Abstract: An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.

Abstract: A friction stir welding tool with a base, a rotating friction stir slug mounted in the said base and at least one guide member connected to the said base, the welding tool being adapted to move from upstream to downstream; a welding tool having at least one displacement member of the guide member relative to the said base between at least one guiding position in which the guide member extends in a scout area located downstream and facing the friction stir slug and at least one retracted position in which the guide member is offset from the said scout area.

Abstract: A friction stir welding apparatus includes: a rotating shaft, on which a thread for friction stirring is formed; and a drive unit rotatably supporting the rotating shaft. A rotating shoulder configured to rotate together with the rotating shaft to generate frictional heat between the rotating shoulder and back surfaces of workpieces is fixed to a distal end of the rotating shaft. The rotating shoulder is pushed against the back surfaces of the workpieces by a pushing mechanism. A stationary shoulder penetrated by the rotating shaft and configured to hold the workpieces in a sandwiching manner together with the rotating shoulder is non-rotatably mounted to the drive unit or a member connected to the drive unit.

Abstract: A method and a device for improving the quality of the weld seam in friction stir welding is provided. The process of friction stir welding is effected by means of a friction welding tip, in which a spiral conveyor screw is provided in the spindle bearing. The longitudinal axis of the spindle bearing is inclined at an angle to the vertical. The sliding surface of the rotating spindle consists of a flat sliding surface and, for the welding of curved seams, in each case of a sliding surface inclined at an acute angle to the sliding surface, the friction welding tip is designed in the shape of a truncated cone. The lateral surface of the truncated cone is formed by six trapezoidal planar parts, of which three planar parts each uniformly distributed at the circumference lie at an angle of 120 degrees with respect to one another and account for a proportion greater than ? at the circumference.

Abstract: A joining method for forming a joint structure of different materials includes steps of: providing a steel member and a light metal member stacked on each other and to be joined together by friction stir welding in a non-melted state; applying a coating to the steel member; and joining the steel member and the light metal member together by rotatingly pushing a rotation tool into a joint portion of the light metal member with the steel member, generating friction heat and having the joint portion of the light metal member softened and plastically flow under the friction heat.

Abstract: A method of soldering a bumped work without using flux is provided by the steps of vacuum-sucking the bumped work on a head, pressing a bump against a pad of another work, causing a projection of the bump to partially break an oxide film on the solder portion, to pierce it, and to be placed thereon, and cooling and solidifying the molten solder portion. The surface of the solder portion is coated by the oxide film as a hard shell, so that, even if the bump is firmly pressed against the solder portion, the solder of the solder portion does not flow sidewise, and a solder bridge is not produced.

Abstract: A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor.

Abstract: A linear friction welding oscillator consists of a plurality of individual linear oscillators which are ganged together so as to operate in unison. The total force exerted by the composite oscillator is thus the sum of the output forces of the individual oscillators. The individual oscillators produce variable amplitude, linear reciprocation of an output ram by converting rotary motion into linear motion using conversion/coupling means such as a swash plate connected by a bending elements to drive a crank. Each of the individual oscillator cranks is rotatably engaged with the output ram so as to transmit to it axial, reciprocal movement due to the angular alignment of the swash plate axis with the ram. All of the individual oscillators are mounted in a common frame in which they can be swung in unison so as to vary and control their individual movements in synchronism.

Abstract: A method for correcting the welding path of a welding torch which weaves from side to side while proceeding along the welding path is disclosed. The method comprises the steps of: determining the center of weaving of the welding torch with respect to a welding center line, by monitoring the arc current which varies according to the change of distance between the welding end of the welding torch and a welding surface; and correcting the center of weaving of the welding torch to a correction position on the welding center line, when the center of weaving of the welding torch is misaligned with the welding center line by a predetermined distance, in which the direction of weaving of the welding torch is corrected to be perpendicular to an imaginary line connecting the most recent two correction positions among the correction positions of the center of weaving.

Abstract: A bonding apparatus including a pair of guide rails, a main heating block and a pair of pre-stage and after-stage heating blocks so as to heat a lead frame conveyed on the pair of guide rails, and the pre-stage and after-stage heating blocks can be moved in the direction of width of the lead frame together with one of the pair of guide rails and are installed so that they are positioned beneath the other frame guide rail.

Abstract: Methods for forming solder bumps on integrated circuit chips (and other similar circuitized units). A screening stencil is laid over the surface of the substrate and solder paste material is deposited into the stencil's apertures with a screening blade. The stencil is placed in such a manner that each of its apertures is positioned over a substrate pad, upon which a solder bump is to be formed. Next, a flat pressure plate is laid over the exposed top surface of the stencil, which creates a fully enclosed or "captured", cell of solder paste within each stencil aperture. Then, with the stencil and plate remaining in place on top of the substrate, the substrate is heated to a temperature sufficient to reflow the solder paste material. After reflow, the substrate is cooled, and the pressure plate and stencil are thereafter removed, leaving solder bumps on the substrate. The use of the pressure plate ensures the proper formation of the solder bumps at high densities of solder bumps (i.e.

