Patents Examined by Dameon Levi
  • Patent number: 8228678
    Abstract: A portable electronic apparatus having a first case, a second case, and a two-axis hinge mechanism. Positional misalignment between both cases can be easily prevented without relying only on dimensional precision of the components of the two-axis hinge mechanism. The portable electronic apparatus has a hinge (4) for interconnecting the first and second cases so that they can be opened and closed about a first rotation axis (X) and at the same time interconnecting the first and second cases so that they can pivot about a second rotation axis (Y). The hinge (4) has a first case fixing component (122) fixed to the first case, a first connection component (452) connected to the first case fixing component (122) so as to be rotatable about the second rotation axis (Y), and a second connection component (461) connected to the second case so as to be rotatable about the first rotation axis (X). The first connection component (452) and the second connection component (461) are connected to each other with a screw.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: July 24, 2012
    Assignee: KYOCERA Corporation
    Inventors: Takashi Hasegawa, Motonori Imamura
  • Patent number: 8228689
    Abstract: Disclosed is an internal cable system that communicates signals in an electronic device. The system uses a printed circuit board with active circuits that is connected to a standard communication cable. The printed circuit board is exposed to air flow from the cooling system of the electronic device for proper operation of the active components of the active circuits on the printed circuit board. The standard cable may include a SCSI internal cable or other similar signal communication cables. Signal integrity is enhanced using the active circuits that are mounted on the printed circuit board. Power is supplied to the printed circuit board through inactive conductors in the cable or conductors that would otherwise be used for grounding.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: July 24, 2012
    Assignee: LSI Corporation
    Inventor: Alan T. Pfeifer
  • Patent number: 8223504
    Abstract: A structure for supporting a printed wiring board housed in a housing of an electronic device. The supporting structure includes a first projection formed on the housing and projecting toward the printed wiring board. The electronic device includes a conductor plate, which is grounded and accommodated in the housing. A second projection is formed on the conductor plate and projects toward the printed wiring board. The printed wiring board includes a substrate and a ground layer, which is arranged on the substrate. The first projection of the housing and the second projection of the conductor plate hold and support the printed wiring board in between and thereby electrically connect the ground layer to the conductor plate.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: July 17, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Kazunori Kotani
  • Patent number: 8223507
    Abstract: An electronic circuit having a circuit board, a shield frame and a shield cover is provided. The shield frame is provided on the circuit board along a fringe of an area of the circuit board. The shield frame is discontinuous at a portion on the fringe. The shield cover is fastened to the shield frame so as to cover the area having the fringe along which the shield frame is provided.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: July 17, 2012
    Assignee: Fujitsu Toshiba Mobile Communications Limited
    Inventor: Yoshihiro Tanno
  • Patent number: 8223500
    Abstract: A memory card includes a circuit board, semiconductor chips mounted on different areas on the circuit board, a semiconductor chip with a semiconductor electrode on its top face and being fixed such that at least a part of its bottom face faces at least a part of a top face of the semiconductor chip, a wire for connecting the semiconductor electrode and a board electrode on the circuit board to achieve a mounting state of the semiconductor chip, and a cover for covering a circuit formation area from an upper side of the circuit board. The circuit formation area includes three semiconductor chips and the wire. At least a part of each of three semiconductor chips, at least a part of the circuit board, and the wire are covered with secondary sealing resin and primary sealing resin.
    Type: Grant
    Filed: May 26, 2008
    Date of Patent: July 17, 2012
    Assignee: Panasonic Corporation
    Inventors: Yuichiro Yamada, Hidenobu Nishikawa, Hiroyuki Yamada, Shuichi Takeda
  • Patent number: 8213183
    Abstract: An electronic device includes a case, a board module, and an electrostatic discharging module. The case has a conductive area. The board module is disposed in the case and has a ground end. The electrostatic discharging module is disposed on the case. Besides, the electrostatic discharging module includes a first discharging element and a second discharging element. The first discharging element is electrically connected to the ground end, and the second discharging element is electrically connected to the conductive area. There exists a gap between the first discharging element and the second discharging element, so that leak current generated by the board module can be prevented from being transmitted to the case, and that an electrostatic charge can be transmitted from the case to the ground end.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: July 3, 2012
    Assignee: Compal Electronics, Inc.
