Abstract: A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circular arc that has an apex at the above-described predetermined height, thus forming (minute) cracks in a portion between the tail wire and a bonding end of a bonding point, and then cutting of a tail wire sticking out of the tip end of the capillary is executed by way of raising the capillary and clamper.

Abstract: In an ultrasonic joining method for joining a flange portion of a first member to a portion of a second member, a first horn and a second horn are arranged on the flange portion on a side opposite to the second member, and the first horn is vibrated in a condition that the second horn is biased against the first horn and the first horn and the second horn are pressed against the flange portion such that the flange portion is vibrated while being pressed against the portion of the second member. Because the first horn is vibrated in a condition that the first horn and the second horn are pressed against each other at press-contact portions thereof, vibration of the first horn is transferred to the second horn through the press-contact portions.

Abstract: A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.

Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.

Abstract: A linear friction welding head apparatus for dual axis forging, the apparatus including three sets of orthogonal actuators for providing X-, Y-, and Z-planes of apparatus movement for providing Y-axis oscillation, a first forge load along a first forge axis, and a second forge load along a second forge axis. A method for dual axis forging for welding including providing a welding head for applying first and second forge loads along X- and Z-forge axes to weld at more than one interface. The forge loads may be applied at right angles to each other and have magnitudes corresponding to weld interface length.

Abstract: A method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device is provided. A flat plate having a plurality of projections or recesses thereon is prepared; the flat plate is aligned to oppose an electronic component and a resin composition including a solder powder is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals, so as to form solder bumps on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps. Thus, the solder bumps having pits corresponding to the projections or having protrusions corresponding to the recesses are formed.

Abstract: A method of making a carbon nanotube reinforced solder cap. Carbon nanotube-solder (CNT-S) particles are transferred from a transfer substrate, having an adhesive layer, to a solder bump by using thermo compression bonding. The CNT-S particles are then reflowed to form a cap on the solder bump. The solder bump with the reflowed cap can then be joined to a bonding pad or another solder bump with a cap by placing the solder bump on the pad or other bump and reflowing at a temperature sufficient to reflow the cap(s).

Abstract: There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface of the inner cylinder are opened; a sieve provided in the inner cylinder, wherein the inner cylinder is partitioned into an upper space and a lower space by the sieve; an inlet port for supplying an air from an outside to the lower space of the inner cylinder; a mask provided to a lower end of the outer frame and having openings, the openings being provided to correspond to conductive ball mounting positions; and an exhaust port for exhausting an air from an upper surface of the mask to the outside and being provided to the lower end of the outer frame, wherein the inner cylinder is adapted to vibrate without being restricted by the outer frame.

Abstract: An anchor for use interior of a carbon steel vessel, the anchor comprising a carbon steel anchor element and a carbon steel base, the anchor allowing welding of the base to the wall of the vessel without release of hexavalent chromium during installation. A method for installing a stainless steel anchor element to the interior wall of a carbon steel vessel, comprising welding the stainless steel anchor element to a carbon steel base in a ventilated environment exterior of the vessel interior and subsequently welding the carbon steel base to the vessel wall interior of the vessel.

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Abstract: While fabricating a packaged semiconductor chip, a wire is bonded on a chip contact pad using a wire bonding machine. A bond head of the wire bonding machine is moved relative to the chip contact pad, thereby pulling a first length of the wire out of the wire bonding machine. Part of the wire passes through a space between a first outer edge of a first bearing race and a second outer edge of a second bearing race during the pulling of the first length. The wire is bonded on a lead. A first piezoelectric element is energized in the bond head, thereby causing it to expand and press against the first bearing race, which brakes the first bearing race and brakes the wire between the first and second races. The bond head is moved relative to the lead during the braking and severs the wire proximate to the lead.

Abstract: An apparatus and method for automatically controlling a clamp gap between clamping arms of a wire clamp is provided wherein a motor generates an actuation force for moving the clamping arms relative to each other. A resilient member is positioned such that the actuation force acts upon and flexes the resilient member to an extent that is proportional to the clamp gap, and the clamp gap is controlled by adjusting the amount of actuation force according to a predetermined relationship between the actuation force and the clamp gap.

Abstract: An arrangement for the welding of cables by means of an ultrasonic welding device with a compression chamber for housing the cables defined by at least sections of a sonotrode transmitting ultrasonic vibrations, a counter electrode and lateral defining elements. In order to guarantee a desired layout for the cables, the components are installed in an insertion space, before closing the compression chamber, the width of which is less than that of the open compression chamber.

Abstract: An ultrasonic welding method and an ultrasonic welding device are provided to join a first member having a substantial pipe shape and a second member at a joining surface by pressure-applying and vibration-exciting. In an arranging process, each of a first horn member and a second horn member is slantways arranged in such a manner that a part of a pressure-applying surface thereof which is nearer to a division surface thereof becomes nearer to the joining surface, according to deformation in a joining process. Thus, in the joining process, the pressure-applying surfaces are disposed substantially parallel to the joining surface due to a pressure-applying reaction force, so that the first horn member and the second horn member can be pressed against each other at the division surfaces thereof.

Abstract: A method and apparatus are disclosed for placing solder spheres on electronic receiving pads of a ball grid array (BGA) component package, such as by a BGA solder sphere placement apparatus. The solder spheres are held to a pattern of solder sphere apertures in a foil and against a solder sphere backing rib of a second layer by a vacuum holding force. After locating the solder spheres to receiving pads of a BGA component package, the system removes the holding force and the solder spheres are then released and placed on the receiving pads. Optionally, the apparatus can ensure release of the solder spheres as well as seating the solder spheres onto the receiving pads by applying a tapping or vibrational force.

Abstract: An ultrasonic welder includes a housing having an ultrasonic transducer, a horn mounted to one end of the housing, a motor having a shaft, and a mounting assembly having a fastener such as a threaded screw. One screw end is coupled to the motor shaft to rotate as the motor shaft is being driven. The other screw end extends into a threaded screw receiver running within the housing. Upon rotating in one direction, the screw engages more threads of the screw receiver such that the housing with the horn move upward. Upon rotating in the other direction, the screw engages less threads of the screw receiver such that the housing with the horn moves downward. A linear transducer extends from the mounting assembly into the housing to monitor the horn position. A pair of guide shafts extend from the mounting assembly into the housing to stabilize the horn positioning.

Abstract: A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.

Abstract: A method by which low melting point solder for reflow connection of components is formed on select fine and coarse pitch contacts of a printed circuit board simultaneously. A template with openings to select fine pitch circuit board contacts is placed in contact with fine pitch contacts. The fine and coarse pitch contacts of the board are exposed through holes in a stencil characterized in its ability to withstand solder reflow temperatures, not be wettable by solder, and have a coefficient of thermal expansion relatively matching the printed circuit board. Low temperature solder paste is screen deposited into the stencil openings. The stencil is removed and a mesh is fixedly positioned on the board, the solder paste retained by the stencil pattern is reflowed to selectively form on the underlying contacts of the printed circuit board.

Abstract: The invention herein relates to a kind of integrated circuit solder ball implant machine that is mainly comprised of a machine base, a solder ball implant device, a solder ball loading device, an integrated circuit component positioning device and an integrated circuit mold ejection device, the innovations of which includes the utilization of the aforesaid integrated circuit component positioning device that reciprocates leftward and rightward at the lower extent of the solder ball implant device as well as the aforesaid solder ball loading device that is vibrated forward and backward to directly transport the solder balls through the feed holes of the solder ball implant device such that each of the solder balls are reliably, accurately, soundly and expeditiously carried and positioned onto integrated circuit component in the integrated circuit component positioning device.