Abstract: A method for forming a cable may include providing a strength member that includes a plurality of strength fibers positioned within a shapeable resin material. A shape of the strength member may be modified along its longitudinal length while twisting the strength member with one or more fiber optic components. The modified shape of the strength member may then be fixed within a desired operating temperature range of the cable, and a jacket may be formed around the strength member and the one or more optical fiber components.

Abstract: Devices, systems and methods to prevent damage to power and communication conductors located in cold occurring regions, with an elongated cylindrical tubular assembly of closed cell foam within a braided/woven layer that can be sealed to provide longitudinal strength and a snag resistant durable and flexible outer coating. The assembly along with communication and power lines is pulled through new power and communication ducts and conduits and in retrofitting existing power and communication ducts, so that the assembly reduces the volume spacing in the ducts/conduits that can be damaged by water intrusion which expands during freeze conditions.

Abstract: A test apparatus has at least one optical source, a high-speed photodetector, a microcontroller or processor, and electrical circuitry to power and drive the optical source, high-speed photodetector, and microcontroller or processor. The apparatus measures the frequency response and optical path length of a multimode optical fiber under test, utilizes a reference VCSEL spatial spectral launch condition and modal-chromatic dispersion interaction data to estimate the channels total modal-chromatic bandwidth of the fiber under test, and computes and presents the estimated maximum data rate the fiber under test can support.

Abstract: A sensor system comprises a pulsed light source, and a passive sensor head chip in communication with the light source. The sensor head chip includes a first photonics substrate, a transmitting optical component on the first photonics substrate and configured to couple a pulse, transmitted through a first optical fiber from the light source, into a region of interest; and a receiving optical component on the first photonics substrate and configured to couple backscattered light, received from the region of interest, into a second optical fiber. A signal processing chip communicates with the sensor head chip and light source. The signal processing chip includes a second photonics substrate and comprises a passive optical filter array that receives the backscattered light from the second optical fiber. The filter array includes notch filters in communication with each other and operative for frequency selection; and optical detectors respectively coupled to the notch filters.

Abstract: A sensing cable for protection against rodent damage includes an optical component comprising at least one optical fiber, a plurality of armor components embedded in the jacket, and a strength member embedded in the cable jacket, wherein when viewed in cross-section, each component of the plurality of armor components and the strength member surround the optical component with a gap formed between each component of the plurality of armor components and the optical transmission component and the strength member.

Abstract: An optical interposer for providing optimal optical coupling between an optical transceiver interface and an external optical interface includes an interposer photonic integrated circuit (PIC) operably configured to couple an optical signal between the optical transceiver interface and the external optical interface, one or more waveguide based optical devices operably integrated on a common substrate and one or more of interposer input/output (I/O) channels operably configured with the optical transceiver interface and the external optical interface.

Abstract: An optical fiber enclosure has a housing having a mounting wall within a storage space. The enclosure also has a backplate attached to the mounting wall, the backplate having a mounting surface and a circumferential wall for receiving cable slack. The optical fiber enclosure also has a spindle attached to the mounting surface of the backplate, the spindle configured to connect to a cable spool configured to rotate relative to the spindle and the backplate to store optical fiber.

Abstract: An optical fiber cable 100 includes at least one optical fiber core 140 and a sheath containing the optical fiber core. The optical fiber core 140 includes optical fibers 130. A total length of the optical fiber core 140 is longer than that of the sheath 160. The optical fiber core 140 is contained in the sheath 160 so that bending occurs in the optical fibers 130.

Abstract: An adjustable height optical fiber cable reel comprises a first piece having a first base plate and a first tab protruding from the first base plate, the first tab having a first opening and a second opening, a second piece having a second base plate and a second tab protruding from the second base plate, the second tab having a pin. The pin is configured to engage the first opening to lock the adjustable height reel at a first height, and to engage the second opening to lock the adjustable height reel at a second height. The adjustable height reel may also be coupled to a slack storage tray. Optical fiber enclosures may also be configured with adjustable height reels with optional slack storage trays.

Abstract: Optical apparatus and methods of manufacture thereof An optical apparatus (20) for evanescently coupling an optical signal across an (interface (30) is described. The optical apparatus (20) comprises a first substrate (22) and a second substrate (24). The optical signal is evanescently coupled between a first waveguide (26) formed by laser inscription of the first substrate (22) and a second waveguide (28) of the second substrate (22). The first waveguide (26) comprises a curved section (34) configured to provide evanescent coupling of the optical signal between the first and second waveguides (26, 28) via the interface (30).

Abstract: Structures and methods implement an enlarged waveguide. The structure may include a semiconductor-on-insulator (SOI) substrate including a semiconductor-on-insulator (SOI) layer over a buried insulator layer over a semiconductor substrate. An inter-level dielectric (ILD) layer is over the SOI substrate. A first waveguide has a lower surface extending at least partially into the buried insulator layer, which allows vertical enlargement of the waveguide, without increasing the thickness of the ILD layer or increasing the length of interconnects to other devices. The enlarged waveguide may include nitride, and can be implemented with other conventional silicon and nitride waveguides.

