Patents Examined by Carl Arbes
  • Patent number: 9985406
    Abstract: A system for assisting in the assembly of a cable harness may include a wire insertion apparatus that includes a frame that defines a connector mounting location; a projector mount attached to the frame and positioned so that a projector held in the projector mount projects graphical information onto a connector held by the mounting location; and the projector. The system may also include a computer device in communication with the projector and comprising a module configured for: projecting, via the projector, a plurality of alignment dots onto the connector; moving the alignment dots based on a first user input; receiving a second user input that the alignment dots are aligned and, based on the second user input, determining a position and orientation of the connector; and illuminating, via the projector, one or more pin locations of the connector based on the position and orientation of the connector.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: May 29, 2018
    Assignee: The Boeing Company
    Inventors: James R. Crocco, Stephen Doyle, Frederick C. Edman, Jason Gerald DeStories
  • Patent number: 9986651
    Abstract: Methods and mechanisms for mitigating attenuation in a printed circuit board connection may include selecting the relative permittivities of resin layers proximate to the connection to control connection frequency resonances such that the attenuation of signals in the connection due to frequency resonance is mitigated.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: May 29, 2018
    Assignee: DELL PRODUCTS, LP
    Inventors: Bhyrav Mutnury, Sanjay Kumar, Vijendera Kumar, Jaya Gowri Anand Burji, Mallikarjun Goud Vasa
  • Patent number: 9980419
    Abstract: The pressure of a gas supplied to a nozzle is stably controlled over a wide range. A first positive pressure supply pathway supplies the gas at a first positive pressure. A second positive pressure supply pathway supplies the gas at a second positive pressure that is lower than the first positive pressure. A nozzle connecting pathway is connected to the nozzle. A switch-over valve selectively switches between a first connected state in which the first positive pressure supply pathway is connected to the nozzle connecting pathway and a second connected state in which the second positive pressure supply pathway is connected to the nozzle connecting pathway. A valve controller controls the connected state of the switch-over valve and adjusts the pressure of the gas supplied to the nozzle within the range from the first positive pressure to the second positive pressure.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 22, 2018
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Tomoyasu Arai
  • Patent number: 9974220
    Abstract: A fitting system includes a plurality of fitting lines for fitting printed circuit boards with electronic components. A method for allocating printed circuit boards to the fitting lines includes determining requirements for fitting each of a plurality of printed circuit boards with components with which the plurality of printed circuit boards are to be fitted, determining an amount of printed circuit boards of which the component variances exceed a predetermined value, each component variance representing the number of different components with which a printed circuit board is to be fitted, and allocating the printed circuit boards to the fitting lines under the predetermined conditions via integral linear programming, such that the printed circuit boards of the amount are distributed as uniformly as possible over the fitting lines.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: May 15, 2018
    Assignee: Siemens Aktiengesellschaft
    Inventors: Daniel Craiovan, Norbert Herold, Thorsten Kemper, Alexander Pfaffinger, Christian Royer
  • Patent number: 9972345
    Abstract: A method includes depositing a layer of pole material on a substrate. The layer of pole material has a bottom surface that is adjacent to the substrate and a top surface that is opposite the bottom surface. A masking material is deposited over a portion of the top surface. Material from the pole material unprotected by the masking material is removed to form a write pole having first and second side walls. At least a portion of a trench formed by removal of the material from the layer of pole material is filled with a sacrificial material. The mask and a portion of the write pole at the top surface are removed to form a beveled trailing edge surface. The sacrificial material is then removed. Front shield gap material is deposited over the beveled trailing edge surface and over portions of the side walls.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: May 15, 2018
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Wei Tian, Hauqing Yin, Lei Lu, Yong Luo, Joseph Mundenar
  • Patent number: 9972981
    Abstract: A device for servicing live power lines, including: a main body, two primary mechanical arms, two telescopic arms, a terminal device, an auxiliary mechanical arm, and a monitoring system. A travelling wheel mechanism, an equipotential wheel, and a first clamping jaw are disposed on the upper end of each telescopic arm. The two primary mechanical arms are symmetrically disposed on two sides of the main body, respectively. The two telescopic arms are vertically disposed on two ends of the main body, respectively, and are capable of telescoping upward and downward. The auxiliary mechanical arm is disposed and adapted to move transversely on the main body. The main body is driven by the travelling wheel mechanism to travel on the high voltage transmission line. The first clamping jaw clamps the high voltage transmission line for locating the main body.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 15, 2018
