Abstract: In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt. % or a Zn content of the Zn series alloy layer is 90 to 100 wt. %. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, a high connection reliability can be achieved when an Al series alloy layer is left after the connection, since the soft Al thereof functions as a stress buffer material.

Abstract: A reflow oven chamber assembly includes a housing disposed within a reflow oven chamber, heating elements disposed in the housing, and compression box assemblies disposed in the housing. The compression box assembly includes a compression box housing having an intake port located adjacent the heating element, an intake duct disposed in the compression box, and a diffuser plate disposed above the intake duct. The intake duct has an inlet opening in fluid communication with the intake port of the compression box housing and an outlet opening. The compression box assembly draws heated air into the compression box housing from the reflow oven chamber through the intake port and into the inlet opening of the intake duct and exhaust air out of the outlet opening of the intake duct to the diffuser plate. A method of distributing heated air within a reflow soldering oven is further disclosed.

Abstract: Disclosed herein is a mask frame apparatus capable of forming a bump having a micro-pitch without performing the manufacturing and the operation controlling of a separate head apparatus and preventing the reduction of a mounting speed of solder balls due to the repetition of an operation of separately recovering the solder balls after they are mounted on a mask. A mask frame apparatus for mounting solder balls includes: an outer circumferential mask frame configured to supply solder balls and having a hollow type duct shape; and an inner mask duct having a duct shape and positioned over the inside of a circumference of the outer circumferential mask frame so as to be in communication with the outer circumferential mask frame, and including a plurality of mask openings formed in a duct shape bottom surface so that the solder balls introduced through the hollow type outer circumferential mask frame are mounted on a substrate by the flow of air.

Abstract: A method of determining the quality of a friction weld between two components, the method comprising joining two components together using a friction welding process, measuring the loss of length of the components as a function of time during the friction welding process, determining the double differential with respect to time of the loss in length of the components as a function of time, determining the quality of the friction weld by calculating the R2 value of the linear fit to the loss in length of the components as a function of time over a defined time period, determining the end of the defined time period by identifying the start of the final positive peak of the double differential with respect to time of the loss of length of the components as a function of time, calculating R2 from the least square difference of the linear fit over the defined time period of the loss of length of the components as a function of time and comparing the calculated value of R2 with acceptable values of R2 to determine

Abstract: A weld enclosure and welding apparatus including a weld enclosure. Also a method of welding. The apparatus has first and second opposed tooling faces adapted to receive and hold respective first and second weld elements. The weld enclosure comprises a housing that allows relative movement between the weld elements and a change in a physical dimension of at least one of the weld elements. The weld enclosure also comprises locating means for locating the housing relative to the welding apparatus and includes heating means.

Abstract: A method for connecting a conducting wire to an electric heating film is provided. The method includes: first, opening a groove on an electric heating film carrier; then, placing one end of a connecting wire in the groove; afterwards, pouring a conductive adhesive into the groove; and finally, heating the electric heating film carrier, so that the electric heating film carrier is just melted and the connecting wire and the conductive adhesive are merged into a whole; and cooling the electric heating film carrier, and solidifying the conductive adhesive. The electric heating film carrier is made of various dielectric materials such as glass, ceramics, enamel, mica, quartz, and microcrystalline glass. Two sides of the electric heating film carrier are coated with layered electrodes, and the layered electrodes are connected in series to the electric heating film. The groove is disposed in the middle of the layered electrode, and the groove is an annular groove. The connecting wire is a pure silver wire.

Abstract: A method is taught for creating a hollow sphere that is created by joining two cylinders together that have a semispherical hollow formed in the ends being joined together, wherein a metallic reinforcing disk is inserted at an interface between the two ends of the cylinders, wherein the two cylinders and reinforcing disk are joined using friction stir welding to create an inner sphere from the two hemispherical hollows that is bisected by the metallic reinforcing disk, and wherein the joined cylinders and reinforcing disk are machined to thereby create an outer spherical surface that is centered around the inner sphere.

