Abstract: An apparatus (10) and method for forming differentially frangible seals (FS) in a final closed pouch (FCP) are described. The method involves differential cooling a seal portions of pouch forming dies (15, 15A) with a fluid directed at or in a portion of the die. The method is useful for forming pouches with dual chambers separated by a frangible seal and surrounded by a hard seal, one chamber for a liquid (L) and the other chamber for another material (M). Single pouches are also described.
Abstract: A method of assembly of a NBC Filter comprising a tubular formation of an inner filter medium closed at lease one end by a metallic inner end cap, a tubular mass of granulated carbon surrounding said inner filter medium to form an outer filter medium, a tubular mesh enclosing said outer filter medium, an annular, resilient gasket surrounding said inner end cap and an outer end cap of metallic material having a peripheral skirt which, in use, surrounds one end of the mesh tube while the gasket is compressed between the outer end cap and the carbon mass. A thixotropic adhesive is interposed between the inner periphery of the gasket and the inner end cap, between the outer periphery of the gasket and mesh tube and between the gasket and the outer end cap.
Abstract: A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.
Type:
Grant
Filed:
January 18, 2000
Date of Patent:
January 15, 2002
Assignee:
Matsushita Electric Industrial Co., Ltd.
Abstract: A magnetic recording medium including a substrate and a magnetic layer on the substrate which is a Co-based alloy including Pt and/or Ir, including at least one of Ti, Zr, Hr, V, Nb, Ta, Cr, Mo, W, Ge, and Si, and including oxygen. A magnetic memory apparatus including the magnetic recording medium.
Abstract: Provided is a novel method of and system for recovering and recirculating a deuterium-containing gas. According to the inventive method, a deuterium-containing feed gas is introduced into a chamber. An exhaust gas containing deuterium is removed from the chamber. The deuterium concentration of the exhaust gas is adjusted to a predetermined value, thereby producing a concentration-adjusted gas stream. Finally, the concentration-adjusted gas stream is introduced into the chamber as the deuterium-containing feed gas. The invention makes the use of deuterium, for example, in the mass production of semiconductor devices, commercially feasible.
Type:
Grant
Filed:
February 6, 1998
Date of Patent:
December 11, 2001
Assignee:
L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation
des Procedes Georges Claude
Inventors:
Daniel Gary, Jean-Marc Girard, Jean-Christophe Rostaing, Jean-Marie Friedt
Abstract: Ceramic green sheets of controlled microporosity and method of making same have been provided. Controlled microporosity is achieved by including certain ionic species in the ceramic composition, particularly boron, phosphorus and copper oxide.
Type:
Grant
Filed:
September 11, 1996
Date of Patent:
November 20, 2001
Assignee:
International Business Machines Corporation
Inventors:
Cynthia N. Felisberto, Stephen A. Milkovich, Robert Wolff Nufer
Abstract: An apparatus for applying labels on optical discs having a base capable of supporting a label. A plunger element capable of supporting and positioning an optical disc with respect to the label and movably coupled with the base so to be capable of affixing labels on the optical disc concentrically with the rotational axis of the optical disc. A biasing element in cooperative arrangement with the base and the plunger element so as to bias the plunger element toward a position above the base. A locking mechanism that locks the plunger element into a fixed position relative to the base. A foam element positioned on the base and adapted to keeping the label horizontally oriented. A nonskid surface positioned on the bottom of the base for limiting undesired movement of the base. A positioning element coupled with the plunger element and/or the bottom of the base for positioning the biasing element within the base.
Abstract: The invention concerns a process for the production of osteosynthesis plates with a varying thickness to whatever degree. The plates are manufactured by a metal cutting process carried out on a composite structure made by a layer of the material which will form the osteosynthesis plate, bound through a layer of adhesive to a supporting layer with high thermal conductivity and mechanical strength. When the cutting process terminates, the osteosynthesis plate is separated from the supporting layer by heating the composite structure until the adhesive melts or by using a thinner suitable for the adopted adhesive.
Abstract: A process for continuously manufacturing transdermal therapeutic patches having a backing layer, a pressure-sensitive adhesive drug reservoir layer, and a removable protective layer, whereby loss of active substances during fabrication of the patches is minimized, said process being characterized in that, in a tape-like laminate having a pressure-sensitive adhesive backing layer (1) and a removable protective layer (3), single quadrangular pressure-sensitive adhesive drug reservoir sections (2) are inserted one after the other in the longitudinal direction between the layers (2,3); the clearance between said drug reservoir sections remains constant in the longitudinal direction; their width is calculated such that the backing layer (1) and the removable protective layer (3) project beyond both sides of said sections; the pressure-sensitive adhesive backing layer (1) is first cut by punching in such a way that the punching line (1a) surrounds the individual drug reservoir sections (2) at an evident distance fr
Type:
Grant
Filed:
September 22, 1995
Date of Patent:
November 13, 2001
Assignee:
LTS Lohmann Therapie-Systeme GmbH & Co. KG
Inventors:
Dieter Anhauser, Lothar Deurer, Thomas Hille, Peter Steinborn
Abstract: In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet type adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising conductive high polymer material, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet adhesive coating device.
Abstract: The invention provides pressure-sensitive adhesive (PSA) coated articles, including tapes and transfer coatings, having microstructured surfaces and methods of making pressure-sensitive adhesive articles bearing such microstructured surfaces. The performance properties of the pressure-sensitive adhesive articles can be tailored by independently varying the microstructure and the rheological properties of the pressure-sensitive adhesive.
