Abstract: There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (?1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C.

Abstract: The polishing pad is suitable for polishing patterned semiconductor substrates containing at least one of copper, dielectric, barrier and tungsten. The polishing pad includes a polymeric matrix; and the polymeric matrix being a polyurethane reaction product of a polyol blend, a polyamine or polyamine mixture and toluene diisocyanate. The polyol blend is a mixture of 15 to 77 weight percent total polypropylene glycol and polytetramethylene ether glycol; and the mixture of polypropylene glycol and polytetramethylene ether glycol having a weight ratio of the polypropylene glycol to the polytetramethylene ether glycol from a 20 to 1 ratio to a 1 to 20 ratio. The polyamine or polyamine mixture is 8 to 50 weight percent; and the toluene diisocyanate is 15 to 35 weight percent total monomer or partially reacted toluene diisocyanate monomer.

Abstract: A method of providing a fine line adhesive bond and/or seal or gasket and/or lined channel, and in particular a fine line bonding seal, between a first (14) and a second ply (16), especially of dissimilar materials, comprises the steps of: fabricating a microscale recess in at least a first ply; lidding the first ply with a second ply such that the recess or recesses in the ply or plies form a fluidly continuous channel (12), —urging curable material into this channel so as to substantially fill the channel with curable material, and in particular urging the material via an inlet (17) into a fluidly continuous channel until it emerges from an outlet (18) remote therefrom; curing the curable material in situ. A system for implementing the method and the bonded and/or sealed and/or lined product of such method are also described.

Abstract: The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a novel aromatic di-isoimide chemical compound. The conductive elements are thereby protected. The flexible printed wiring board is readily cured at a temperature in the range of 100 to 250° C. However, before curing, by virtue of the latent cure feature of the epoxy adhesive, the adhesive component of the printed wiring board has an extended shelf life, and avoids premature curing during processing.

Abstract: The invention relates to a decorative coating having at least one layer of two-component paint and one protective resin surface layer. The resin is translucent or transparent and the two-component paint has at least one first component of prepolymer type based on bisphenol and epichlorohydrin and at least one second component of polyamine type. Another subject of the invention is the use of such a coating for covering surfaces such as a floor or a worktop or a sink or sanitary ware of wash basin, shower cubicle, etc. type.

Abstract: The present invention deals with a laminate useful for forming fully encapsulated flexible printed wiring boards. The laminate comprises a dielectric substrate coated with a curable composition comprising an epoxy and a novel aromatic di-isoimide chemical compound. The curable composition provides the benefit of thermal latency, improving shelf-life, and reducing premature curing during processing. Fully encapsulated printed wiring boards are also disclosed.

Abstract: An ionic polymer composite device and methods for fabricating the ionic polymer composite device are provided. The ionic polymer composite device includes two extended electrode layers, each extended electrode layer including at least one ionic polymer with a plurality of electrically conductive particles, and a dielectric layer including at least one sulfonated poly ether sulfone polymer or a derivative between the two extended electrode layers.

Abstract: The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.

Abstract: A sheet which has a substrate layer containing from 21 to 87 mass % of a polycarbonate resin, from 7 to 68 mass % of a polyalkylene terephthalate resin and from 3 to 30 mass % of carbon black, and a surface layer containing from 19 to 86 mass % of a polycarbonate resin, from 6 to 67 mass % of a polyalkylene terephthalate resin and from 5 to 35 mass % of carbon black, laminated on one side or both sides of the substrate layer by extrusion, co-extrusion or extrusion coating, where the sheet has a burr incidence ratio of at most 4%, and a carrier tape using the sheet.

Abstract: The present invention provides a cation-polymerizable resin composition comprising (A) a multi-branched polyether polyol obtained from a ring-opening reaction of (a1) a hydroxyalkyloxetane and (a2) an epoxy compound having one epoxy group, (B) an alicyclic epoxy compound having at least two alicyclic epoxy groups, and (C) an acid generator, which may be used in various uses including, for example, an adhesive agent or tackiness agent for optical elements, various kinds of coating agents and the like.

Abstract: A thermally conductive sheet composite comprises a gelatinous thermally conductive sheet molded of a thermally conductive polymer composition containing a polymeric material and a thermally conductive filler, and a release sheet molded separately from the thermally conductive sheet and peelably laminated on at least one surface of a pair of surfaces of the thermally conductive sheet. The release sheet has a hardness of 30 or more as measured by a type A durometer in conformity with ISO 7619.