Patents Examined by Cynthia Hamilton
  • Patent number: 10451971
    Abstract: [Problem] To provide a composition for an underlayer, which can form an underlayer having flattened surface. [Means for Solution] A composition for forming an underlayer, comprising a polymer having a repeating unit containing nitrogen and a solvent. An underlayer is formed by coating this composition on a substrate, preferably baking in an inert atmosphere, and then baking in the air containing oxygen.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: October 22, 2019
    Assignee: AZ Electronic Materials (Luxembourg) S.a.r.l.
    Inventors: Masato Suzuki, Yusuke Hama, Hiroshi Yanagita, Go Noya, Shigemasa Nakasugi
  • Patent number: 10451970
    Abstract: The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000. This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: October 22, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hitoshi Maruyama, Kazunori Kondo, Michihiro Sugo
  • Patent number: 10450417
    Abstract: Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: October 22, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Yu Iwai, Akinori Shibuya
  • Patent number: 10451969
    Abstract: Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: October 22, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takenori Fujiwara, Yugo Tanigaki
  • Patent number: 10416559
    Abstract: A film material includes a support film having a transmittance of at least 60% with respect to light of wavelength 300-450 nm, and a resin layer containing 0.001-10 wt % of a basic compound with a molecular weight of up to 10,000, and having a thickness of 1-100 ?m. A pattern is formed by attaching the resin layer in the film material to a chemically amplified negative resist layer on a wafer, exposing, baking, and developing the resist layer. The profile of openings in the pattern is improved.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: September 17, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Satoshi Asai, Kyoko Soga, Hideto Kato
  • Patent number: 10409160
    Abstract: Embodiments in accordance with the present invention encompass self-imagable polymer compositions containing a variety of photobase generators which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. The compositions of this invention can be tailored to form positive tone or negative tone images depending upon the intended application in aqueous developable medium. The images formed therefrom exhibit improved properties including low wafer stress and better thermo-mechanical properties, among other property enhancements.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 10, 2019
    Assignee: PROMERUS, LLC
    Inventors: Pramod Kandanarachchi, Larry F Rhodes, Hendra Ng, Wei Zhang, Brian Knapp
  • Patent number: 10394127
    Abstract: Provide are a pattern forming method including a step (1) of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition including a resin having an acid-decomposable repeating unit capable of decomposing by the action of an acid to generate an acid having a pKa of 3.0 or less, a step (2) of exposing the film using actinic rays or radiation, and a step (3) of carrying out development using a developer including an organic solvent after the exposure to form a negative tone pattern; and a method for manufacturing an electronic device, including the pattern forming method.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: August 27, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Wataru Nihashi, Hideaki Tsubaki, Toru Tsuchihashi, Tomotaka Tsuchimura
  • Patent number: 10386720
    Abstract: Provided are a polymer that can be favorably used as a positive resist having a high ? value and a positive resist composition that can favorably form a high-resolution pattern. The polymer includes an ?-methylstyrene unit and a methyl ?-chloroacrylate unit, and has a molecular weight distribution (Mw/Mn) of less than 1.48. The positive resist composition contains the aforementioned polymer and a solvent.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: August 20, 2019
    Assignee: ZEON CORPORATION
    Inventor: Manabu Hoshino
  • Patent number: 10336924
    Abstract: An pressure sensitive adhesive composition according to the present invention includes: an acrylic copolymer; a multifunctional acrylate-based compound; and a photoinitiator, in which the acrylic copolymer includes a repeating unit derived from an acrylate-based monomer having a Tg of ?20° C. or less and a repeating unit derived from an unsaturated carboxylic acid monomer, and the repeating unit derived from the unsaturated carboxylic acid monomer is included in an amount of 10 to 50 parts by weight based on the total 100 parts by weight of the acrylic copolymer.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: July 2, 2019
    Assignee: Dongwoo Fine-Chem Co., Ltd.
    Inventors: Joong Han Kum, Jeong Ho Yoo, Kyoung Moon Jung, Bong Jin Choi, Han Young Choi
  • Patent number: 10331031
    Abstract: A resin composition comprises a polymer comprising a structural unit that comprises a group represented by formula (1), and a solvent. In the formula (1), R1 to R4 each independently represent a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 20 carbon atoms, wherein at least one of R1 to R4 has the fluorine atom or a group including the fluorine atom. R5 represents a substituted or unsubstituted trivalent chain hydrocarbon group having 1 to 7 carbon atoms. * denotes a binding site to other moiety of the structural unit. The structural unit is preferably represented by any one of formulae (2-1) to (2-3). In the formulae (2-1) to (2-3), Z represents a group represented by formula (1).
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: June 25, 2019
    Assignee: JSR CORPORATION
    Inventor: Hayato Namai
  • Patent number: 10331032
    Abstract: Photosensitive, developer-soluble bottom anti-reflective coatings are described. Compositions and methods of forming the same are also disclosed along with resulting microelectronic structures. The anti-reflective compositions comprise a multi-functional epoxy compound having multiple epoxy moieties pendant therefrom and one or more crosslinkable chromophores bonded thereto. The compounds are dispersed or dissolved in a solvent system with a vinyl ether crosslinker and can be used to create crosslinkable and de-crosslinkable coatings for microelectronics fabrication.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: June 25, 2019
    Assignee: Brewer Science, Inc.
