Abstract: The present invention discloses a dielectric predictable break load aerial drop cable comprising one or more optical transmission elements, a first layer surrounding the one or more optical transmission elements, a plurality of strength yarns surrounding the first layer, an outer sheath surrounding the plurality of strength yarns. In particular, the outer sheath has a plurality of strength members embedded in an equilateral position. Moreover, the dielectric predictable break load aerial drop cable breaks at a predefined break load with a neutral bending performance.

Abstract: An apparatus has a cassette configured to hold optical fiber comprising one or more optical sensors. The cassette has a spool configured to one or more of extract and retract the optical fiber from the cassette. A pre-strain mechanism is configured to apply a predetermined pre-strain to the one or more optical sensors. An optical fiber installation tool is configured to mount the optical fiber comprising the one or more pre-strained optical sensors to a surface.

Abstract: Electro-optic (EO) devices having an EO polymer core comprising a first host polymer and a first nonlinear optical chromophore (NLOC); and a cladding comprising a second host polymer and a second NLOC, and methods of preparing the same; wherein the first NLOC has a first bridge covalently bonded to an electron-accepting group and an electron-donating group; wherein the second NLOC has a second bridge covalently bonded to an electron-accepting group and an electron-donating group; and wherein the second bridge is less conjugated than the first bridge such that the cladding has an index of refraction that is less than that of the EO polymer core, and wherein the second NLOC is present in the second host polymer in a concentration such that the cladding has a conductivity equal to or greater than at least 10% of the conductivity of the EO polymer core at a poling temperature.

Abstract: A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: A waveguide is provided. The waveguide having a first core, a second core spaced apart from and parallel with the first core, and a cladding surrounding the first core and the second core. An interstitial portion of the cladding is located between the first core and the second core. A first region of the first core adjacent to the cladding or of the cladding adjacent to the first core is color dyed.

Abstract: A Distributed Feedback Laser (DFB) mounted on a Silicon Photonic Integrated Circuit (Si PIC), the DFB having a longitudinal length which extends from a first end of the DFB laser to a second end of the DFB laser, the DFB laser comprising: an epi stack, the epi stack comprising: one or more active material layers; a layer comprising a partial grating, the partial grating extending from the second end of the DFB laser, only partially along the longitudinal length of the DFB laser such that it does not extend to the first end of the DFB laser; a highly reflective medium located at the first end of the DFB laser; and a back facet located at the second end of the DFB laser.

Abstract: A waveguide includes a core and a cladding. The core has an inlet on which light is incident. The core includes a front portion and a rear portion located between the front portion and the inlet. The front portion and the rear portion each have a thickness that is a dimension in a first direction and a width that is a dimension in a second direction. The first direction is orthogonal to a propagation direction of the light. The second direction is orthogonal to the propagation direction of the light and the first direction. The thickness of the front portion decreases with increasing distance from the inlet.

Abstract: A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.

Abstract: A photonic integrated circuit (PIC)-based imager blade includes a number of PIC imager units stacked on top of one another. Each PIC imager unit includes a PIC coupled, at a first end and a second end, to a first set of lenslets and a second set of lenslets, respectively. An electronic integrated circuit (EIC) is coupled to the PIC. Pairs of lenslets of the first and second set of lenslets are optically coupled to respective waveguides embedded in the PIC. The PIC imager units have different lengths, and longer PIC imager units include larger lenslets.

Abstract: Example implementations described herein are directed to a system involving one or more photonic integrated circuits having multi-mode waveguides and connected to a printed optical board through the use of multi-mode waveguide connectors described herein. The printed optical board can include an embedded multi-mode waveguide bus to facilitate optical signal to and from the photonic integrated circuits. The system can also include a chiplet such as a photonic integrated circuit with a single mode waveguide configured to connect to an optical fiber cable.

Abstract: A telecommunications assembly includes a chassis and a plurality of fiber optic splitter modules mounted within the chassis. Each splitter module includes at least one fiber optic connector. Within an interior of the chassis are positioned at least one fiber optic adapter. Inserting the splitter module through a front opening of the chassis at a mounting location positions the connector of the splitter module for insertion into and mating with the adapter of the chassis. The adapters mounted within the interior of the chassis are integrally formed as part of a removable adapter assembly. A method of mounting a fiber optic splitter module within a telecommunications chassis is also disclosed.

