Abstract: A coating composition for the protection of metallic substrates against environmental attack comprising, in weight percent, from about 10% to about 30% of at least one film-forming polymer such as epoxy resins having an epoxide value of about 250 to about 2500, vinyl chloride resins copolymerized with polyisocyanates, polyurethane resins, and polyester resins; from about 40% to about 55% particulate metallic zinc; from about 4.75% to about 7% zinc-coated hollow glass-like microspheres having diameters ranging from about 2.5 to about 60 microns, the volumetric ratio of the metallic zinc to the microspheres ranging from about 0.8:1 to 1.2:1; from about 1.5 to about 3% of at least one particle size grade of pyrogenic amorphous silica having an average particle size ranging from about 0.007 to about 0.04 micron; and not more than 30% solvents compatible with the film-forming polymer.

Abstract: An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.

Abstract: A photocurable ink composition for forming patterns resistive to electroless plating is disclosed which includes (a) an epoxy resin, (b) an aliphatic polyol polyglycidyl ether as a reactive, viscosity controlling agent, (c) a photopolymerization catalyst, and (d) hydrophobic silica particles as a thixotropic agent.

Abstract: Compositions are prepared by the reaction of (A) an advanced composition resulting from reacting (1) at least one of (a) at least one epoxidized triglyceride of a fatty acid, or (b) at least one epoxidized fatty acid having an average of more than one unsaturated group per molecule or (c) at least one diepoxyalkane, or (d) any combination of any two or more of (a), (b) or (c), or (e) a combination of any one or more of (a), (b) or (c) and (f) a diglycidyl ether of a dihydric phenol; with (2) a dihydric phenol; (B) optionally a monohydric phenol; (C) a phosphorous-containing compound; and (D) optionally a base. These compositions can be cured with curing agents which react with aliphatic hydroxyl groups.

Abstract: An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.

Abstract: Advanced resins and unadvanced epoxy resins are disclosed wherein the unadvanced compound and at least a portion of the advanced epoxy resin contains at least one --O--R.sup.1 --O-- or --(O--CH.sub.2 --CHR.sup.2).sub.n --O-- group as a bridge between two groups selected independently from the group consisting of (1) a saturated or unsaturated cycloaliphatic group, (2) an aromatic group, (3) a group represented by the formula ##STR1## or (4) a group represented by the formula ##STR2## Also disclosed are nucleophilic derivatives thereof, as well as curable compositions and coating compositions containing the advanced or unadvanced epoxy resins or nucleophilic modified advanced or unadvanced epoxy resins. These advanced resins and unadvanced epoxy resins provide coatings with good flexibility or formability as exhibited by good flexural or formable properties determined by reverse impact, T-bend and wedge-bend tests, chip resistance, and with good corrosion resistance and throwpower.

Abstract: The present invention relates to hybrid aqueous silicone-organic composition which are prepared by first forming a silicone oil-in-water emulsion by dispersing an oil phase, containing a silicone polymer and a specific non-ionic surfactant, in a water phase containing a poly(vinyl alcohol) dissolved in water. This silicone emulsion is subsequently mixed with a an aqueous solution of a water-soluble polymer to form the instant compositions which can be applied to substrates to provide coatings having heat resistance comparable to conventional all-silicone systems delivered from organic solvent solution.

Abstract: An epoxy resin composition for semiconductor sealing, comprising as essential components:(A) an epoxy resin,(B) a phenolic resin curing agent comprising 30-100% by weight, based on the total amount of the phenolic resin curing agent, of a silicone-modified phenolic resin curing agent obtained by reacting a phenolic resin with at least one of silicone compounds represented by the following formulas [I] and [II] ##STR1## wherein ##STR2## A: --R--COOH, ##STR3## or H, R: a lower alkylene group,10.ltoreq.N=l+m+n+2.ltoreq.200,0.ltoreq.m/N.ltoreq.0.1, and 5.ltoreq.N/n.ltoreq.50,(C) an inorganic filler, and(D) a curing accelerator.

Abstract: A composition is disclosed which comprises the reaction product of a diglycidyl ether of a 4,4'-dihydroxybiphenyl and a polyhydric phenol having an average of 2.3 to 10 hydroxyl groups per molecule. The described epoxy resin is particularly useful in phenolic-cured electrical encapsulation formulations.

Abstract: A sizing agent for carbon fibers and glass fibers is based on an aqueous dispersion containing an epoxy resin and from 5 to 40% by weight, based on the epoxy resin, of a nonionic emulsifier containing teritary amino groups and/or ether linkages and at least one functional radical capable of reaction with the epoxy resin, preferably a glycidyl radical, and also at least one emulsifying radical which preferably carries a polyethylene glycol group in the terminal position.

