Patents Examined by Carlos J. Gamino
-
Patent number: 10919108Abstract: A friction stir spot welding device which welds an object to be welded, by softening the object by friction heat and by stirring the object, has a tool with a cylindrical shape, the tool being rotatable around an axis thereof, advanceable along a direction of the axis, and retractable along the direction of the axis, a temperature detector which detects a temperature of the tool when a welding step for the object starts, and a controller configured to compare the temperature of the tool which is detected by the temperature detector to a predetermined reference temperature to set a plunging force applied by the tool to press the object.Type: GrantFiled: September 13, 2016Date of Patent: February 16, 2021Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHAInventors: Hideki Okada, Shuhei Yoshikawa, Kenichi Kamimuki
-
Patent number: 10919106Abstract: A method of making an annular component includes forming sheet feedstock into an annular shape disposed about a central axis; and bonding one portion of the feedstock to another portion of the feedstock using ultrasonic welding, so as to fix the annular shape.Type: GrantFiled: June 9, 2017Date of Patent: February 16, 2021Assignee: General Electric CompanyInventor: Todd Jay Rockstroh
-
Patent number: 10889067Abstract: A manufacturing system includes a tension-wound system having a feedstock system and a shape fixture. The tension-wound system is configured to feed a feedstock from the feedstock system and to wind the feedstock under tension in successive layers around the shape fixture to allow the feedstock to form a component having a shape represented by the shape fixture. The manufacturing system includes a solid-state joining tool configured to additively join the successive layers of the feedstock. In a spiral tension-winding process, with a continuously-fed strip of aluminum feedstock around a piece of tooling, the feedstock can be friction stir welded and additively joined in successive layers to produce a large, near-net structure.Type: GrantFiled: April 11, 2016Date of Patent: January 12, 2021Assignee: LOCKHEED MARTIN CORPORATIONInventors: Michael R. Eller, Randy J. Brown
-
Patent number: 10881007Abstract: Methods for refurbishing a circuitry device are disclosed. The methods described herein include applying a first flux to solder contacts connecting a first member of a circuitry device to a second member of the circuitry device; performing a first setting process on the circuitry device with the first flux; applying a second flux to the solder contacts of the circuitry device; performing a second setting process on the circuitry device; and reflowing the solder contacts.Type: GrantFiled: October 4, 2017Date of Patent: December 29, 2020Assignee: International Business Machines CorporationInventors: Tim A. Bartsch, James D. Bielick, David J. Braun, Jennifer I. Bennett, Timothy P. Younger
-
Patent number: 10864597Abstract: An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 ?m or less.Type: GrantFiled: January 11, 2016Date of Patent: December 15, 2020Assignee: Toshiba Mitsubishi-Electric Industrial Systems CorporationInventors: Akio Yoshida, Masahisa Kogura
-
Patent number: 10859189Abstract: A method for joining two components, of which at least one is tubular in shape, more preferably of an exhaust system of an internal combustion engine. The joint can be produced in an easier manner with high quality if a ring-shaped joining element having an outer cone on at least one axial side with its outer cone is axially pressed into an axial end section of the one tubular component, as a result of which the end section of the one component widens along the outer cone when on its axial end of the widened end section and on the joining element a circumferential weld seam is produced and when the other component on an axial end section is joined with the joining element.Type: GrantFiled: September 24, 2009Date of Patent: December 8, 2020Assignee: EBERSPAECHER EXHAUST TECHNOLOGY GMBH & CO. KGInventor: Georg Wirth
-
Patent number: 10843284Abstract: The invention relates to a process to connect, by soldering, at least one electronic component (104, 204, 304, 404, 504) with a mounting plate (100, 200, 300, 400, 500), the mounting plate having at least one mounting plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component having at least one component contact surface (105) corresponding to it, the at least one mounting plate contact surface being surrounded by a solder resist layer (101, 201, 301, 401, 501) that borders the at least one mounting plate contact surface, the process having the following steps: a) Applying solder paste (106, 206, 306, 406, 506) onto at least areas of the solder resist layer (101, 201, 301, 401, 501), minimally overlapping with the mounting plate contact surface (102, 202, 302, 402, 502) adjacent to the solder resist layer, b) Equipping the mounting plate with the at least one electronic component (104, 204, 304, 404, 504), the at least one component contact surface (105) at least partly coveringType: GrantFiled: November 18, 2015Date of Patent: November 24, 2020Assignee: ZKW Group GmbHInventor: Erik Edlinger
