Abstract: Disclosed herein is an epoxy resin composition for sealing a semiconductor, which contains a flexibilizer, epoxy resin, a hardener, a hardening accelerator, a filler, a mold releasing agent, a colorant and a finishing agent. The flexibilizer is prepared from silicone containing hydroxyphenyl groups on ends of and/or in its molecules, which is formed of a copolymer of denatured silicone oil A having hydroxyphenyl groups, denatured silicone oil B having epoxy groups and/or bifunctional epoxy resin having epoxy groups on both ends.In addition to heat resistance, moisture resistance, a low elastic modulus, a low thermal expansion coefficient and a high glass-transition temperature, the epoxy resin composition according to the present invention has toughness which is higher than that of a conventional one, due to fine dispersion of silicone.

Abstract: Transparent abrasion resistant coatings capable of withstanding 1000 hours of accelerated weathering are comprised of colloidal silicon dioxide particles dispersed in ethylenically unsaturated aliphatic and/or cycloaliphatic monomers that are substituted by a protic group. The coatings are useful in protecting plastic, wood, metal and ceramic surfaces.

Abstract: Binder mixtures crosslinkable by radiation comprising as component A a product obtained by reaction of an epoxy compound with more than one epoxide group per molecule with at least one carboxylic acid in a molar ratio of epoxide groups to carboxyl groups of 1:0.5-0.9 and subsequent reaction of the reaction product with at least one unsaturated isocyanatocarbamate esters and as component B a product obtained by reaction of an epoxy compound with more than one epoxide group per molecule with at least one olefinic unsaturated carboxylic acid in a molar ratio of epoxide groups to carboxyl groups of 1:>>1 and subsequent reaction of the reaction product with at least one polybasic carboxylic acid or anhydride(s) thereof, components A and B being present in a weight ratio of 3:1 to 1:3 useful for the product of superior photo-resists and protective lacquers.

Abstract: A rubber composition with small fluorocarbon micro-powder particles incorporated into the composition which reduces the coefficient of friction. The rubber with a lowered coefficient of friction allows for ease of movement of the rubber part against metal surfaces thereby reducing the wear of the rubber part.

Abstract: A process for the preparation of water-dilutable binders for cathodically depositable electrodeposition paints wherein 5 to 60 mol % of the epoxy groups of a resinous compound having at least two 1,2-epoxy groups per molecule are reacted with disecondary diamines obtained by the reaction of polypropylene glycol diglycidylethers or polypropylene glycol diacrylates with compounds containing a primary amino group is described. The binders prepared in accordance with the invention are suitable, in particular, for formulating electrodeposition paints, to provide films having a greater layer thickness under normal deposition conditions.

Abstract: An improved electrodepositable cationic resin is disclosed. Prior art electrodepositable cationic resins are formed from polyepoxides which are chain extended with polyether or polyester polyols to internally flexibilize the resin. Our polyepoxide resin is chain extended with amide diol which gives a resin which is hydrolytically stable and does not tend to absorb moisture.

Abstract: An improved coating composition suitable for concealing scuff marks on glass articles is provided, comprising by weight (A) from about 70 to about 100 percent of a composition comprising by weight (1) from about 50 to 75 percent of an organooxy-chainstopped organopolysilsequioxane having a viscosity of from about 5 to about 1000 centipoise at 25.degree. C., (2) from about 5 to about 15 percent of tetraorganotitanate, (3) from about 0 to about 25 percent of an organotriorganooxysilane, and (4) from about 0 to about 15 percent of a carboxylic acid ester, and (B) from about 0 to about 30 percent of a volatile diluent. The coating formed from this composition has improved cure rate and masks wet bottles uniformly and completely.

Abstract: Compositions are prepared by the reaction of (A) an advanced composition resulting from reacting (1) at least one of (a) at least one epoxidized triglyceride of a fatty acid, or (b) at least one epoxidized fatty acid having an average of more than one unsaturated group per molecule or (c) at least one diepoxyalkane, or (d) any combination of any two or more of (a), (b) or (c), or (e) a combination of any one or more of (a), (b) or (c) and (f) a diglycidyl ether of a dihydric phenol; with (2) a dihydric phenol; (B) optionally a monohydric phenol; (C) a phosphorus-containing compound; and (D) optionally a base. These compositions can be cured with curing agents which react with aliphatic hydroxyl groups.

Abstract: An electrical encapsulation composition containing an epoxy resin, a phenolic curing agent and a tris(dialkoxyphenyl)phosphine high cured glass transition temperature and good crack resistance.

