Abstract: Halogen-free, flame retardant compositions comprising in weight percent based on the weight of the composition: A. 20 to 60% TPU/Si-g-EVA polymer blend in which the Si-g-EVA is crosslinked, B. 1 to 25% organic phosphate ester, C. 30 to 60% metal hydrate, and D. 0.1 to 10% epoxidized novolac. Optionally, the compositions further comprise in weight percent based on the weight of the composition, one or more of: E. 0.01 to 0.5% anti-dripping agent, F. 0.1 to 2% additive; and G. 0.1 to 5% filler.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract: The invention relates to a composite consisting of an impact-modified acrylic capstock or film on a thermoplastic olefin (TPO). A tie-layer containing a functionalized olefin-acrylic is used to improve the adhesion of the acrylic layer to the TPO and to improve the overall melt processing of the three-layer composite.

Abstract: Provided is a laser imageable media that forms both a vesicular bubble image and an infrared image upon exposure to laser radiation. The laser imageable media comprises (1) a substrate, preferably a transparent plastic substrate, (2) an infrared absorbing layer comprising an infrared absorbing compound, preferably an aminium radical cation compound, that exhibits a reduction in infrared absorption when exposed to the laser radiation, and (3) a polymeric layer comprising an organic polymer, preferably nitrocellulose, overlying the infrared absorbing layer. The vesicular image on a transparent plastic substrate is readable with a visible scanner without the use of any reflective background material behind the transparent plastic substrate.

Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.

Abstract: The present invention relates to a sheet for forming a hard coating and a method of formation. The present invention can provide a transfer material or a surface protection sheet having a high index of refraction and superior physical properties, such as hardness, friction resistance, abrasion resistance, chemical resistance, transparency, luster, and the like, for forming a hard coating on the surface of various molded products, including resin molded products or wood products, and a method for forming a hard coating from such transfer material or surface protection sheets.

Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: Disclosed herein are compositions and systems having a low coefficient of friction. The low friction system comprises a first surface and a second surface, where the first surface comprises (i) a polycarbonate and a first additive, or (ii) a polybutylene terephthalate and a second additive; and the second surface comprises a polyoxymethylene and a third additive. The low friction compositions and systems are valuable for producing devices, such as medical devices.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: Provided is an epoxy resin allowing a cured product that is less changed in terms of heat resistance due to thermal history and has low thermal expansion, the epoxy resin having high solvent solubility. The epoxy resin is a polyglycidyl ether of a naphthol-novolac resin including, at predetermined proportions, a trimer and a dimer that have specific structures.

Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.

Abstract: A coating system, a method of coating a substrate, and a coated substrate (e.g., a coated cement fiberboard article) include one or more latex polymers, an aliphatic epoxy resin system, optionally a silicate additive, and optionally one or more olefinic compounds and an initiator. The coating system may be applied in one or more layers and may be applied to all the surfaces of the substrate (e.g., the front side, back side and edges of a board). The coated substrate may then be coated with other optional coatings, e.g., decorative or protective topcoats.

Abstract: A coating system includes a clear coat layer and a sealant. The clear coat layer is formed from a clear coat composition that comprises a crosslinkable carbamate-functional resin and an aminoplast. Optionally, the coating system further includes a sub-clear coat layer. The sealant is bonded to the clear coat layer opposite the sub-clear coat layer. Optionally, the coating system further includes a tie coat layer and that is disposed between the sealant and the clear coat layer. An adhesion promoter is present in the clear coat composition in an amount of less than or equal to about 3% by weight based on the total weight of resin solids of the clear coat composition. Further, the adhesion promoter is present in at least one of the sub-clear coat composition and the tie coat composition in an amount sufficient to increase adhesion between the clear coat layer and the sealant.

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

Abstract: A polymer material system that consists of multiple SMP layers of different shape memory transition temperatures in a multilayer construction to achieve and tailor a multiple shape memory effect. Wherein two SMP layers of different shape memory transition temperatures are utilized, a triple shape memory effect is achieved.

Abstract: Disclosed herein is a transparent conductive polycarbonate film coated with carbon nanotubes, including a transparent conductive layer formed by applying a mixed solution of carbon nanotubes and a binder on one side or both sides of a transparent polycarbonate film, and a touch panel using the transparent conductive polycarbonate film as a lower transparent electrode. The present invention provides a transparent conductive polycarbonate film coated with a mixed solution of carbon nanotubes and a binder, by which a touch panel having high transmissivity can be manufactured by directly forming a transparent conductive layer on a polycarbonate film used as a protective film of a liquid crystal display using carbon nanotubes, without using a polyethylene terephthalate (PET) substrate used for a transparent electrode of a conventional touch panel, by which the production cost of the touch panel can be decreased, and by which a thin touch panel can be manufactured.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1?m2?3.

Abstract: There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (?1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C.