-
Patent number: 10834823Abstract: After a copper plate 14 is bonded to at least one surface of a ceramic substrate 10 via an active metal containing brazing filler metal 12 which contains silver, the unnecessary portion of the copper plat 14 and active metal containing brazing filler metal 12 is removed, and thereafter, an unnecessary portion of the copper plate 14 is removed by chemical polishing so as to cause the active metal containing brazing filler metal 12 to protrude from the side face portion of the copper plate 14, and then, a silver layer 18 adhered to the surface of the copper plate 14 by the chemical polishing is removed.Type: GrantFiled: February 8, 2018Date of Patent: November 10, 2020Assignee: Dowa Metaltech Co., Ltd.Inventors: Takashi Ideno, Ayumu Ozaki, Koji Kobayashi
-
Patent number: 10799980Abstract: A tool includes a friction stir welding (FSW) tool, a first body, a second body, and a plurality of biasing elements. The FSW tool has a rotational axis. The first body is rotationally fixed relative to the FSW tool and the second body is rotational fixed relative to the FSW tool. The plurality of biasing elements is positioned longitudinally between at least a portion of the first body and at least a portion of the second body.Type: GrantFiled: September 29, 2017Date of Patent: October 13, 2020Assignee: Mazak CorporationInventors: Scott M. Packer, Rodney Dale Fleck, Russell J. Steel
-
Patent number: 10786878Abstract: A method of welding a component and a treated component are provided. The method comprises an initial heat-treating of the component comprising a substrate. The method further comprises removing a portion of the substrate to form a treatment region comprising an exposed surface. The method further comprises buttering the exposed surface with a first filler additive to form a weld metal adjacent to the fusion line comprising an easy-to-weld alloy. The method further comprises welding the component with the easy-to-weld alloy and a second filler additive. The first filler additive comprises a sufficient amount of each of Co, Cr, Mo, Fe, Al, Ti, Mn, C and Ni to form the easy-to-weld alloy, when welded with the hard-to-weld base alloy.Type: GrantFiled: July 24, 2017Date of Patent: September 29, 2020Assignee: GENERAL ELECTRIC COMPANYInventors: Yan Cui, Srikanth Chandrudu Kottilingam, Brian Lee Tollison
-
Patent number: 10688566Abstract: A method of forming a receiver 130 comprises arranging first structures 120a in a first set 117 and second structures 120b in a second set 119 such that the first structures 120a and the second structures 120b extend within an interior space 136 of the receiver 130 in a direction normal to a longitudinal central axis 112 of the interior space 136. The method further comprises indirectly bonding the first set 117 of the first structures 120a to the second set 119 of the second structures 120b.Type: GrantFiled: April 12, 2018Date of Patent: June 23, 2020Assignee: The Boeing CompanyInventor: Steven Graham Wallace
-
Patent number: 10596664Abstract: A robot according to an embodiment includes a flange, a wrist arm, a forearm, and a feeder. The flange configured so that a welding torch is attached thereto and configured to rotate about a T axis. The wrist arm configured to rotate about a B axis substantially perpendicular to the T axis and configured to support the flange. The forearm configured to support the wrist arm. The feeder attached to a position between a base end and a tip end of the forearm and configured to feed a welding wire.Type: GrantFiled: September 18, 2014Date of Patent: March 24, 2020Assignee: KABUSHIKI KAISHA YASKAWA DENKIInventors: Atsushi Terada, Kazuhiro Yasutomi
-
Patent number: 10586781Abstract: A bonding apparatus 10 having a diagonal optical system 30, the bonding apparatus moves a capillary 24 down to a first heightwise position to calculate a position A11 of a tip end portion of the capillary 24 and a position A12 of a tip end portion of the capillary in an image on an imaging plane of the diagonal optical system 30, and similarly moves the capillary 24 down to a further lower second heightwise position to calculate a position A21 of the tip end portion of the capillary 24 and a position A22 of the tip end portion of the capillary in the image on the imaging plane. The bonding apparatus then estimates the position of the landing point of the capillary 24 on a bonding target 8 based on positional data for the four calculated positions A11, A12, A21, and A22, the first heightwise position, and the second heightwise position. With this, it is possible to use the diagonal optical system in the bonding apparatus to further improve positional accuracy in the bonding process.Type: GrantFiled: December 9, 2016Date of Patent: March 10, 2020Assignee: SHINKAWA LTD.Inventors: Shigeru Hayata, Hiroya Yuzawa, Hiromi Tomiyama
