Abstract: In one aspect, the disclosure relates to an apparatus including a photonic integrated circuit (PIC) including an optical network including V optical output channels and U optical input ports, wherein a selectable subset of the U optical input ports can be connected to L lasers, wherein L is less than or equal to U, and wherein the PIC is operable to output light on some or all of the V optical output channels in response to different number of active lasers connected to the U optical input ports.

Abstract: The disclosed structures and methods are directed to a chip for an optical gyroscope and methods of manufacturing the chip for the optical gyroscope. The chip comprises a substrate, a waveguide having a first waveguide cladding layer and a waveguide core; and a ring resonator having a first ring cladding layer and a ring resonator core attached to the first ring cladding layer. A side wall of the ring resonator core forms an obtuse angle with an upper surface of the substrate. The method comprises etching a ring groove and a waveguide groove; placing the optical fiber ring into the ring groove and the optical fiber waveguide into the waveguide groove. The method further comprising splicing two ends of an optical fiber; annealing the ring junction of the optical fiber ring; and attaching the optical fiber waveguide to the waveguide groove and the optical fiber ring into the ring groove.

Abstract: Disclosed is a non-steel high strength data transmission cable having a strength member (5) and a core (1). The high strength data transmission cable includes a length of a core-cable (10), the length of core-cable (10) includes core (1) plus at least one fiber-optic conductor (2) that is: (i) disposed in a helical shape; and (ii) completely encased in a solid, flexible material. Also disclosed is a process for making a high strength data transmission cable. The high strength data transmission cable is capable of being wound on a winch under tensions and surging shocks experienced by a fishing trawler, and provides high quality data signal transmission and resolution so as to permit use for transmitting data during fish trawl operation from high-resolution sonars used to monitor fish caught.

Abstract: A method of integrating an optoelectronic device comprising a Pockels material, such as lithium niobate (LiNbO3), includes forming an optoelectronic device layer over a semiconductor layer. The optoelectronic device layer includes a patterned optoelectronic device segment in an interlayer dielectric. A window is etched in the interlayer dielectric using the patterned optoelectronic device segment as a sacrificial etch stop. The patterned optoelectronic device segment is removed in the window. The optoelectronic device comprising the Pockels material is formed in place of the removed patterned optoelectronic device segment. The optoelectronic device comprising the Pockels material may be formed from an optoelectronic chiplet.

Abstract: Structures for a waveguide crossing and methods of fabricating a structure for a waveguide crossing. The structure comprises a first waveguide core and a second waveguide core each including a first section, a second section, and a first waveguide bend connecting the first section to the second section. The second section terminates the first waveguide core. The second section terminates the second waveguide core. The second waveguide bend has a side surface that is spaced from a side surface of the first waveguide bend by a gap. A third waveguide core is terminated by a section having an overlapping arrangement with the second section of the first waveguide core. A fourth waveguide core is terminated by a section having an overlapping arrangement with the second section of the second waveguide core.

Abstract: Network rack systems for physically supporting modules of a network element and cable management structures for maintaining network cables in an organized manner are provided. An auxiliary side cabinet, according to one implementation, includes a frame configured for physical attachment to a side portion of a main rack structure, where the main rack structure is configured to support a plurality of modules of a Network Element (NE). The auxiliary side cabinet further includes a front plane connected to a front portion of the frame. Also, the auxiliary side cabinet includes one or more connector panels supported on the front plane. Each of the one or more connector panels is configured to support a plurality of connectors. The plurality of connectors are configured for communication with associated connectors of the modules of the NE via cables. Also, the plurality of connectors are configured as high pin count connectors.

Abstract: An optical modulator includes, a semiconductor substrate, an optical waveguide portion disposed on the semiconductor substrate, a first P-N junction disposed on the semiconductor substrate, and a second P-N disposed on the semiconductor substrate. The optical waveguide portion provides an optical path for light that is to be modulated. The first P-N junction is disposed on the semiconductor substrate along the optical path and defines a border between an N-doped portion disposed on the semiconductor substrate and a P-doped portion disposed on the semiconductor substrate. The second P-N junction is disposed on a portion of the semiconductor substrate alongside the optical path and spaced apart from the first P-N junction.

Abstract: A hinge structure for pivotally mounting a first telecommunications element to a second telecommunications element includes a hinge pin provided on the first element and a hinge pin receiver provided on the second element. The hinge pin defines a notch separating the pin into two pin halves. The hinge pin receiver defines two sets of opposing surfaces, the two sets separated by a divider, the divider configured to be accommodated by the notch when the hinge pin is inserted into the hinge pin receiver, wherein each opposing surface set defines a slot for receiving each pin half.

Abstract: In some examples, optical fiber identification and distance measurement may include utilizing a reflectometer and optical fiber connection device that includes a Rayleigh wavelength pass filter to pass, in one direction, an optical reflectometer signal to an optical fiber. The reflectometer and optical fiber connection device may include a Raman wavelength pass filter to filter out, in another direction, Rayleigh backscattering from the optical reflectometer signal. Further, the Raman wavelength pass filter may pass, in the another direction, a Raman Anti-Stokes signal from the optical fiber.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: In an embodiment, an optical inspection circuit includes: an optical modulator comprising an optical waveguide on a substrate, the optical waveguide having a core comprising a semiconductor; a first input waveguide optically connected to the optical modulator, the first input waveguide having a core comprising the semiconductor; an output waveguide optically connected to the optical modulator, the output waveguide having a core comprising the semiconductor; a photodiode on the substrate in a vicinity of the optical modulator; a wire electrically connecting the optical modulator and the photodiode; and a second input waveguide optically connected to the photodiode, the second input waveguide having a core comprising the semiconductor.