    Assignees: Hunan Electric Power Corporation, The Live Working Center of Hunan Electric Power Corporation, State Grid Corporation of China
    Inventors: Xiaqing Liu, Dehua Zou, Yu Yan, Wen Li, Naicheng Ou, Jianjun Zhang, Liuxin Wu, Hui Li, Yang Long
  • Patent number: 9968019
    Abstract: A component feeding device transports a tape (a component feeding tape) in which electronic components are stored with some transportation device, and exposes the components. Transportation of the component feeding tape may be performed by fitting a sprocket with a feed hole of the component feeding tape. It has been found that sprocket does not necessarily fit with the feed hole of the component feeding tape. It has been found that this phenomenon takes place in a case of driving at least two or more sprockets with a driving device. When the sprocket does not fit with the feed hole, transportation of the tape is not correctly performed, but exerts an undesirable influence such as reduction of mounting efficiency on feeding of the components and subsequent mounting of the components. One feature resides in rendering a backlash of an upstream-side sprocket larger than a backlash of a downstream-side sprocket.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: May 8, 2018
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Akito Tanokuchi, Tsutomu Yanagida, Kazuyoshi Ohyama, Yoshinori Kano
  • Patent number: 9965998
    Abstract: A method for forming an electronic label including using laser imaging to form a pattern of conductive lines on a conductive film, thereby forming a patterned conductive layer. A phosphorescent layer and a dielectric layer are added over the patterned conductive layer. A conductive trace layer is printed over the dielectric layer using a conductive ink including a pattern of conductive traces that overlap with the conductive lines of the patterned conductive layer to form an electric grid in a display area. One or more electronic components and a power source are added that are adapted to supply power and control signals to the electric grid.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: May 8, 2018
    Assignee: EASTMAN KODAK COMPANY
    Inventor: Dan Kalati
  • Patent number: 9960503
    Abstract: A method of stranded electrical wire connection involves inserting stripped, stranded ends of the wires into and then out of open container housing. A dielectric gel filled canister having an open bottom is placed over the electrical wires and the container housing, thereby completely encasing the wires. The canister is then snapped onto or otherwise secured over the container housing, to seal the electrical wires, thus completing the sealed, waterproof electrical connection.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: May 1, 2018
    Inventor: Jeremy Sviben
  • Patent number: 9961780
    Abstract: A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: May 1, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hirofumi Shinagawa, Shigeru Tago, Masaki Kawata, Yuki Ito
  • Patent number: 9961816
    Abstract: A mounting device, which receives electronic circuit components from component supply devices, and mounts the components onto a substrate which is carried into a work region by a substrate conveyance device. The mounting device includes (a) a plurality of articulated robots, which include an arm section that includes a plurality of link members, which are connected so as to be relatively rotatable with respect to one another at a plurality of joints, and a hand that is attached to a free end section of the arm section so as to be relatively rotatable, and (b) a robot guide rail that supports base end sections of the articulated robots in a manner in which the articulated robots are capable of moving in a direction that is parallel to a conveyance direction, and the hand holds a rotating head, which holds a plurality of suction nozzles.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: May 1, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Masatoshi Fujita, Seigo Kodama
  • Patent number: 9955620
    Abstract: The invention concerns a fitting line which is arranged to fit printed circuit boards with electronic components. A method for determining equipment families for the fitting line comprises the following steps: initial forming of a number of equipment families, each having allocated printed circuit boards; selecting of one of the equipment families; and distributing of the printed circuit boards of the selected equipment family to the other equipment families by means of integral linear programming.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: April 24, 2018
    Assignee: Siemens Aktiengesellschaft
    Inventor: Christian Royer
  • Patent number: 9954423
    Abstract: A method of manufacturing a rotor according to the present invention includes: a process of stacking a plurality of electromagnetic steel plates on a jig 30 to fix the electromagnetic steel plates to the jig 30, and a process of inserting magnets 21 into a plurality of respective openings 11 included in a rotor core 10 in which the plurality of electromagnetic steel plates are stacked on one another. The magnets 21 are inserted into the respective openings 11 while a structure 80 including the rotor core 10 and the jig 30 is vibrated at a resonance frequency of the structure 80.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: April 24, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akira Yoshida, Hirotaka Kawaura
  • Patent number: 9953844