Abstract: A waveguide grating. The waveguide grating includes a rib composed of a first material. A first portion of the waveguide has a first layer on the rib, the first layer being composed of a second material; and a second layer on the first layer, the second layer being composed of a third material, the third material having a higher index of refraction than the first material.

Abstract: A LiDAR system has a field of view and includes a polarization-based waveguide splitter. The splitter includes a first splitter port, a second splitter port and a common splitter port. A laser is optically coupled to the first splitter port via a single-polarization waveguide. An objective lens optically couples each optical emitter of an array of optical emitters to a respective unique portion of the field of view. An optical switching network is coupled via respective dual-polarization waveguides between the common splitter port and the array of optical emitters. An optical receiver is optically coupled to the second splitter port via a dual-polarization waveguide and is configured to receive light reflected from the field of view. A controller, coupled to the optical switching network, is configured to cause the optical switching network to route light from the laser to a sequence of the optical emitters according to a temporal pattern.

Abstract: An optical fiber protective unit includes: a reticulated tube having openings that are reticulately formed, the reticulated tube being configured to accommodate a plurality of optical fibers inserted through the reticulated tube; a tubular member disposed inside the reticulated tube, the tubular member being configured to accommodate the plurality of optical fibers through the tubular member; and a cylindrical member attached to an end part of the reticulated tube. The cylindrical member has an inner diameter that is larger than an outer diameter of the tubular member.

Abstract: Structures for an edge coupler and methods of forming a structure for an edge coupler. The structure includes a waveguide core over a dielectric layer, and a back-end-of-line stack over the waveguide core and the dielectric layer. The back-end-of-line stack includes an interlayer dielectric layer, a side edge, a first feature, a second feature, and a third feature laterally arranged between the first feature and the second feature. The first feature, the second feature, and the third feature are positioned on the interlayer dielectric layer adjacent to the side edge, and the third feature has an overlapping relationship with a tapered section of the waveguide core.

Abstract: An apparatus includes a cassette configured to hold optical fiber comprising one or more optical sensors. The cassette comprises a spool configured to one or more of extract and retract the optical fiber from the cassette. A fiber monitor is coupled to the cassette. The fiber monitor is configured to monitor at least one parameter of the optical fiber as the optical fiber is extracted from the cassette.

Abstract: A photonic integrated circuit (PIC) for determining a wavelength of an input signal is disclosed. The PIC comprises: a substrate; a first Mach-Zehnder Interferometer (MZI) disposed over the substrate, comprising first optical waveguides having a first optical path length difference, and configured to receive a first output optical signal from a light source. The PIC also comprises a second Mach-Zehnder Interferometer (MZI) disposed over the substrate, comprising second optical waveguides having a second optical path length difference, which is greater than the first optical path length difference, and configured to receive a second output optical signal from the light source.

Abstract: A system includes a plurality of wafer-scale modules and a plurality of optical fibers. Each wafer-scale module includes an optical backplane and one or more die stacks on the optical backplane. The optical backplane includes a substrate and at least one optical waveguide layer configured to transport and/or manipulate photonic quantum systems (e.g., photons, qubits, qudits, large entangled states, etc.). Each die stack of the one or more die stacks includes a photonic integrated circuit (PIC) die optically coupled to the at least one optical waveguide layer of the optical backplane. The plurality of optical fibers is coupled to the optical backplanes of the plurality of wafer-scale modules to provide inter-module and/or intra-module interconnects for the photonic quantum systems.

Abstract: Structures for an edge coupler and methods of fabricating a structure for an edge coupler. A waveguide core includes a waveguide core section that has a first notched sidewall, a second notched sidewall, and an end surface connecting the first notched sidewall to the second notched sidewall. Segments are positioned with a spaced arrangement adjacent to the end surface of the waveguide core section, and a slab layer is adjoined to the segments, the first notched sidewall of the waveguide core section, the second notched sidewall of the waveguide core section, and the end surface of the waveguide core section. The segments and the waveguide core section have a first thickness, and the slab layer has a second thickness that is less than the first thickness.