Abstract: Provided is a portable electronic device wherein breakage due to stress concentration at a portion of a housing in a connecting part side is suppressed. A second housing 5 of a mobile phone 1 has a front case 29 and a rear case 37 which face each other in a direction that faces a first housing 3 in a closed state. The front case 29 and the rear case 37 are connected to each other at a plurality of hole parts 41 arranged at a plurality of positions within a facing surface. The front case 29 has a resin part 55 formed of a resin, and a sheet metal part 57 which is formed of a metal and is at least partially embedded in the resin part 55. The sheet metal part 57 has a main body part 59 surrounded by the hole parts 41; and an extending part 61 extending from the main body part 59 up to a position closer to the connecting part 7 than a hole part 41A, 41B arranged closer to the connecting part 7 than the main body part 59 and embedded in the resin part 55.

Abstract: The invention relates to a format adapter comprising a storage device having: a front surface provided with electrical contact pads opposite a rear surface defining a lower peripheral border (2a); a body having a cavity (4) for receiving the device and opening on a front and rear side of the body, and; an adhesive film (8a), which is sensitive to pressure, adhered to the rear side of the body and which has at least one adhesive portion inside the cavity in order to hold the storage device. The adhesive film has an inner recess (10) essentially centered on the cavity and has at least one shoulder bordering on the cavity that assures a localized adhesion only on the lower peripheral border (2a) of the storage device. The invention also relates to a method for producing the adapter and to a use of the adapter for manufacturing and packaging the storage device.

Abstract: A networking appliance includes a chassis, an off-the-shelf motherboard mounted on said chassis, said motherboard including at least one expansion bus, one or more separately removable expansion module mounted on said chassis, and a number of card slots in the expansion module for accommodating expansion cards. A connection arrangement provides a signal connection between the card slots in the expansion modules and the expansion buses.

Abstract: A potted electrical circuit is enclosed within a housing and has a first and second fiberglass layer that is laid upon a top surface of the potted electrical circuit. A lid of the housing seals the electrical circuit there within and an opening formed in a side wall allows circuitry wiring to extend there from out. The first fiberglass layer is a woven layer while the second fiberglass layer is a padding-like layer. Circuitry wiring pushes through the woven first fiberglass layer before extending out through the opening in the housing. The first fiberglass layer is tucked in and around the electrical circuit and adheres to the inside of the housing by attaching to the potting material while it hardens. In a preferred embodiment, the electrical circuit in combination with the insulation material is used within a transient voltage surge suppression device.

Abstract: An electronic device includes a base, a button module with a button movably received in the base from a lateral side of the base, a sliding block slidably mounted in the base, and an elastic positioning member. The sliding block defines a first securing slot and a second securing slot. The elastic positioning member is capable of engaging in the first securing slot to restrict the sliding block in a first position where the button module is received in the base, and is capable of engaging in the second securing slot to restrict the sliding block in a second position where the button module extends out of the base.

Abstract: A USB device including a bistable mechanism that serves to bias a plug connector into one of two stable states, where the first stable state is associated with a retracted position in which the plug connector is fully retracted inside a housing, and the second stable state is associated with a deployed position in which the plug connector extends through the front opening for coupling to a host system. Movement of the plug connector form the retracted to the deployed position is performed by manually applying a force to a handle portion that protrudes through a slot defined in the housing. The bistable mechanism resists the deploying force until an equilibrium point is reach, after which the bistable mechanism releases stored potential energy to complete the deploying process and to maintain the plug connector is the deployed position.

Abstract: A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding.

Abstract: A portable terminal characterized by comprises: a first substrate; a double-sided tape adhered to a prescribed portion of said first substrate; a second substrate adhered to said double-sided tape on a side thereof that is opposite the side on which said first substrate is located and having an electronic part mounted on a side thereof that is opposite the side affixed to said double-sided tape; an upper case disposed on a side of said first substrate, opposite the side where said doubled-sided tape is located; a lower case disposed on a side of the electronic part, opposite the side where said second substrate is located, and combined with said upper case; and a frame placed between said second substrate and said lower case and having an opening at a position corresponding to said electronic part.

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: An electronic device includes a housing, a circuit board, a switch, and a side key. The housing has a plurality of side walls. The circuit board is disposed in the housing. The switch is disposed at an inner surface of the housing relatively close to the circuit board. The side key disposes through one of the side walls, and the location of the side key is corresponding to the switch. When the side key is pressed, the side key contacts the switch to make the switch electrically connected with the circuit board.

Abstract: A microelectronic substrate, a method of forming the same, and a system including the same. The microelectronic substrate comprises: a conductive layer; a spacer layer disposed onto the conductive dielectric layer; a dielectric build-up layer disposed onto the spacer layer, the spacer layer being made of a material that has a lower shrinkage than a material of the embedding dielectric-build-up layer during curing, and a higher viscosity than a material of the embedding dielectric build-up layer in its pre-cure form and during curing; and active or passive microelectronic components embedded within the dielectric build-up layer.