Abstract: A composition suitable for use as a coating composition depositable by cationic electrodeposition which has improved edge protection capability containing, in addition to the conventional ingredients used in compositions for cationic electrocoat, such as an aqueous cationic resin, micro-resin particles of a size sufficient to be water dispersible which particles comprise an internally crosslinked polymer of (A) an active hydrogen containing monomer and (B) a monomer containing at least two active double bonds, which polymer further contains a cationic group in sufficient proportion to allow the micro-resin particle to be water dispersed.

Abstract: A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula: ##STR1## where R.sub.1 is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula: ##STR2## where n is a positive integer of 3-16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.

Abstract: The present invention relates to films or sheets of linear polyester containing glass spheres having a certain particle size distribution and in a certain amount based upon the weight of the polyester film. The addition of the glass spheres improves several properties of the film, including the dynamic coefficient of friction. Preferably, a second film additive, fumed silica, of a controlled particle size distribution and weight is additionally added to the film. The addition of the fumed silica additionally improves several properties of the polyester film, including the static coefficient of friction of the film.

Abstract: Improved methods of forming and suspending consolidatable resin composition coated particulate materials in gelled aqueous carrier liquids are provided. In accordance with the methods, a gelled aqueous carrier liquid, uncoated particulate material, a resin composition which will subsequently harden and a surface active agent are admixed whereby the particulate material is coated with the resin composition and suspended in the gelled aqueous carrier liquid.

Abstract: The present invention relates to a polyvinyl chloride- based unplasticized molding composition which includes vinyl chloride homo-, co- and/or ter-polymer and/or mixtures or alloys thereof having a vinyl chloride or PVC content of more than 70% by weight, preferably more than 85% by weight, and 15 to 0% by weight of at least one impact-modifying polymer, which unplasticized molding composition includes, per 100 parts by weight of the PVC mixture if appropriate, pigments, colorants, lubricants, blowing agents, flame retardants, fillers, reinforcing fibers or other processing auxiliaries and the following additives:(a) 0.01 to 3 parts by weight of at least one calcium carboxylate,(b) 0.01 to 3 parts by weight of at least one zinc carboxylate,(c) 0.01 to 3 parts by weight of at least one organic co-stabilizer selected from at least one .beta.-diketone, at least one organic phosphite and/or at least one dihydropyridine, and(d) 0.

Abstract: The invention relates to water-dilutable binders for cationic electrocoating finishes, the said binders containing latent primary amino groups. In order to prepare the binders, an epoxy resin is reacted with a polyamine, which in addition to a sterically hindered primary amino group also contains at least one primary amino group blocked by reaction with a ketone or aldehyde, and, if appropriate, further primary or secondary amines.

Abstract: The invention is a compound useful for emulsifying an epoxy resin in water, which corresponds toA--X--O--(CH.sub.2 CH.sub.2 O).sub.n --Rwherein:X is the residue of a difunctional compound which is capable of reacting with the primary hydroxy moiety of a monoalkylether of a polyethylene glycol and a 1,2-glycidyl ether moiety;R is C.sub.1-10 alkyl moiety; andn is a positive real number such that the composition is emulsifiable in water.In another embodiment the invention is a water emulsifiable epoxy resin composition which comprises an epoxy resin and the compounds described above. The epoxy resin compositions of this invention are useful in water-borne coating compositions.

Abstract: An improved aqueous electrocoating composition that contains a catalyst for a curing the components of the electocoating composition of a blocked polyisocyanate and an epoxy amine adduct, wherein the catalyst is alkyl tin diacetyl acetonate, preferably, dibutol tin diacetyl acetonate.

Abstract: A coating composition and method of use thereof for coating metal substrates, especially galvanically active metals, containing a resinous organic polymer, a corrosion inhibiting leachable pigment and an ion reactive pigment generally in the form of metallic spheroid particles. Coated materials have improved corrosion resistance.

Abstract: The present invention is directed to a resin composition for electric insulation materials for vehicles such as distributor caps which is prepared by blending a crystalline propylene-ethylene copolymer resin with 3 to 10 wt. % of a glass fiber, 10 to 20 wt. % of talc or mica, 5 to 20 wt. % of silica, 4 to 20 wt. % of modified polyolefin resins, 10 to 30 wt. % of halogen-containing flame retardants and 3 to 15 wt. % of flame retardant auxiliaries. In the resin composition of the present invention, balance is kept in all points of mechanical characteristics, mechanical characteristics at high temperature, electrical characteristics, nitric acid resistance, weld characteristics, blooming resistance, corona resistance and flame retardance.