Abstract: A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, acid anhydride latent heat activated curing agent and an accelerator for the acid anhydride curing agent characterized in that 2-phenylimidazole phosphate salt is the accelerator.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.

Abstract: A process for producing a phenolic resin of good hue, characterized by reacting a hydroxylated aromatic compound with an unsaturated cyclic hydrocarbon compound in the presence of both active hydrogen and a reducing metal compound with the aid of an acid catalyst, subsequently deactivating the catalyst, and then removing the catalyst, the metal compound, and the starting materials remaining unreacted; and a process for producing an epoxy resin which comprises a step of reacting the phenolic resin with an epihalohydrin. By these processes, a phenolic resin and an epoxy resin are obtained which each is colored little and has an excellent hue. These resins are useful as resins for electrically insulating materials, especially as resins for semiconductor encapsulation materials and for laminated plates.

Abstract: The present invention relates to a single-packaged epoxy resin coating composition comprising: (A) an epoxy resin having at least one epoxy group in a molecule and capable of being dissolved in the following organic solvent (D), (B) a ketimines compound having at least two primary amino groups blocked with a carbonyl compound and having no other amino groups than the above blocked amino groups, (C) a dehydrating agent and (D) an organic solvent, wherein the above organic solvent (D) comprises a hydrocarbon base solvent selected from the group consisting of an aliphatic hydrocarbon base solvent and an aromatic hydrocarbon base solvent having a boiling point of 148° C. or higher in a proportion of at least 95% by weight based on the above organic solvent (D).

Abstract: A curable composition comprises a compound having at least one epoxy group and at least one styrenic or cinnamyl group per molecule.

Abstract: A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, dicyandiamide latent heat activated curing agent and an accelerator for the dicyandiamide curing agent characterized in that an imidazole phosphate salt is the accelerator.

Abstract: Fire resistant adhesive resins that include a halogen-free and bromine-free flame retardant ingredient and conductive foils coated with the halogen-free fire resistant adhesive resin coated compositions of this invention as well as printed circuit boards manufactured using the adhesive resin coated conductive foils.

Abstract: The invention is directed to novel epoxy molding compounds for the encapsulation of microchips in the electronics industry. Known epoxy molding encapsulants are generally prepared from a blend epoxy resins, phenol hardeners, silica fillers, catalysts, flame retardant materials, processing aids and colorants. The addition of polybenzoxazines as a co-reactant with one or several epoxy resins provides a product with reduced moisture adsorption while maintaining a high glass transition temperature.

Abstract: A curable vinyl ester resin composition capable of undergoing B-staging at room temperature comprises (a) an unmodified vinyl ester resin; (b) a reactive diluent consisting of an ethylenically unsaturated monomer; (c) a free-radical curing agent; (d) a B-staging agent comprising a Group II metal oxide or hydroxide, or a mixture thereof; and (e) a thickening agent comprising an ester, a ketone, an aldehyde or a mixture thereof. The thickening agent coacts with the B-staging agent to cause B-staging of the vinyl ester resin at room temperature. The vinyl ester resin composition according to the invention is particularly useful for impregnating a fibrous material such as a woven fabric material. The fibrous material impregnated with the vinyl ester resin composition of the invention has a shelf life of up to 12 months. B-staging is generally reached in about two weeks following mixture of the various components and impregnation of the fibrous material.

Abstract: Blends of novolaks and cyanates, such blends can be thermally hardened in a short time and without using a catalyst and have an excellent storage stability. The resins obtained by the blends can be used as binding agents in abradants or as chip coverings or printed circuit boards (PCB) in electronics.

Abstract: A curing agent for epoxy resin which comprises at least one selected from the compound of the formula (1) and its salt, as an effective component wherein X is —(CH2)n- or —(CH2)1-Y—(CH2)m- , Y is —N(R1)—, —O— or —S—, R1 is alkyl having 1 to 8 carbon atoms or amino. n is a number of 2, 3, 5 to 11, 1 and m are each a number of 1 to 8.