Abstract: A crystal oscillator for surface mounting comprising: a case main body including concave portions on both principal surfaces; a crystal element hermetically encapsulated in one concave portion; an IC chip housed in the other concave portion; mounting terminals provided on four corner portions of an opening end face of the other concave portion; and a protrusion serving as identifying marks along a direction of sides of the case main body and provided in some of the mounting terminals. The mounting terminals, to which the protrusions are provided, are provided on both corner portions on one end side of the case main body. The protrusions extend in a same direction from the mounting terminals at an inner or outer circumference side of the opening end face. The mounting terminals including the protrusions are symmetric with respect to a center line between both corner portions on the one end side.

Abstract: A land pattern, a method of manufacturing a printed circuit board (PCB) and a PCB incorporating a land pattern. In one embodiment, the land pattern includes: (1) a quadrilateral component outline area having diagonally opposed first and second corners and diagonally opposed third and fourth corners, defined according to a body configuration of a particular component type and located on a surface of a substrate and (2) first and second exposed conductive pads located within said area respectively proximate said first and second corners, coupled to respective first and second circuit conductors of said substrate, configured according to a terminal configuration of said type and separated from said third and fourth corners such that a component of said particular component type may be placed on the land pattern in multiple orientations without causing a short circuit.

Abstract: A mobile electronic device is provided. The mobile electronic device includes a case having a sidewall; a circuit board mounted in the case, and a side button module attached to the case sidewall. The circuit board includes a switch disposed thereon. The side button module includes a positioning member secured to the case sidewall and a button secured to the positioning member. The button includes a base and an actuating protrusion protruding from the base. The base abuts the positioning member. The actuating protrusion extends through the positioning member and is configured to trigger the switch on the circuit board when actuated. The positioning member is sandwiched between the base and the actuating protrusion.

Abstract: A data processing system with at least one mainboard is arranged in a computer housing and at least one daughter card that can be electrically connected to the mainboard by at least one riser card. A metal carrier sheet accommodates and supports the riser card and the daughter card and can be arranged together with the riser card and the daughter card in the computer housing. A metal carrier sheet includes a retaining bracket constructed to fix the riser card on the metal carrier sheet without screws. The metal carrier sheet further includes at least one angle bracket and at least one retaining bolt constructed to fix the daughter card without screws on the metal carrier sheet.

Abstract: The present disclosure describes an apparatus for enclosing electrical equipment. A shutter panel with at least one shutter aperture, at least one guide piece configured to align the shutter panel with a stab-on bore of a unit area, an operator member and a mounting member interconnected with a bus bar assembly is presented. A method for accessing electrical equipment in a motor control unit is also presented.

Abstract: The circuit device includes a first transmitting inductor, a first insulating layer, a first receiving inductor, and a second receiving inductor. The first transmitting inductor is constituted of a helical conductive pattern and receives a transmitted signal. The first receiving inductor is located in a region overlapping the first transmitting inductor through the first insulating layer. The first receiving inductor is constituted of a helical conductive pattern, and generates a received signal corresponding to the transmitted signal input to the first transmitting inductor. The second receiving inductor is connected in series to the first receiving inductor, and constituted of a helical conductive pattern. The second receiving inductor generates a voltage in an opposite direction to that generated by the first receiving inductor, in response to a magnetic field of the same direction.

Abstract: A highly accurate current sensing transformer, such as an external neutral current transformer (ENCT), accommodates a wide range of loads. The ENCT includes a housing, first and second terminals each having an end portion extending from and external to the housing, a conductor for carrying a current to be measured, and a current sensor having an aperture for receiving the conductor and having a central axis. The conductor joins the first and second terminals to form a current path that passes through the aperture. Increased accuracy is achieved by arranging the conductor such that a portion thereof passing through the aperture forms a substantial angle relative to the central axis, such that the entry angle of the current path via the conductor through the aperture of the current sensor of the ENCT matches an entry angle of a conductor through an aperture of a current sensor in the electronic trip unit to which the ENCT is attached.

Abstract: A chip card holder, for securing a chip card in an electronic device, includes a housing, an elastic member and a strip member. The housing defines a receiving chamber. The elastic member is secured in the receiving chamber and has an elastic foldable resisting section. The strip member connects with the resisting section and an end of the strip exposes from the receiving chamber. A chip card is assembled in the receiving chamber, the resisting section of the elastic member resists against the chip card, the resisting section is folded elastically by pulling the strip member and the chip card is withdrawn by the pushing of the resisting section.

Abstract: A portable electronic device includes a circuit board and at least one treatment element mounted adjacent to the circuit board and storing volatile maintaining matters therein. The circuit board generates heat when the portable electronic device is working to heat the treatment element, and then the maintaining matters volatilize to maintain the portable electronic device.