Abstract: A polarizing device includes: a first waveguide to guide input light, a second waveguide to guide TE-polarized light, wherein the second waveguide includes a tapered input portion to polarization-selectively couple TE-polarized light from the first waveguide to the second waveguide, wherein the tapered input portion symmetrically overlaps the first waveguide, and the thickness of the tapered input portion has been selected to substantially prevent coupling of TM-polarized light from the first waveguide to the second waveguide, wherein the refractive index of the second waveguide is higher than the refractive index of the first waveguide.

Abstract: An image fiber includes: a plurality of cores; a cladding that integrally encloses the plurality of cores; a light guide fiber that propagates illumination light; and a light guide layer that covers an entire periphery of an external peripheral surface of the cladding and that is in contact with an external peripheral surface of the light guide fiber. The light guide layer is capable of propagating the illumination light.

Abstract: A ring-resonator filter device includes: a waveguide device that includes a core. Further, the core constitutes two ring resonator filters, each of the two ring resonator filters includes two arm portions, a ring-shaped portion, and two optical coupling/branching portions that optically couple the two arm portions and the ring-shaped portion, respectively, and the two ring-shaped portions cross each other.

Abstract: A strip-loaded optical waveguide includes a slab layer, a strip layer, and a cladding region. The slab layer has a first optical refractive index and a first width measured in a transverse direction that is perpendicular to a light propagation direction through the strip-loaded optical waveguide. The strip layer is disposed above the slab layer. The strip layer has a second optical refractive index and a second width as measured the transverse direction. The second width is less than the first width of the slab layer. The second optical refractive index is less than the first optical refractive index of the slab layer. The cladding region is disposed above the slab layer and above the strip layer. The cladding region has a third optical refractive index that is less than the second optical refractive index of the strip layer.

Abstract: Distributed optical tapping architectures include two or more optical tap terminals daisy-chained together. Each optical tap terminal includes an environmentally sealed enclosure; an optical tapping circuit positioned within an interior of the enclosure, the optical tapping circuit including an tap input, a tap pass-through output, and a tap drop output; and hardened interface locations (e.g., de-mateable fiber optic connection locations, cable-pass through glands, etc.) corresponding to the tap input, the tap pass-through output and the tap drop output.

Abstract: Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers.

Abstract: Optical devices and methods include a first waveguide having a first surface and a second waveguide including a second surface. The first waveguide is at a fixed position relative to the second waveguide with the first surface at least partly facing the second surface, and the first surface includes a first positioning element. The first positioning element is a NanoImprint Lithography (NIL) structure. The optical device further includes an adhesive arranged for attaching the first surface to the second surface, where the first positioning element is arranged to control a position of the adhesive. The first positioning element includes a philic region adapted to attract the adhesive, or a phobic region adapted to repel the adhesive.

Abstract: A dual-sided fiber routing tray includes a body, a connector interface, and one or more strain relief assemblies. The body defines a connector side and a slack storage side opposite the connector side. The connector interface is arranged on the connector side of the body between the first end and the second end and is configured to connect one or more fibers. The one or more strain relief assemblies are configured to secure one or more strength members of a fiber optic cable to the body. The one or more strain relief assemblies extend through the body and engage the connector side and the slack storage side of the body. The one or more strain relief assemblies are configured to engage the one or more strength members of the fiber optic cable in the engaged position thereby restricting motion of the one or more strength members relative to the body.

Abstract: In one aspect, the disclosure relates to an apparatus including a photonic integrated circuit (PIC) including an optical network including V optical output channels and U optical input ports, wherein a selectable subset of the U optical input ports can be connected to L lasers, wherein L is less than or equal to U, and wherein the PIC is operable to output light on some or all of the V optical output channels in response to different number of active lasers connected to the U optical input ports.

Abstract: Structures for a waveguide crossing and methods of fabricating a structure for a waveguide crossing. The structure comprises a first waveguide core and a second waveguide core each including a first section, a second section, and a first waveguide bend connecting the first section to the second section. The second section terminates the first waveguide core. The second section terminates the second waveguide core. The second waveguide bend has a side surface that is spaced from a side surface of the first waveguide bend by a gap. A third waveguide core is terminated by a section having an overlapping arrangement with the second section of the first waveguide core. A fourth waveguide core is terminated by a section having an overlapping arrangement with the second section of the second waveguide core.

Abstract: A method of integrating an optoelectronic device comprising a Pockels material, such as lithium niobate (LiNbO3), includes forming an optoelectronic device layer over a semiconductor layer. The optoelectronic device layer includes a patterned optoelectronic device segment in an interlayer dielectric. A window is etched in the interlayer dielectric using the patterned optoelectronic device segment as a sacrificial etch stop. The patterned optoelectronic device segment is removed in the window. The optoelectronic device comprising the Pockels material is formed in place of the removed patterned optoelectronic device segment. The optoelectronic device comprising the Pockels material may be formed from an optoelectronic chiplet.