Type:
Grant
Filed:
January 10, 2000
Date of Patent:
November 13, 2001
Assignee:
3M Innovative Properties Company
Inventors:
Mieczyslaw H. Mazurek, Robert K. Galkiewicz, Gerald M. Benson
Abstract: A method of making a flat-skinned door which simulates a three-dimensional molded skin door, and corresponding product, are disclosed. The method includes the steps of applying a basecoat(s) to the door skin, applying a woodgrain puff-ink to the skin over the basecoat in order to simulate woodgrain patterning, utilizing a printing roll(s) to print a photographic image on the door which simulates a three-dimension molded door skin, and forming a hardened non-stainable polymerized coating over the image applied by the printing roll(s). In such a manner, a flat skinned door may be made which simulates a three dimensional molded skin door.
Abstract: A method for manufacturing end products such as wound dressings, surgical dressing, fixation wafers for prostheses, ostomy wafers, shoe inner-soles, and other laminated and contoured devices using a contouring and laminating station, a delaminating station, a driving station and a cutting station. A first outer layer having a backing film protected by a support layer is attached to a subject layer having predetermined malleable properties on one surface of the adhesive material. A second outer layer is attached on an opposing surface of the subject layer. As the layers are attached, the subject layer is contoured at the contouring and laminating station to produce a first intermediate product. The support layer is removed to produce a second intermediate product at a delaminating station. The second intermediate product is driven by the driving station to the cutting station to be cut into the end products.
Abstract: Disclosed is a composite film, a method of producing a lead frame with the composite film attached, and a method of bonding a semiconductor chip to this lead frame having the composite film attached. The composite film includes a base film and an adhesive layer on one or both sides of the base film. The composite film has a thickness of T (&mgr;m), the base film has an edge tearing strength of R (kg/20 mm), the adhesive layer has a total thickness of A, and the base film has a thickness of B, T being related to R by a numerical formula R>0.6T−8 when T≦60, or by a numerical formula R≧28 when T>60, and A/B being 0.5 to 1.4.
Abstract: The invention relates to a method for producing a lammar compound for transferring optically variable elements to objects to be protected, the laminar compound comprising a carrier substrate and isolated single elements on said carrier substrate in the contour shape of the elements to be transferred. The method comprises the steps of: providing a carrier substrate; applying at least one embossable layer on said carrier substrate with the contour shape of said element to be transferred; forming a diffraction structure in said embossable layer in the form of a relief; and forming a reflecting layer on said diffraction structure.
Abstract: An apparatus for consistently and accurately applying adhesive bar code labels to a target surface on the edge of trays such as JEDEC trays. The bar code applicator includes a base having a label seat for supporting a bar code label that is to be applied to a JEDEC tray. Slidably disposed within a carriage way on the base is a carriage for holding a JEDEC tray. The carriage has a plurality of structural features that allows for the accurate and repetitive longitudinal and lateral alignment of a JEDEC tray within the carriage. The carriage also has a target window. The label seat extends up from the carriage way and into the target window of the carriage, thereby enabling a label resting on the label seat to make contact with the target surface of a JEDEC tray supported within the carriage when the carriage is moved downward with respect to the base.
Abstract: A method for making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts, juxtaposing the first and second microelectronic elements with one another, bonding electrically conductive parts of the microelectronic elements together to form electrical interconnection, providing a resilient element having one or more tacky surface regions in contact with one or more liners separately from the first and second microelectronic elements, assembling the resilient element with at least one of said microelectronic elements, and removing the resilient element from the one or more liners prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps.
Abstract: A method of manufacturing a laminate particularly adapted for bedding, padding upholstering and like applications by feeding an indeterminate length of a first material along a predetermined first path of travel from a source of the first material to a downstream assembly area. Feeding an indeterminate length of second material along a predetermined second path of travel from a source of the second material to the downstream assembly area. Depositing a multiplicity of substantially yieldable cushioning materials upon an upper surface of one of the first and second indeterminate lengths of material during the feeding thereof between the respective sources and the assembly area. Thereafter, sandwiching the cushioning materials between the indeterminate lengths of first and second materials to form a laminate therefrom, and rolling the laminate into a roll. The cushioning materials are foam latex and/or down and the first and second lengths of material are polyester fiber material and/or convoluted foam.
Type:
Grant
Filed:
December 2, 1999
Date of Patent:
September 18, 2001
Inventors:
Steven Antinori, Manuel Fernandez, William Harp
Abstract: The present invention is directed to a cold seal package that includes constructions wherein two substrates, or two portions of one substrate, are sealingly engaged to one another using a substantially natural latex rubber-free contact adhesive. The two substrates can be easily peeled apart without substantial damage to the substrates. Furthermore, the substrates cannot typically be resealed, or refastened, once peeled apart. That is, the cold seal formed by the adhesive between the substrates is substantially non-refastenable. Advantageously, a cold seal package of the present invention is particularly well suited for aseptic delivery of packaged goods, such as bandages, dressings, and the like.
Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
Type:
Grant
Filed:
July 26, 2000
Date of Patent:
September 4, 2001
Assignee:
Medtronic, Inc.
Inventors:
Samuel F. Haq, Patrick F. Malone, Donald P. Varner