Abstract: The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.

Abstract: A liquid thermosetting insulating resin composition and a method for permanently filling holes in a printed circuit board by the use of the composition are provided. The liquid thermosetting insulating resin composition comprises (A) an epoxy resin assuming a liquid state at room temperature, preferably in combination with (B) a phenolic resin assuming a liquid state at room temperature, (C) a curing catalyst, and (D) a filler, wherein the filler (D) contains a spherical filler and a ground filler. Preferably the spherical filler includes a spherical fine filler and a spherical coarse filler. In a method for permanently filling holes in the printed circuit board, the composition is applied to the board so as to fill the holes in the printed circuit board and precured by application of heat. Thereafter, the parts of the precured composition protruding from a surface defining the holes is removed by polishing and then the precured composition is further heated to cause final curing thereof.

Abstract: A composition suitable for use in dental medicine and/or dentistry polymerizable by cationic polymerization consists of one or more epoxy compounds, a plasticizer, a catalyst for hardening by ring opening, a catalyst for hardening by light and an accelerator consisting of a non alkaline tertiary amine. At radiation with a light having a wavelength of 340-500 nm the composition hardens practically free of contraction and adhesiveness.

Abstract: This invention provides, at a low cost, a low-pollution type cationic electro-coating bath composition which contains neither lead nor chromium, and which comprises cationic electrodeposition paint and, contained therein, a bismuth oxide paste, the amount of the bismuth oxide paste being within a range of 0.1 to 0.3% by weight as metal bismuth on the basis of total solid content of said cationic electro-coating bath composition, and the bismuth oxide paste being prepared by dispersing bismuth oxide (B) in an organic acid-neutralized aqueous dispersion of diethanol amine-added alicyclic epoxy resin (A).

Abstract: A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device.

Abstract: The invention relates to two-component preparations comprising components (I) and (II), wherein at least one component comprises epoxy compounds and the preparations cure by cationic polymerization, initiated by Lewis and/or Brönsted acids, after mixing of the two components, the preparations comprising the Lewis and/or Brönsted acids in the form of precursor compounds which are suitable for the formation of Lewis and/or Brönsted acids.

Abstract: A solventless non-filler underfill material for COF mounting comprising an organic material, which is used to fill the gap between an FPC having a polyimide film substrate and a copper circuit layer having a thickness of 9 &mgr;m or smaller and an IC chip mounted on the FPC, exhibits such adhesion as to destroy a silicon wafer in a polyimide film/silicon wafer adhesion test, and provides a cured film having a tensile modulus of 150 kg/mm2 or less.

Abstract: This invention relates to foundry binder systems, which will cure in the presence of sulfur dioxide and a free radical initiator, comprising (a) an epoxy resin; (b) an acrylate; (c) an alkyl silicate; and (d) an effective amount of a free radical initiator. The foundry binder systems are used for making foundry mixes. The foundry mixes are used to make foundry shapes (such as cores and molds) which are used to make metal castings, particularly ferrous castings.

Abstract: The present invention provides a modifying agent for resins for paints or resins for inks, containing fatty acids obtained by the enzymatic decomposition of vegetable oils or fats, the resins for paints or resins for inks modified with the modifying agent, and a paint or ink composition containing the resin for the paint or resin for the ink. The paint or ink composition of the present invention has electrodeposition potential or UV curing property and is excellent in the appearance of the paint film, finishing sharpness and adhesion.

Abstract: A process of micro-encapsulating a volatile liquid includes selecting a volatile liquid, such as Isophorone, and porous ceramic particles for encapsulating the volatile liquid. The volatile liquid and porous particles are mixed and a vacuum is applied to the mixture to impregnate the volatile liquid in the porous particles. A polymer catalyst for the polymer resin, such as an epoxy catalyst for use with an epoxy resin, is mixed with the volatile liquid and porous particles to saturate the particles. The polymer resin, such as epoxy resin, is added to the mixture for forming a resin cured shell around the porous particle holding the volatile liquid to form a microencapsulated volatile liquid. The resin is only cured on the outer shell of the porous particle when coming in contact with the catalyst supported with the volatile liquid in the porous particle.

Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomical in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of a bisphenol-A curing agent or a polyester curing agent; 0.1 to 20 parts by weight of a defoaming agent; and 0.1 to 20 parts by weight of a leveling agent.

Abstract: A clear coat dicyandiamide cured epoxy powder coating for non-metallic substrates wherein the finish coat is visually haze-free as a result of the addition of a small amount of an aromatic substituted urea compound. Non-metallic substrates, such as brass, cannot withstand extremely high temperatures which are required to cure well known powder coatings. However, coating systems which cure at lower temperatures often produce a haze within the finish clear coat. The present invention alleviates this problem.

Abstract: An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction between a polyphenylene oxide and a phenol compound in the presence of a reaction initiator which can be decomposed to generate an alcohol, a prepreg and a metal-clad laminate of the invention contain the epoxy resin composition.

Abstract: An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the electrical stability.

Abstract: The present invention relates to a phosphorous-containing flame retarding epoxy resin and their composition comprising the nitrogen-containing flame retarding epoxy resin. More specifically, the present invention relates to a flame retarding epoxy resin having a pendent phosphorous-containing functional group and their composition comprising the nitrogen-containing flame retarding epoxy resin. The flame retarding phosphorous-containing epoxy resin and the epoxy resin composition containing the same of the present invention possess excellent flame retarding property and heat resistance without containing halogen and diantimony trioxide. Therefore they are useful as an encapsulating material in the semiconductor industry and the cured article prepared from the composition exhibits excellent molding ability and excellent reliance.

Abstract: The invention relates to a novel process for the preparation of polycondensate solutions based on polyamidoamine/epichlorohydrin resins that gives products having a very low content of organic chlorine compounds, in particular a 1,3-dichlorophenol-2-propanol content of <0.1%, in combination with high activity and good shelf-life.

Abstract: A water based coating composition prepared by reacting an epoxy resin (A) having a bisphenol A skeletal structure and a carboxyl group-containing acrylic resin (B) in the presence of an amine compound to form an acrylic-modified epoxy resin (C), and neutralizing, and dispersing the acrylic-modified epoxy resin (C) into an aqueous medium, an amount of a quaternary ammonium salt in the acrylic-modified epoxy resin (C) being in the range of 3.0×10−4 mol or less per one gram of the resin.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: Pigment pastes suitable for the production of cathodically depositable electrodeposition lacquers (CEC) obtainable by dispersion of pigments and/or fillers in an aqueous paste resin containing tertiary-bonded amino nitrogen, whereby epoxy compounds and, if not already present, acid are added to the aqueous paste resin in the presence of pigments and/or fillers, process for their production and CEC coating compounds containing the same.

Abstract: A cured resin plate which is reduced in undulation and has excellent flatness even when having a thickness of 100 &mgr;m or larger or a size exceeding 2 inches; and a process for efficiently mass-producing the resin plate. The process comprises spreading a resinous coating fluid A on a support (5) having a smooth surface to form an unsolidified or solidified coating layer, spreading thereon a resinous coating fluid B which is the same as or different from the coating fluid A to form two or more superposed layers of the coating fluid B, and solidifying the layers (12, 22, and 42) separately or simultaneously to thereby form superposed resin layers (1, 2, and 4) adhered to each other which comprise two or more adjacent cured resin layers (1 and 2). The multilayered resin plate comprises superposed layers adhered to each other which are composed of a thermoset epoxy resin layer and superposed thereon a thermoset epoxy resin layer having a smaller thickness than that layer.