-
Patent number: 10570573Abstract: A welding unit for welding together two rails of a track includes two rail clamping assemblies which can be moved towards one another in a longitudinal direction of the rail along unit guides by compression cylinders. Each rail clamping assembly is equipped with clamping jaws which are displaceable in pairs in a pressing plane and each of which has a contact surface provided for application to a rail web. The clamping jaws are each constructed as clamping levers which are pivotable in the pressing plane about a lever pivot axis. The contact surface intended for application to the rail web is disposed at a first lever end spaced apart from the lever pivot axis. The two contact surfaces of each rail clamping assembly are each positioned closer to the oppositely disposed rail clamping assembly than the two lever pivot axes.Type: GrantFiled: September 7, 2015Date of Patent: February 25, 2020Assignee: Plasser & Theurer Export von Bahnbaumaschinen Gesellschaft m.b.H.Inventor: Heinz Muehlleitner
-
Patent number: 10569355Abstract: A method of operating a linear friction welding system in one embodiment includes positioning a phase change assembly driven by a motor in different configurations to establish different phase relationships between two eccentrically engaged power shafts while one of the power shafts is driven by the motor and the other power shaft is driven by the phase change assembly. In one phase change assembly configuration a ram operably connected to one of two components to be welded does not vibrate when the first power shaft and the second power shaft rotate while in another phase change assembly configuration the ram vibrates. Pressure between the two components is controlled to provide scrub pressure when the ram vibrates and forge pressure when the ram is no longer vibrating.Type: GrantFiled: October 16, 2018Date of Patent: February 25, 2020Assignee: APCI, LLCInventor: Stephen A. Johnson
-
Patent number: 10500661Abstract: Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways.Type: GrantFiled: November 6, 2016Date of Patent: December 10, 2019Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Hannes Martin Hinrich Greve, F. Patrick McCluskey, Shailesh N. Joshi
-
Patent number: 10475763Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.Type: GrantFiled: May 20, 2016Date of Patent: November 12, 2019Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Siu Wing Lau, Kin Yik Hung, Yuk Cheung Au, Wing Chiu Lai, Leo Man Lee, Sai Yuen Go
-
Patent number: 10413993Abstract: A method and system for joining relatively thick (i.e., at least 0.07 inch, or between 0.08 and 0.24 inch) sheets of non-weldable aluminum or other material using multiple passes of ultrasonic joining and multiple plugs to create a single larger sheet. Angles and profiles are machined onto edges of the sheets, the angles are overlapped to form a scarf joint, and ultrasonic joining is performed on both sides of the scarf joint, resulting in channels where the angles and profiles intersect. Plugs are extruded or otherwise created and positioned in the channels, and ultrasonic joining is used to join the plugs in the channels. Additional plugs are added until the last plugs are proud of the surface, and then the plugs are machined until the joint is flush with the surface. The plugs may be of the same or a different material as the sheets.Type: GrantFiled: August 9, 2018Date of Patent: September 17, 2019Assignee: Spirit AeroSystems, Inc.Inventors: Heath Edward Misak, Paul R. Toivonen
-
Patent number: 10381904Abstract: A rotor coil for a revolving armature includes a strand coil that includes a part arranged in a core slot of the rotor and is composed of a plurality of element wires; and a solid coil welded to an end of the strand coil wherein the end of the strand coil and an end of the solid coil are welded by friction stir welding. A manufacturing method of a rotor coil includes the step of performing friction stir welding wherein the friction stir welding is performed for the butt joint with the end of the strand coil arranged in an advancing side defined by a rotation direction of a tool and with the solid coil arranged in a retreating side.Type: GrantFiled: January 13, 2017Date of Patent: August 13, 2019Assignee: Mitsubishi Hitachi Power Systems, Ltd.Inventors: Ryosuke Umezu, Yasuaki Kageyama, Juichi Enyama, Seunghwan Park, Satoshi Hirano
-
Patent number: 10369648Abstract: A guiding board for a ball placement machine has a board body. The board body has a top surface, a bottom surface, a ball-dropping area, and multiple guiding grooves. The ball-dropping area is defined on the top surface. The guiding grooves are defined in the ball-dropping area and are parallel to each other. Each guiding groove has a bottom and multiple ball-dropping holes defined in the bottom and extending through the bottom surface of the board body.Type: GrantFiled: January 13, 2017Date of Patent: August 6, 2019Assignee: HORNG TERNG AUTOMATION CO., LTD.Inventor: Eric Wang