    Inventors: Joyce Lowes, Jinhua Dai, Alice Guerrero
  • Patent number: 10323113
    Abstract: A resist composition comprising a base polymer and a sulfonium or iodonium salt of iodized benzoyloxy-containing fluorinated sulfonic acid offers a high sensitivity and minimal LWR or improved CDU independent of whether it is of positive or negative tone.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: June 18, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Masaki Ohashi, Takayuki Fujiwara, Masahiro Fukushima, Kazuya Honda
  • Patent number: 10324375
    Abstract: Provided is a photosensitive resin composition comprising (A) a resin having a phenolic hydroxyl group; (B) an aliphatic or alicyclic epoxy compound having two or more oxirane rings; (C) a photosensitive acid generator; and (D) a solvent; wherein the photosensitive resin composition comprises 20 to 70 parts by mass of the component (B) relative to 100 parts by mass of the component (A).
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: June 18, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kenichi Iwashita, Yasuharu Murakami, Hanako Yori, Tetsuya Kato
  • Patent number: 10324374
    Abstract: There is provided an active light sensitive or radiation sensitive resin composition which contains (A) an alkali soluble resin and (C) a cross-linking agent represented by the following General Formula (1-0).
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: June 18, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Shuhei Yamaguchi, Tomotaka Tsuchimura, Natsumi Yokokawa, Koutarou Takahashi
  • Patent number: 10303057
    Abstract: Various polycycloolefinic polymers containing phenolic pendent groups and compositions thereof useful for forming self-imageable films encompassing such polymers are disclosed. Such polymers encompass norbornene-type repeating units containing phenolic pendent groups which contain very low levels of fluorine containing monomers. The films formed from such polymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 28, 2019
    Assignee: PROMERUS, LLC
    Inventors: Edmund Elce, Royce Groff
  • Patent number: 10295904
    Abstract: A resist composition comprising a base polymer and a sulfonium salt of iodized benzoic acid offers a high sensitivity and minimal LWR independent of whether it is of positive or negative tone.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: May 21, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Masaki Ohashi
  • Patent number: 10294183
    Abstract: The compound according to the present invention is represented by a specific formula. The compound according to the present invention has a structure according to the specific formula, and therefore can be applied to a wet process and is excellent in heat resistance and etching resistance. In addition, the compound according to the present invention has such a specific structure, and therefore has a high heat resistance, a relatively high carbon concentration, a relatively low oxygen concentration and also a high solvent solubility. Therefore, the compound according to the present invention can be used to form an underlayer film whose degradation is suppressed at high-temperature baking and which is also excellent in etching resistance to oxygen plasma etching or the like. Furthermore, the compound is also excellent in adhesiveness with a resist layer and therefore can form an excellent resist pattern.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: May 21, 2019
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takashi Makinoshima, Masatoshi Echigo
  • Patent number: 10295907
    Abstract: A resist underlayer film-forming composition for lithography capable of being dry-etched during pattern transfer from the upper layer or during substrate processing and capable of being removed with an alkaline aqueous solution after the substrate processing. A resist underlayer film-forming composition for lithography includes a polymer (A) including a unit structure of Formula (1) and a unit structure of Formula (2); a crosslinkable compound (B) having at least two groups selected from blocked isocyanate groups, methylol group, or C1-5 alkoxy methyl groups; and a solvent (C), characterized in that the polymer (A) is a polymer in which the unit structure of Formula (1) and the unit structure of Formula (2) are copolymerized in a mol % ratio of the unit structure of Formula (1):the unit structure of Formula (2)=25 to 60:75 to 40.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: May 21, 2019
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Ryo Karasawa, Yasunobu Someya, Takafumi Endo, Tokio Nishita, Rikimaru Sakamoto
  • Patent number: 10289002
    Abstract: An electron beam resist underlayer film-forming composition includes a polymer containing a unit structure having a lactone ring and a unit structure having a hydroxy group. The polymer may be a polymer obtained by copolymerizing a monomer mixture containing a lactone (meth)acrylate, a hydroxyalkyl (meth)acrylate, and phenyl (meth)acrylate or benzyl (meth)acrylate. A method for producing a semiconductor device including: applying the electron beam resist underlayer film-forming composition onto a substrate and heating the applied composition to form an electron beam resist underlayer film; coating the electron beam resist underlayer film with an electron beam resist; irradiating the substrate coated with the electron beam resist underlayer film and the electron beam resist with an electron beam; developing the substrate; and transferring an image onto the substrate by dry etching to form an integrated circuit element.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: May 14, 2019
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Yasushi Sakaida, Ryuta Mizuochi, Rikimaru Sakamoto
  • Patent number: 10289001
    Abstract: A pattern forming method includes forming a photosensitive resin composition layer on at least one surface of a substrate using a photosensitive transfer material, exposing the photosensitive resin composition layer; and developing the exposed photosensitive resin composition layer, in which the photosensitive transfer material includes a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, and the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: May 14, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Ito, Shinji Fujimoto, Yasumasa Kawabe