    Abstract: When a plating layer is formed on through holes in semiconductor packages, first and second stacked bodies are stacked with first and second cavities formed in the first and second stacked bodies facing the inner side and are bonded together by applying adhesive to peripheral regions so that the cavities of the first and second stacked bodies form sealed spaces, and the through holes are formed such that part of the first and second stacked bodies including the bonding surface remains. Then, the through holes are plated to form the plating layer, the peripheral regions are removed as cutting allowances, i.e., removal regions, and the first and second stacked bodies are divided into a plurality of pieces along dicing lines to form semiconductor packages.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: April 24, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masanori Nimura, Shigenori Takeda, Yoshinao Tatei, Ikio Sugiura
  • Patent number: 9949419
    Abstract: A linear motion device includes: a linear motion mechanism having: a beam elongated in one horizontal direction; a guide member disposed in the beam to extend in the one direction; a moving member disposed to be movable along the guide member; and a moving mechanism that moves the moving member. The beam includes a metallic tubular body formed with an opening portion penetrating the metallic tubular body in the one direction and a tubular reinforcing portion formed of a carbon fiber reinforced plastic and formed in close contact with an inner surface of the metallic tubular body.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: April 17, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Tatsuya Sano
  • Patent number: 9945892
    Abstract: An illustrative wire processing machine includes at least one blade configured for at least one of cutting a conductor or at least piercing an insulation layer on the conductor. At least one gripper assembly includes a gripper configured to at least temporarily grasp a portion of a conductor during a wire processing operation. A generator, which is part of the gripper assembly, is configured to radiate a field toward a conductor. The gripper assembly also includes a detector that is configured to detect at least some of the field propagated along the conductor. A processor is configured to determine when a change in the propagated field detected by the detector indicates contact between a conductor and the blade.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: April 17, 2018
    Assignee: OES, INC.
    Inventors: Kiet Ngo, Michael Reeve
  • Patent number: 9939682
    Abstract: Methods are provided for making layers with nano- and micro-patterned topographies by laser action or inkjet printing on a first surface. These topographies have a periodicity of 5 nm to 500 ?m in a first direction in the plane of the first surface. These layers can be used as anisotropically patterned alignment layers in electro-optical devices and generate an orientational order of at least 0.30.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: April 10, 2018
    Assignee: e-Vision, LLC
    Inventors: Anita Trajkovska-Broach, David Boyd, Dan Chambers, Joseph O. Branham
  • Patent number: 9931742
    Abstract: An embodiment of the present invention provides a jig for detaching a display assembly. The display assembly comprises: a fixing module configured to fix a backlight module in the display assembly; and an absorbing module configured to absorb a display panel in the display assembly such that the display panel and the backlight module are separated from each other by an external force.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: April 3, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Gang Wang, Xinqing Zhu, Guangyuan Cai, Jianlei Yang, Yu Zhang, Ningheng Du
  • Patent number: 9929628
    Abstract: A magnet insertion method into a rotor core is to insert an assembly into a magnet insertion hole provided in the rotor core of an electric motor, the assembly being formed by laminating a plurality of members, including at least a plurality of magnet pieces, in a line. According to this magnet insertion method, the assembly is formed by arranging a front member, having a surface surrounded by a chamfered ridge line, to cause the surface to be a front side end surface upon insertion, by laminating, on its rear side in an insertion direction, other members, without having the chamfered ridge line, in a line along the insertion direction to cause the other members to be hidden inside a projection of the front member when being projected from an insertion hole side, and by temporarily holding the front member and the other members.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: March 27, 2018
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Takumi Ohshima, Kiyoshi Hasegawa, Takashi Sekikawa, Yasushi Matsushita, Akihisa Hori, Michito Kishi, Hiroaki Shibukawa
  • Patent number: 9930790
    Abstract: In a method for manufacturing a multilayer substrate for having a BGA-type component thereon, a conductive through hole for restricting a signal interference and a resist film are formed on the multilayer substrate, an occurrence of a fault caused by a residual of a resist in the conductive through hole is reduced. In the method for manufacturing the multilayer substrate for having the BGA-type component thereon, a step of forming the resist film includes an applying step of applying a photosensitive resist to an entirety of a front surface portion of a base. The applying step is performed while restricting the resist from entering the conductive through hole by supplying a high pressure air to a rear surface of the base to pass through the conductive through hole using an air supply mechanism.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: March 27, 2018
    Assignee: DENSO CORPORATION
    Inventors: Hirokazu Saitoh, Ichiro Yoshida