamless splice mechanism of the present invention comprises: splice mechanism comprising: a micro-device for detecting coordinates of orifices of nozzles; a nozzle adjustment base for fixing nozzles; a nozzle bottom plate connected with said nozzle adjustment base adjustably. The nozzle seamless splice mechanism of the present invention has a low cost, high adjustment efficiency, and achieves digitized adjustment.

Abstract: Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.

Abstract: A component mounting line includes a component mounting apparatus and a board distributing apparatus. The component mounting apparatus includes two transport lanes, each having a carry-in area where a board is carried and a mounting area where a component is mounted onto the board received from the carry-in area. The board distributing apparatus distributes the board to any one of the two transport lanes. The board distributing apparatus distributes the board to any one of the two transport lanes based on a presence or absence of boards in the carry-in area and the mounting area.

Abstract: A method for repairing or servicing a wye ring of a generator includes the steps of, dismantling the generator to gain access to the wye ring, determining a fault location in the wye ring; and attaching a patch to the wye ring in an area of the fault location. The patch provides an electrical path around the fault location so that the generator is repaired.

Abstract: An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %.

Abstract: A method of stranded electrical wire connection involves stripping the insulation of the ends of stranded wire and inserting a compression member over the ends of the wire, and applying constant, irreversible ratcheting pressure to the compression member to compress the compression member over each end of the stranded wires. The compressed stranded wires and compression member are then inserted into a tube connector which is filled with a dielectric gel. The tube connector has a cover with a snap connector member. When the compressed wire connection is fully encased within the connector tube, the cover is closed over the top of the connector tube and snapped and locked shut, to ensure for a waterproof electrical connection.

Abstract: An electrode joining apparatus for joining a first electrode and a second electrode includes an electrode holder configured to receive the first electrode and a torque device positioned above the electrode holder. The torque device is configured to engage and rotate the second electrode relative to the first electrode. A lift is disposed on the apparatus to move the torque device relative to the electrode holder. In some embodiments, the lift includes a mechanism such as a powered actuator operable to raise the torque device above the electrode holder. In additional embodiments, the lift includes a carriage that is vertically moveable relative to the electrode holder, and the torque device is attached to the carriage.

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract: A coil installation method for installing a coil on a tooth of a stator core to manufacture a stator for a rotary electric machine, the coil installation method including forming the coil such that a rectangular wire is wound into a generally quadrangular shape so as to form three or more winding portions overlapping in a radial direction of the stator core and such that the winding portion positioned on an outer peripheral side in the radial direction has a larger width directed in a circumferential direction of the stator core.

Abstract: The invention relates to a method of manufacturing a rotor for performing a magnetizing process of magnetizing a plurality of magnet materials that are assembled in a rotor core. A magnetization device is used which has a coil group configured of a plurality of coils that are disposed side by side in a manner that winding directions of adjacent coils are opposite to each other, the coil group is configured of sub coils at both ends and two or more main coils between the sub coils, and all of the coils are connected in series. Further, in the magnetizing process, a partial magnetization of magnetizing the magnet material among the plurality of magnet materials to which magnetic flux interlinking with two adjacent main coils is applied is performed a plurality of times, so as to magnetize all the plurality of magnet materials.

Abstract: A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.

Abstract: According to an embodiment, a method includes receiving a magnetic device design comprising a magnetic structure to be formed, at least in part, from a magnetic material matrix, wherein the magnetic material matrix is configured to be used in at least one of a magnetic materials additive manufacturing system (MMAMS) and a magnetic materials bulk extrusion system (MMBES); receiving the magnetic material matrix by at least one of the MMAMS and the MMBES; and dispensing the magnetic material matrix using at least one of the MMAMS and the MMBES to form the magnetic structure.

Abstract: Electronic sticker technology that enables assembly of circuits at ambient temperature without the use of any special tools.

Abstract: The present disclosure provides a method and device for removing an integrated circuit. The device is used to remove the integrated circuit from a display panel. The device includes a heating unit configured to contact and heat the display panel, and a retractable clamping-taking component configured to clamp and take the integrated circuit on the display panel which has been heated. According to embodiments of the present disclosure, the method and device may remove the integrated circuit from the display panel without destroying the display panel and increase efficiency of removing the integrated circuit.

Abstract: An optrode may provide a cylindrical substrate two or more electrodes deposited said cylindrical substrate. The cylindrical substrate and electrodes may be coated by an insulating layer with openings or vias over certain portions of the electrodes that may provide a contact for the neural probe or may be utilized to connect lead lines. Manufacturing of an optrode may utilize a jig that secures a cylindrical substrate coated by a conductive material and a resist. A first mask may be positioned in an opening provided by the jig, and the cylindrical substrate may be exposed ions or neutral particles to define one or more electrode patterns. After regions of the resist and conductive material are removed to form the electrodes, a second mask may be utilized to define vias regions in which portions of the electrodes are exposed and uncoated by an insulating layer.

Abstract: A method for manufacturing a thin film chip resistor device includes the steps of: disposing a magnetic fixing member on a first surface of a substrate, and disposing a magnetic shadow mask on a second surface of the substrate opposite to the first surface, such that the magnetic shadow mask detachably and fixedly contacts the second surface of the substrate by virtue of an attractive magnetic force between the magnetic fixing member and the magnetic shadow mask; and depositing at least one resistor unit on the second surface of the substrate with the use of the magnetic shadow mask, the resistor unit including two separated first electrode elements and a resistor element that electrically interconnects the first electrode elements.

Abstract: A circuit board includes a dielectric layer, a first circuit layer, a second circuit layer and at least an electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located outsides the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths thereof gradually decreasing along the extension direction. A method for manufacturing the circuit board is also provided.