Abstract: An optical communication cable is provided having a cable body with an inner surface defining a passage within the cable body and a plurality of core elements within the passage. A film surrounds the plurality of core elements, wherein the film directs a radial force inward onto the plurality of core elements to restrain and hold the plurality of core elements in place.

Abstract: A terminal system assembly includes a base plate, a spool, an adapter module for securing a connection between a fiber of an input fiber cable and a fiber of an output fiber cable, and a cable management plate coupled with the spool. The spool is rotatably mounted to the base plate and is configured to receive the input fiber cable. The adapter module is configured to be coupled with the cable management plate. The spool containing the fiber input cable is allowed to freely rotate until the adapter module is coupled with the cable management plate. The adapter module includes an anti-rotation portion that is configured to cooperate with a portion of the base plate to prevent rotation of the spool and the adapter module when the adapter module is coupled with the spool.

Abstract: In one embodiment, a chromatic device includes a transparent conductive substrate, an active layer provided on the conductive substrate, the active layer comprising a conducting polymer, an electrolyte layer in contact with the conductive substrate and the active layer, the electrolyte comprising an oxidant and a salt but not comprising an acid, and a metal element configured to be selectively placed in and out of direct electrical contact with the conductive substrate or the active layer, wherein the active layer has a color that blocks light when the metal element is not in electrical contact with the conductive substrate but changes to a translucent color that transmits light when the metal element is placed in electrical contact with the conductive substrate or the active layer, wherein the active layer changes color without applying external energy to the active layer.

Abstract: A precise optical technique for measuring electronic transport properties in semiconductors is disclosed. Using tightly focused laser beams in a photo-modulated reflectance system, the modulated reflectance signal is measured as a function of the longitudinal (Z) displacement of the sample from focus. The modulated component of the reflected probe beam is a Gaussian beam with its profile determined by the focal parameters and the complex diffusion length. The reflected probe beam is collected and input to the detector, thereby integrating over the radial profile of the beam. This results in a simple analytic expression for the Z dependence of the signal in terms of the complex diffusion length. Best fit values for the diffusion length and recombination lifetime are obtained via a nonlinear regression analysis. The output diffusion lengths and recombination lifetimes and their estimated uncertainties may then be used to evaluate various transport properties and their associated uncertainties.

Abstract: The present description relates to a modular, reconfigurable splice tray system that comprises a splice tray having a base extending longitudinally from a first end to a second end, a pair of side walls extending longitudinally between the first and second ends of the base, a plurality of cable entrances formed at the first and second end of the base and a receiving portion configured to receive a modular component disposed between the cable entrances at the first end and at the second end.

Abstract: Fiber optic connectors are disclosed that may compensate for the tolerance stack-up of components. The fiber optic connector comprises a connector assembly, a body for securing a portion of the connector assembly, an internal compliant member, a connector sleeve assembly, a balancing resilient member, and a housing. The internal compliant member is disposed about a portion of the body and may compensate for tolerance stack-up of components when the fiber optic connector is assembled. The connector assembly comprises a ferrule and a resilient member for biasing the ferrule forward and the connector sleeve assembly comprises a housing and a ferrule sleeve. When assembled, the connector assembly is at least partially disposed in the passageway of the housing and the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve. The balancing resilient member biases the housing of the connector sleeve assembly to a forward position.

Abstract: In one aspect, a method for displaying incompatible ports at the schematic design stage comprises the following. A schematic of a photonic integrated circuit is accessed. The schematic comprises a plurality of optical components that have ports, and the optical components are connected at their ports. A processor determines the structures of the ports. Typically, the structure of a port is determined by the cross-sectional shape and the material(s) of the port. The schematic of the photonic integrated circuit is displayed, with different visual indicators for ports with different structures. For example, ports with different structures may be represented by symbols of different colors, different outlines, different fill patterns or other types of non-textual visual indicators.

Abstract: This invention described a Spatial Recognition Device (SRD) based on a mounted high precision measurement sensor that enables the user to detect and navigate around objects and obstacles like traditional white cane would, but without contact, and also allow the user to identify the location and shape of objects to enable identifying such obstacles and objects. The device can also provide route guidance through a GPS and collision avoidance through onboard and/or cloud based or hybrid computational systems, accelerometers and other sensors. The device enables sensing ranges from approximately one inch to a maximum range dependent on the high precision measurement sensor used in the device. This device would not be mounted on a “white cane” or similar assistive device.

Abstract: A package includes a photonic integrated circuit die, an electric integrated circuit die, and an encapsulant. The photonic integrated circuit die includes a semiconductor substrate, an insulation layer, and a waveguide. The semiconductor substrate has a notch. The insulation layer is disposed on the semiconductor substrate. The waveguide is disposed on the insulation layer. The notch of the semiconductor substrate is underneath at least a portion of the waveguide. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The encapsulant laterally encapsulates the electric integrated circuit die.