Abstract: Disclosed is a non-steel high strength data transmission cable having a strength member (5) and a core (1). The high strength data transmission cable includes a length of a core-cable (10), the length of core-cable (10) includes core (1) plus at least one fiber-optic conductor (2) that is: (i) disposed in a helical shape; and (ii) completely encased in a solid, flexible material. Also disclosed is a process for making a high strength data transmission cable. The high strength data transmission cable is capable of being wound on a winch under tensions and surging shocks experienced by a fishing trawler, and provides high quality data signal transmission and resolution so as to permit use for transmitting data during fish trawl operation from high-resolution sonars used to monitor fish caught.

Abstract: The disclosed structures and methods are directed to a chip for an optical gyroscope and methods of manufacturing the chip for the optical gyroscope. The chip comprises a substrate, a waveguide having a first waveguide cladding layer and a waveguide core; and a ring resonator having a first ring cladding layer and a ring resonator core attached to the first ring cladding layer. A side wall of the ring resonator core forms an obtuse angle with an upper surface of the substrate. The method comprises etching a ring groove and a waveguide groove; placing the optical fiber ring into the ring groove and the optical fiber waveguide into the waveguide groove. The method further comprising splicing two ends of an optical fiber; annealing the ring junction of the optical fiber ring; and attaching the optical fiber waveguide to the waveguide groove and the optical fiber ring into the ring groove.

Abstract: Network rack systems for physically supporting modules of a network element and cable management structures for maintaining network cables in an organized manner are provided. An auxiliary side cabinet, according to one implementation, includes a frame configured for physical attachment to a side portion of a main rack structure, where the main rack structure is configured to support a plurality of modules of a Network Element (NE). The auxiliary side cabinet further includes a front plane connected to a front portion of the frame. Also, the auxiliary side cabinet includes one or more connector panels supported on the front plane. Each of the one or more connector panels is configured to support a plurality of connectors. The plurality of connectors are configured for communication with associated connectors of the modules of the NE via cables. Also, the plurality of connectors are configured as high pin count connectors.

Abstract: An optical modulator includes, a semiconductor substrate, an optical waveguide portion disposed on the semiconductor substrate, a first P-N junction disposed on the semiconductor substrate, and a second P-N disposed on the semiconductor substrate. The optical waveguide portion provides an optical path for light that is to be modulated. The first P-N junction is disposed on the semiconductor substrate along the optical path and defines a border between an N-doped portion disposed on the semiconductor substrate and a P-doped portion disposed on the semiconductor substrate. The second P-N junction is disposed on a portion of the semiconductor substrate alongside the optical path and spaced apart from the first P-N junction.

Abstract: A hinge structure for pivotally mounting a first telecommunications element to a second telecommunications element includes a hinge pin provided on the first element and a hinge pin receiver provided on the second element. The hinge pin defines a notch separating the pin into two pin halves. The hinge pin receiver defines two sets of opposing surfaces, the two sets separated by a divider, the divider configured to be accommodated by the notch when the hinge pin is inserted into the hinge pin receiver, wherein each opposing surface set defines a slot for receiving each pin half.

Abstract: In some examples, optical fiber identification and distance measurement may include utilizing a reflectometer and optical fiber connection device that includes a Rayleigh wavelength pass filter to pass, in one direction, an optical reflectometer signal to an optical fiber. The reflectometer and optical fiber connection device may include a Raman wavelength pass filter to filter out, in another direction, Rayleigh backscattering from the optical reflectometer signal. Further, the Raman wavelength pass filter may pass, in the another direction, a Raman Anti-Stokes signal from the optical fiber.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: In an embodiment, an optical inspection circuit includes: an optical modulator comprising an optical waveguide on a substrate, the optical waveguide having a core comprising a semiconductor; a first input waveguide optically connected to the optical modulator, the first input waveguide having a core comprising the semiconductor; an output waveguide optically connected to the optical modulator, the output waveguide having a core comprising the semiconductor; a photodiode on the substrate in a vicinity of the optical modulator; a wire electrically connecting the optical modulator and the photodiode; and a second input waveguide optically connected to the photodiode, the second input waveguide having a core comprising the semiconductor.

Abstract: To provide an optical multiplexing circuit that can accurately monitor light of a plurality of wavelengths, and that can mitigate allowable errors in manufacturing. The present invention includes a plurality of branching units that each divide light output from a corresponding one of a plurality of input waveguides; a multiplexing unit that multiplexes beams each being one beam of the light divided by each of the plurality of branching units; an output waveguide that outputs the light multiplexed by the multiplexing unit; and a plurality of monitoring waveguides that each output another beam of the light divided by the plurality of branching units, wherein a plurality of optical multiplexing circuits including multiplexing units having different multiplexing characteristics are provided on a same substrate.