Abstract: A bonding head is provided for a wire bonding machine which comprises a capillary connected to a transducer for applying pressure and ultrasonic energy to a wire guided into contact with a surface to which a wire bond is to be formed. The transducer is biased by a spring mounted at one end to a linear motor for adjustment of the urging force of the spring. The actual force applied to the wire is measured by detecting means. Control means are provided which are connected to the linear motor for adjusting the urging force of the spring, to thereby obtain a desired pressure to be applied to the wire.

Abstract: Stir friction welding is accomplished by applying force to plunge a nonconsumable, rotating welding post into the region to be welded. The rotation creates friction which at least partially melts the material to be welded, as the welding post penetrates. The force is continued, causing the post to continue to penetrate. A set of rollers associated with the welding head eventually reaches the surface of the workpiece when the welding post reaches the proper depth, and prevents further penetration of the welding post. In one embodiment of the invention, the rollers have crowned surfaces, and the force is applied by a hydraulic cylinder.

Abstract: A method for controlling the interface in a titanium matrix composite between the titanium matrix material and a silicon carbide reinforcing filament or fiber which comprises treating such filament or fiber with a phosphorus-containing compound, and thereafter incorporating the treated fiber into a titanium matrix composite. The quantity of phosphorus remaining on the fiber, following treatment, can be miniscule, so long as at least a trace amount of phosphorus remains on the fiber.

Abstract: A method of producing an hermetically sealed bond between a first metal and a second metal wherein the first metal comprises a first portion and a second portion, the method comprising (a) positioning the second portion and the second metal in generally spaced apart parallel relation; and (b) propelling the first portion into collision with the second metal so as to produce the hermetically sealed bond between the first portion and the second metal. The propulsion is preferably effected by a high velocity explosive charge of 5,500-9,000 m/s. The improved resultant bond is hermetically sealed. The process is of value in providing an hermetically sealed chamber, cavity or envelope having improved sealed properties.

Abstract: A method is described for forming solder mounds for attachment to electronic devices. The solder mounds are preferably in the form of columns and comprise a first solder portion and a second solder portion with the two solder portions having different melting points. The solder columns are preferably formed using an injection molding device. The method is directed to the use of a single column mold to form the multi-solder column. In one embodiment, deformable material is used to partially block a portion of the through opening of the mold during a first solder injection process. The deformable material is then removed and the remainder of the through openings of the mold filled with a second molten solder. The multi-solder column is then electrically connected to a substrate by reflowing.

Abstract: A brazing rod for use in depositing an abrasive metal coating on a metal substrate. The brazing rod comprises particulate abrasive material selected from the group consisting of diamond particles and mixtures of diamond particles and carbide particles and a matrix comprising a braze alloy which is sufficiently sintered together to bind the particulate abrasive material into a rigid rod. The braze alloy contains one component selected from the group consisting of nickel, nickel alloy, silver, silver alloy, gold, gold alloy, copper, copper alloy and mixtures thereof, and a second component selected from the group consisting of iron, iron alloy, cobalt, cobalt alloy, tin, tin alloy, boron, silicon, chromium, chromium alloy and mixtures thereof. The diamond particles are coated with a material selected from the group consisting of tungsten, molybdenum, chromium, nickel, iron, cobalt, palladium, tungsten carbide, molybdenum carbide, chromium carbide and iron carbide.

Abstract: The invention relates to a device for compacting and then welding electric conductors, especially for making through or terminal connections of flexes by means of ultrasound in a compression chamber adapted to the conductor and adjustable for height and width, in which the conductors to be welded are first compacted and then welded. The compression chamber is adjustable to a predetermined height-width ratio regardless of the cross section of the conductors to be welded.

Abstract: A resonator for an ultrasonic bonding apparatus, which comprises an ultrasonic horn having a recessed portion in the exterior surface and a threaded hole, a bonding working portion having a chip base fitted in the recessed portion and a chip body provided on the chip base, and a screw member having a screw portion to fit into the threaded hole and a through-hole through which the chip body is put without contact with said screw member so that the screw member is screwed into the threaded hole, the bonding portion is fixed to the ultrasonic horn, with the chip body projecting through the through-hole for contact with a workpiece.

Abstract: A method is provided for applying a fluid to a plurality of locations on a non-planar substrate. The apparatus used includes a movable base and an array of pins connected to the base. Each pin has a distal end which is vertically movable with respect to the base independently of the rest of the array of pins. Each distal end is adapted to transfer fluid to a location on the substrate by having a greater affinity for the fluid than the fluid has for itself and a lesser affinity for the fluid than the fluid has for the substrate. Accordingly, the distal ends may be dipped in the fluid and moved into contact with the substrate such that the distal ends may collapse toward the base as the distal ends engage the substrate to facilitate further movement of the base toward the substrate for application of fluid to each of the plurality of locations.