Abstract: A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b).

Abstract: A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.

Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by soldering.

Abstract: Provided is a structure for joining members applicable even to different members. Included are first and second plate-like members 1 and 2 to be joined which are stacked one on the other for face-to-face contact and formed with respective, mutually contiguous holes 3 and 4, a fastening member 5 formed with a threaded hole 20 contiguous with the holes 3 and 4 of the members 1 and 2 and abutting on the member 1 on a side away from the member 2 and an auxiliary member 7 inserted into the holes 20, 3 and 4 of the members 5, 1 and 2. Due to frictional heat and plastic flow, material derived from the member 7 is adapted to enter into a threaded groove on an inner periphery of the hole 20 of the member 5 and cover a circumference of the hole 4 of the member 2 so as to join the members 1 and 2 together.

Abstract: The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet lamp placed at an irradiation position between the positioned electronic component and circuit board. In such a joining apparatus, ultraviolet irradiation to Au bumps of the electronic component and ultraviolet irradiation to board electrodes of the circuit board are performed concurrently by the excimer ultraviolet lamp to execute a cleaning process of the two metallic portions. Thereafter, ultrasonic vibrations are imparted to the two metallic portions while those metallic portions are kept in contact with each other, by which metal joining between the two metallic portions is fulfilled.

Abstract: The present invention relates to a method of brazing two materials (1, 2) together using a filler metal (3), which comprises the following steps: the filler metal is placed between the two contacting materials in a brazing zone where they are intended to be joined; on at least one of the two materials, which is mounted so as to move, a stress force is exerted along each of the directions of expansion provided for the two materials; the assembly in the brazing zone is brought to what is called a brazing temperature, which is both above the melting point of the filler metal and below the melting point of each of the two materials; during the temperature rise, the forces exerted on the materials to be assembled are gradually reduced as said materials expand, so that there is substantially no longer a force exerted on the materials when the brazing temperature is reached; and, once the filler metal has melted and wetted each material to be assembled, the assembly is cooled so as to solidify the filler metal, whic

Abstract: A work station including hide away doors is presented. The work station includes a frame defining a work area, a front door assembly movable within the frame and a front door assembly track disposed within the frame, the front door assembly movable along the front door assembly track. A drive mechanism is disposed along the frame, the drive mechanism in mechanical communication with the front door assembly, the drive mechanism operable to position the front door assembly in a plurality of positions along the front door assembly track. The front door assembly is capable of being positioned beneath a device within the work area thereby allowing full frontal access to the device within the work area and full overhead access to the device within the work area.

Abstract: Methods and apparatus are provided for solder bonding entities to solid materials. One or more through apertures are formed in a solid material. Solder paste is introduced into each through aperture. Respective entities having solderable surface features are disposed in overlying alignment with the through apertures. The arrangement is heated causing molten solder paste to wet the solderable surface features and the solid material. Cooling results in the electrical and mechanical bonding of the entities to the solid material. Devices having substantially planar form factors and without lead wires can be electrically and mechanically secured to a supporting conductive stratum.

Abstract: A reflow oven chamber assembly that is configured to be installed within a reflow oven chamber of a reflow oven includes a chamber housing disposed within the reflow oven chamber, one or more heating elements disposed in the chamber housing, and one or more compression box assemblies disposed in the chamber housing. The compression box assembly includes a compression box housing having an intake port located adjacent the heating element, an intake duct disposed in the compression box, and a diffuser plate disposed above the intake duct. The intake duct has an inlet opening in fluid communication with the intake port of the compression box housing and an outlet opening. The compression box assembly is configured to draw heated air into the compression box housing from the reflow oven chamber through the intake port and into the inlet opening of the intake duct and exhaust air out of the outlet opening of the intake duct to the diffuser plate.

Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

Abstract: A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.