Abstract: A fibrous composite structure impregnated with a solvent-free, curable epoxy resin matrix and comprising(a) a liquid epoxy resin or a liquid mixture of epoxy resins,(b) a liquid .beta.-hydroxyamine of formula I ##STR1## wherein X is phenyl or the radical R--O--CH.sub.2 --, wherein R is an alkyl group of 4 to 20 carbons or is phenyl or phenyl which is substituted by one or more C.sub.1 -C.sub.4 alkyl groups, a liquid mixture of .beta.-hydroxyamines of formula I or a liquid mixture of one more .beta.-hydroxyamines of formula I and of a primary monomaine different from formula I or of a primary or secondary diamine, and optionally(c) a catalytically curing tertiary amine,is virtually odourless, can be stored for several days at room temperature, and has good processing properties.

Abstract: Aqueous two-component systems based on epoxide resins and diamines, containing water in an amount of 1 to 20 wt. % which are prepared by mixing: (a) as a curing agent, a (cyclo)aliphatic di-primary-diamine having 2 to 12 carbon atoms, in homogeneous solution with 2-40 wt. % water, (b) as an epoxide resin component, (i) a polyglycide compound of a bisphenol, an aliphatic polyol, a polyether polyol, a dicarboxylic acid, or a mixture of these polyglycide compounds and (ii) a polyacrylate of a polyol or a polyether polyol, have a low water content, are cold-curable, yield elastic coatings with good solvent resistance, and may be applied in thick layers and with a high filler content. The systems may be used for coating inorganic and organic materials.

Abstract: Nonaqueous organic solvent solutions of phosphate esters of epoxy resins. Coating compositions containing these compositions have improved thermal properties as compared to like compositions which are dispersed in water.

Abstract: A polymaleimide/epoxy blend is cured with cyanamide to provide interlocked one-phase networks with superior thermal properties.

Abstract: An epoxy resin/curing agent composition is provided comprising (i) at least one liquid epoxy resin, (ii) a reactive epoxy-functional diluent, (iii) a thixotroping atent, (iv) a polyamide resin, (v) a polyalkylenediamine, and (vi) 2-ethyl-4-methyl imidazole or derivaties thereof. The composition is suitable for use in insitu coating and rehabilitation processes and can withstand service at elevated temperatures.

Abstract: A polyacetal resin composition is improved in the weather-resistance and comprises:(A) a polyacetal resin,(B) 0.01 to 5% by weight (based on the whole composition) of a weathering (light) stabilizer and(C) 0.01 to 10% by weight (based on the whole composition) of an acrylic oligomer of a polyester type.

Abstract: Phenol-aldehyde novolac resins having reduced quantities of 2-functional material are prepared by removing all or part of the 2-functional material from this product resulting from reacting phenol with an aldehyde. Epoxy novolac resins prepared from the novolac resin containing less 2-functional product exhibit increased Tg values when cured.

Abstract: An improved stabilizer concentrate for use in stabilizing polymeric blend compositions which comprise a thermally sensitive interpolymer. The stabilizer concentrate comprises a carrier resin, and a stabilizing agent capable of stabilizing a thermally sensitive interpolymr. The improvement comprises employing a carrier resin having a viscosity such that the stabilizer concentrate has a viscosity of less than 60 percent of the viscosity of the polymeric blend composition.

Abstract: A water resistant epoxy resin composition is disclosed, said composition comprising an epoxy resin, a compound having at least two phenolic hydroxyl groups sufficient to cure the epoxy resin component, an aromatic nitrogen-containing silane coupling agent and an inorganic filler. The epoxy resin composition is well suited for use as a sealant for electronic components.

Abstract: An epoxy resin composition for use in sealing semiconductors, having enhanced moisture resistance reliability is disclosed, which comprises an epoxy resin and an oxyacid bismuth oxyhydroxide represented by the following formula (1):Bi.sub.x O.sub.y (OH).sub.p (Y.sup.-a).sub.q (NO.sub.3).sub.r.nH.sub.2 O (1)wherein Y.sup.-a represents a residue of an oxyacid other than nitrate; a represents the ionic valence, absolute value, of the residue of the oxyacid; and x, y, p, q, r and n each represents a value satisfying the following:1.ltoreq.x 1.ltoreq.y O.ltoreq.n0.08 x.ltoreq.p.ltoreq.0.92 x0.02 x.ltoreq.aq.ltoreq.0.92 x0.ltoreq.r.ltoreq.0.

Abstract: An improved aqueous electrocoating composition that contains a reactive additive of the following formula ##STR1## wherein R is an aliphatic hydrocarbon group; finishes formed from the composition have improved cure and chip resistance.