    Inventors: Chun-Lung Juan, Kuo-Cheng Chu
  • Patent number: 8208263
    Abstract: An electronic device includes a housing having an aperture and a main circuit board disposed in housing. The main circuit board includes an edge and a plurality of contact surfaces located at the edge proximate to the aperture, whereby a mating connector is connectable to the contact surfaces by inserting the mating connector into the housing from outside of the housing via the aperture. An update connector adapter includes a support structure and a mating connector mounted on the support structure. The mating connector includes a plurality of contact terminals for contacting the contact surfaces. The update connector adapter further includes an update connector mounted to the support structure. A programming unit is connectable to the update connector for programming the main circuit board. The control unit may be programmed by inserting the update connector adapter into the aperture and connecting the mating connector to the contact surfaces.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: June 26, 2012
    Assignee: Harman Becker Automotive Systems GmbH
    Inventor: Kai Seifried
  • Patent number: 8208264
    Abstract: An electronic control device is described for controlling an automatic transmission, having a control circuit an integrated plug connector and an integrated position sensor in a housing, the position sensor including a stator and a rotor. In order to improve the production quality of the position sensor, the stator of the position sensor is enclosed by the material of the housing in a stationary manner.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: June 26, 2012
    Assignee: Robert Bosch GmbH
    Inventor: Michael Heim
  • Patent number: 8203853
    Abstract: A chip filter and supplementary tool combination is disclosed. The chip filter includes a insulative holder base having two arrays of wire grooves arranged along two opposing sidewalls thereof and soldering zones defined in a finished surface on each sidewall corresponding to the wire grooves, connection terminals each having a base portion respectively embedded in the soldering zones in the sidewalls of the insulative holder base and a soldering surface respectively kept in flush with the top edge of the associating sidewall, and filter elements having lead wires thereof respectively extending out of the insulative holder base through the wire grooves and respectively rested on the soldering surfaces of the connection terminals and held down in position by the supplementary tool for soldering by an automatic soldering machine.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: June 19, 2012
    Assignee: U.D. Electronic Corp.
    Inventor: Po-Jung Chen
  • Patent number: 8203852
    Abstract: A retention assembly for an expansion card in an enclosure, the expansion card having an expansion card cover plate. The retention assembly includes an expansion card mounting frame, a limiting member, a resisting member, and an elastic member. The expansion card mounting frame is disposed on the enclosure to fix the expansion card cover plate. The limiting member is disposed on the enclosure adjacent to the expansion card mounting frame, and the limiting member and the enclosure cooperatively define a guide groove. The resisting member includes a resisting portion and a limiting portion connected to the resisting portion and slidably received in the guide groove. The elastic member interconnects the expansion card mounting frame and the resisting member. The resisting portion resists the expansion card cover plate by a resilient force applied by the elastic member.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: June 19, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Wei-Jun Wang
  • Patent number: 8199527
    Abstract: When manufacturing an electronic component having a flip chip or a surface mount component mounted on a sheet substrate and being covered with a shield cover, the above shield cover is dipped into cream solder and placed on the above sheet substrate after the above cream solder is attached to the peripheral edge sides of the above shield cover, and then the shield cover is fixed to the sheet substrate by reflow process. With such manufacturing, it becomes possible to efficiently fix the shield cover to the sheet substrate. Also, the shield cover can securely be fixed against the bend of the sheet substrate produced during the reflow.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: June 12, 2012
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Masakazu Muranaga
  • Patent number: 8194393
    Abstract: There is provided a capacitor unit including plural capacitors, each including end face electrode at one end face and side face electrode having a polarity different from end face electrode at a side face, arranged side by side; bus bar connected to end face electrode of capacitor, and partially connected to side face electrode of adjacent capacitor unit; and a circuit substrate arranged at the one end face sides or the other end face sides of plural capacitors; wherein bus bar and the circuit substrate are electrically connected through conductive portion arranged from bus bar towards the circuit substrate.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: June 5, 2012
    Assignee: Panasonic Corporation
    Inventors: Tatehiko Inoue, Shusaku Kawasaki, Kimiyasu Kakiuchi
  • Patent number: 8189345
    Abstract: Various embodiments of the invention relate to electronics modules, enclosure assemblies housing at least one such electronics module, and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In one embodiment, an electronics module includes a first plate extending generally in a first plane, and a second plate spaced from the first plate and extending generally in a second plane. The electronics module further includes a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates. Each electronic board assembly may be positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: May 29, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: John W. Rapp, Nicholas J. Nagurny, Brent I. Gouldey, Mark Jones, Wendy S. Normark
  • Patent number: 8189348
    Abstract: In one embodiment, the present disclosure refers to an apparatus comprising a bracket having a base configured to receive and hold a first electronic element. The bracket comprises at least one flange extending from the base and at least one guide acting to align the bracket and first electronic element with a second electronic element. The bracket also comprises at least one fastener aligned with the at least one guide and acting to engage and hold the second electronic element.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: May 29, 2012
    Assignee: Cisco Technology, Inc.