Abstract: To provide an optical multiplexing circuit that can accurately monitor light of a plurality of wavelengths, and that can mitigate allowable errors in manufacturing. The present invention includes a plurality of branching units that each divide light output from a corresponding one of a plurality of input waveguides; a multiplexing unit that multiplexes beams each being one beam of the light divided by each of the plurality of branching units; an output waveguide that outputs the light multiplexed by the multiplexing unit; and a plurality of monitoring waveguides that each output another beam of the light divided by the plurality of branching units, wherein a plurality of optical multiplexing circuits including multiplexing units having different multiplexing characteristics are provided on a same substrate.

Abstract: A fiber optic connector can include a connector body with a connector channel extending therethrough. A ferrule can be positioned in a first end of the connector channel and a hollow core fiber can be positioned in a second end of the connector channel. A lens can be positioned in the connector channel between the ferrule and the hollow core fiber. The lens can direct light emitted from the hollow core fiber to an optical fiber within the ferrule.

Abstract: A photonic integrated circuit platform includes a substrate, a first oxide layer disposed on the substrate and including an insulating transparent oxide, and a first optical element layer disposed on the first oxide layer and including a semiconductor material. The photonic integrated circuit platform further includes a second optical element layer disposed on the first optical element layer and including an insulating material different from the insulating transparent oxide of the first oxide layer, the second optical element layer further including a compound semiconductor material different from the semiconductor material of the first optical element layer, a second oxide layer disposed on the second optical element layer and including an insulating transparent oxide, and a plurality of optical elements formed by patterning the first optical element layer or the second optical element layer.

Abstract: An optical ferrule includes an optical coupling member with a light redirecting element that redirects input light from a waveguide toward an output window. The optical coupling member has a mating surface configured to slidably mate with a mating optical coupling member along a longitudinal axis of the optical ferrule. The optical ferrule also includes at least one stacking member along a longitudinal edge of the optical coupling member. The stacking member has a distal end extending beyond one of the mating surface and a top surface opposed to the mating surface. The stacking member also has a contact surface opposed to the distal end. The contact surface is configured to rotatably interface with a corresponding distal end of a of an adjacently stacked optical ferrule.

Abstract: A cross-connect switch architecture is described. A cross-connect switch device includes a cross-point switch array, a plurality of photo detectors and a plurality of amplifiers. The cross-point switch array includes a plurality of switches. Each switch is coupled between a respective photo detector and a respective amplifier and is configured to couple the respective photo detector to the respective amplifier when the switch is selected.

Abstract: A bladed chassis system facilitates installation of the bladed chassis system and replacement of the blades at the chassis. For example, a front panel of the blade can be opened either upwardly or downwardly at the discretion of the user. Blades can be inserted and removed from the front and/or the rear of the bladed chassis system at the discretion of the user. Cables can be routed to the rear of the chassis system from either of two sides at the discretion of the user. The blades carried by the chassis have fiber management trays that can be rotationally oriented in any desired rotational position at the discretion of the user.

Abstract: A mode loss difference compensator of the present disclosure includes a main waveguide configured to allow propagation of N or more modes (where N is an integer of 3 or more), a first auxiliary waveguide having, at one end thereof, a first coupling portion configured to mode-convert an LP0n mode (where n is an integer of 2 or more) propagating in the main waveguide into a fundamental mode in the first auxiliary waveguide and transfer the fundamental mode from the main waveguide to the first auxiliary waveguide and having, at the other end thereof, a second coupling portion configured to mode-convert the fundamental mode propagating in the first auxiliary waveguide into the LP0n mode (where n is an integer of 2 or more) in the main waveguide and transfer the LP0n mode from the first auxiliary waveguide to the main waveguide, and a second auxiliary waveguide having, at one end thereof, a third coupling portion configured to convert a higher-order mode, other than any LP0n mode (where n is an integer of 2 or mor

Abstract: A silicon photonics integration circuit includes a silicon substrate member; a RX sub-circuit formed in the silicon substrate member including multiple RX-input ports each having a mode size converter configured to receive an incoming light signal into one of multiple waveguides and multiple RX photo detectors coupled respectively to the multiple waveguides; and a TX sub-circuit formed in the silicon substrate member including one or more TX-input ports each having a mode size converter coupled to a first TX photo detector into one input waveguide, one or more 1×2 directional couplers each coupled between the input waveguide and two mod-input waveguides, multiple modulators coupled between respective multiple mod-input waveguides and multiple mod-output waveguides each being coupled to a second TX photo detector into one of multiple output waveguides, and multiple TX-output ports each having a mode size converter coupled to respective one of the multiple output waveguides.

Abstract: An embodiment plasmonic waveguide includes a first metal layer formed on a substrate, an electro-optic thin film formed on the first metal layer and including a material having an electro-optic effect, and a second metal layer formed on the electro-optic thin film. In an embodiment, a waveguide region in which the first metal layer and the second metal layer overlap each other in a direction normal to a planar surface of the substrate (layer stacking direction), the waveguide region extending in the planar surface direction of the substrate, is included. For example, the first metal layer and the second metal layer are formed only in the waveguide region, and each of respective widths of the first metal layer and the second metal layer is equal to a width of an overlap between the first metal layer and the second metal layer.