Abstract: A powder coating composition and method of applying it to a substrate, such as medium density fibreboard, consisting of a glycidyl methacrylate resin, a dicarboxylic acid cross-linking agent, a catalyst selected from phosphines, phosphonium, ammonium 2-phenyl-2-imidazoline, substituted imidazoline and isopropyl imidazole Bis-A epoxy resin adduct and a matte texturing agent. The inventive formulation is able to create a matte texture finish on the surface of the substrate. Since the cured final coating is resistant to yellowing and moisture, it is of great utility in the kitchen cabinet making industry.

Abstract: The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. The present invention includes the polymerization of epoxy resins, vinyl ethers and other cationically curable monomers.

Abstract: A chemical anchoring adhesive having a solid, putty-like consistency includes two parts in direct contact with each other along an interface. The first part includes about 20-45% by weight of an epoxy resin, about 10-40% by weight of a first particulate filler having an oil absorption value of at least about 30, and about 40-65% by weight of a second particulate filler, at least about 70% of which has a U.S. Sieve size between 16 and 45. The second part includes about 5-20% by weight of an aliphatic amine compound, about 0.1-15% by weight of a tertiary amine compound, about 1-23% by weight of a first particulate filler having the oil absorption described above, and about 52-87% by weight of a second particulate filler having the U.S. Sieve size described above.

Abstract: A novel aqueous resin composition for use as a sealer is provided, including an aqueous resin as a major component, and a viscosity modifier adjusting the viscosity of the aqueous resin composition to a value ranging from 5,000 to 100,000 mPa·s, the aqueous resin being an aqueous emulsion polyolefin resin which comprises a polyolefin not containing chlorine as a constituent element while exhibiting a viscosity of 1,000 mPa·s or higher in a water-dispersed state having a solid resin content of 20% to 40% by weight.

Abstract: Self-dispersing, hardenable epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: A cationic electrodeposition coating composition is provided which contains blocked isocyanate curing agent which is blocked with a substance not recognized as a HAPs (hazardous atmospheric pollutant). The cationic electrodeposition coating composition of the present invention contains a cationic group-containing epoxy modified base resin and a blocked isocyanate curing agent, wherein said blocked isocyanate curing agent is obtained by reacting a polyisocyanate compound with, as a blocking agent, a terminal primary OH-containing propylene glycol monoalkyl ether and expressed by the formula RO(CH(CH3)CH2O)nH (where R is an alkyl group having 1 to 8 carbons, which may be branched, and n is 1 to 3).

Abstract: Provided are a thermosetting resin composition for build-up method which gives a cured product excellent in heat resistance, an insulating material for build-up method using thereof and a build-up print circuit board. The thermosetting resin composition for build-up method comprises (A) an epoxy resin represented by formula (I), (B) a curing agent for epoxy resin and (C) a poly(ether sulfone), an insulating material for build-up method and a build-up print circuit board using thereof. in the formula, Gly represents glycidyl group: R represents each independently, an alkyl group having 1 to 10 carbons, and the like; i represents each independently a numeral of 0 to 4; when i is 2 or more, R may be the same or different from each other; and n represents a repeating number of 1 to 10.

Abstract: An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. The epoxy resin composition includes an aromatic epoxy resin having at least di-functionality, an aromatic amine compound and/or an alicyclic amine compound, wherein 5 minutes after the main agent comprising the epoxy resin and the curing agent comprising the aromatic amine compound and/or the alicyclic amine compound are mixed, the composition shows a viscosity at 25° C. in the range of from 1 to 1500 mPa sec, and Tc, tc, and Tg satisfy the following equation (1): Tg≧Tc+20−k×(Tc−90)  (1), wherein k=0 when 60≦Tc<90 and k=0.35 when 90≦Tc≦200; Tc is the highest temperature (°C.