    Inventors: Mohammad Reza Danesh Kadivar, Hong Huynh, Saeed Seyed, James T. Theodoras, II, Susheela Narasimhan
  • Patent number: 8184441
    Abstract: A flash memory device includes a cover, an electrical module, a slider and a rotatable member for driving the slider. The cover defines a receiving chamber and an opening communicating with the receiving chamber. The electrical module is slideably received in the receiving chamber and includes a circuit board and a connector port electrically connected with the circuit board. The rotatable member has a fixed axis around which the rotatable member revolves. The rotatable member includes a protrusion slideably received in a slot defined in the slider. The connector port is driven to telescopically extend through the opening by the slider which is further driven by the protrusion.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: May 22, 2012
    Assignee: A-Data Technology (Suzhou) Co., Ltd.
    Inventors: Xiao-Xia Meng, Cheng-Chung Kung
  • Patent number: 8179694
    Abstract: A system for protecting an electronic device from cosmic rays includes a frame in which the circuit is disposed, a cosmic ray detection circuit and a protection circuit. The cosmic ray detection circuit is supported by the frame and is spaced apart from the circuit. The cosmic ray detection circuit is configured to assert an incoming cosmic ray signal when a cosmic ray interacts with the cosmic ray detection device. The protection circuit is coupled to the incoming cosmic ray signal and is configured to cause the electronic device to enter a protected state when the cosmic ray signal is asserted.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: May 15, 2012
    Assignee: International Business Machines Corporation
    Inventors: Mark A. Bransford, Jack A. Mandelman
  • Patent number: 8174836
    Abstract: A data card includes a casing provided with a circuit board therein. One end of the casing is provided with a plug electrically connected with the circuit board. The data card further includes a connecting part and a cap part. One end of the connecting part is connected with the casing, while the other end is connected with the cap part. The cap part can cover the plug. An antenna which is electrically connected with the circuit board is provided on the connecting part and/or the cap part. The invention mainly use in wireless data signal receiving or transmitting device.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: May 8, 2012
    Assignee: Huawei Device Co., Ltd.
    Inventor: Shuai Zhao
  • Patent number: 8169794
    Abstract: A harness-integrated slide hinge is provided that connects between a plurality of casings having circuits therein while allowing the casings to move relatively. The harness-integrated slide hinge includes: a first sliding plate fitted to the one casing; a second sliding plate fitted to the other casing; a sliding mechanism that connects between the first sliding plate and the second sliding plate while allowing them to move relatively; and a harness that has a plurality of wirings, and connection sections provided on both ends of these wirings, and that is routed between the first sliding plate and the second sliding plate, wherein a wiring lamination section having a plurality of the wirings laminated therein is bent in a U-shape and accommodated in a space section between the first sliding plate and the second sliding plate.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: May 1, 2012
    Assignee: Fujikura Ltd.
    Inventors: Takashi Matsukawa, Yuuki Tanaka, Tomoyuki Shinohara, Shigeru Ashida, Yasushi Nakagawa, Shou Ueda
  • Patent number: 8169788
    Abstract: A printed board to be loaded into a printed-board-receiving structure having a backboard and a guide rail, the backboard having a connector plug-in connectable to a connector on the printed board, the guide rail guiding the printed board toward the backboard and having a groove including a sloping portion, the printed board includes a sloping portion forming a projection at an end of the printed board, the projection being fittable and slidable along the groove in the guide rail.
    Type: Grant
    Filed: November 3, 2009
    Date of Patent: May 1, 2012
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Shouyama, Yoshiyuki Nakayama, Yoshiaki Tobimatsu, Kazuya Fuke
  • Patent number: 8164918
    Abstract: One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit signals using proximity communication. This array is comprised of a set of macropads, where each given macropad is comprised of a set of micropads that can be configured to transmit a signal. A steering fabric routes signals to and within macropads, such that a subset of the micropads in the array can be configured to transmit the signal to a receiving component. Each macropad receives a limited number of input signals, with the steering fabric routing input signals to the micropads of the macropads. By limiting the number of input signals that are routed to the micropads of the macropads, the steering fabric eliminates redundant steering configurations for the array and reduces the power needed to transmit the signal.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: April 24, 2012
    Assignee: Oracle America, Inc.
    Inventors: Alex Chow, Robert J. Drost, Ronald Ho, Robert Proebsting, Arlene Proebsting, legal representative