Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.

Abstract: Peelable polymeric film, in particular, peelable polymeric film which comprises a polymeric substrate layer and a coating layer of adhesive, and which is of particular use in the manufacture of electronic devices is described. The adhesive layer is derived from an aqueous composition which comprises an aliphatic polyurethane and is switchable.

Abstract: A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of flat particulate inorganic ceramic and/or metallic electrically insulating, and/or electrically conducting, and/or thermally conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures, such particles resulting in the reduction of the occurrence and size of gas voids within the adhesive bondline.

Abstract: Methods of making vacuum insulated glass (VIG) window units are provided, including activating getters in a process of making VIG window units. In certain example embodiments, at least one getter is activated during and/or at the end of a pump-out/evacuation process in which the cavity between the substrates is evacuated. In certain example embodiments, the getter(s) may be activated (e.g., by at least a laser beam that is directed through a pump-out tube) during and/or at the end of the evacuation process in which the cavity between the substrates is evacuated to a low pressure that is below atmospheric pressure.

Abstract: A pressure-sensitive adhesive comprising at least 60 wt % of a polymer blend, where the polymer blend consists of a first polymer component A, a second polymer component B, and optionally one or more further polymer components (C, D, . . . ), where the first polymer component A is present at not less than x wt % in the polymer blend, where 90?x?99, and where the second polymer component B and any further polymer components C, D, . . . present are present in total at y wt % in the polymer blend, where y=100?x, where each polymer component (A, B, C, . . . ) derives to an extent of at least 60 wt % from (meth)acrylic monomers, wherein none of the polymer components (A, B, C, . . . ) is homogeneously miscible at room temperature with any of the other polymer components (A, B, C, . . . ), and so a multi-phase system is present.

Abstract: The invention relates to use of polylactide (PLA) as an extruded polymer coating on paper or board intended for the production of containers and packages, which are heated in a stove or microwave oven. According to the invention a polyfunctional cross-linking agent, such as trialkyl isocyanurate (TAIC), is blended with PLA, and the extruded coating layer is subjected to cross-linking electron beam (EB) radiation. PLA may be used as such or blended with another biodegradable polyester such as polybutylene succinate (PBS). EB radiation has been found to improve adhesion of the coating to the paper or board substrate, heat-scalability of the coating, and heat-resistance of the finished containers and packages.

Abstract: A bonding system for bonding a plastic substrate to another substrate, the bonding system comprising a plastic substrate wherein the plastic substrate is impregnated with a transition metal; and an anaerobically curable composition. Cure of the anaerobically curable composition is initiatable by the transition metal when the anaerobically curable composition is contacted with the plastic substrate under anaerobic conditions.

Abstract: A non-reactive hot-melt adhesive including 10-90 wt. %, calculated on the weight of the adhesive, of amorphous thermoplastic resin which is compatible with polylactic acid, 10-90 wt. %, calculated on the weight of the adhesive, of a polylactic acid polymer unit (PLAU) selected from poly-L-lactic acid (PLLAU) and poly-D-lactic acid (PDLAU), the unit having a number average molecular weight of at least 0.75 kg/mol, and 0.5-20 wt. %, preferably 1-10 wt. %, calculated on the weight of the first PLAU, of a second polylactic acid polymer unit (PLAU) selected from poly-L-lactic acid (PLLAU) and poly-D-lactic acid (PDLAU), the unit having a number average molecular weight of at least 0.75 kg/mol, wherein when the first PLAU is PLLAU, the second PLAU is PDLAU and when the first PLAU is PDLAU, the second PLAU is PLLAU.

Abstract: Provided is a method for favorable bonding between an adherend and an adhesive body, which is capable of suppressing an ink layer, which is formed by an ultraviolet-curable ink, from being smudged while increasing convenience of a bonding operation between the adherend and the adhesive body, and the like. The method for bonding a medium to a foil body includes an ink layer formation process of spotting an ultraviolet-curable ink, which is ejected from an inkjet head, to a medium and irradiating ultraviolet ray to the ultraviolet-curable ink to cure the same, thereby forming an ink layer; a lamination process of laminating the medium and a foil body with the ink layer being sandwiched therebetween; and a bonding process of heating the ink layer, enabling the ink layer to function as an adhesive, and bonding the medium to the foil body.

Abstract: A method of applying a laminate to a tire includes pre-treating a portion of the tire and placing the laminate on at least the pre-treated portion of the tire. The method further includes placing an electrical heating element on top of the laminate and placing a pressure element over the electrical heating element and the laminate. The method also includes applying heat and pressure to the laminate using the electrical heating element and the pressure element to permanently adhere the laminate to the tire.

Abstract: A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

Abstract: According to the present invention, there is provided a release film that can be suitably used in various applications without suffering from deterioration in releasing property thereof, for example, owing to a solvent used upon processing an adhesive layer, when the film is used as a release film for adhesives or a protective film for an adhesive layer for a polarizing plate. The release film of the present invention comprises a polyester film and a coating layer formed on at least one surface of the polyester film, the coating layer comprising a silicone compound and a Gemini surfactant.

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

Abstract: The present invention is directed to ceiling panels formed from a porous scrim that is coupled to an acoustical substrate using a scrim attachment system that includes an adhesive.

Abstract: A process for the manufacture of a plasterboard including activated carbon, includes: preparing a main mixed batch including a foaming agent and devoid of activated carbon; preparing a secondary mixed batch including powdered activated carbon; providing a first facing sheet; pouring the secondary mixed batch over the first facing sheet, the secondary mixed batch forming a first plaster layer; pouring the main mixed batch over the first plaster layer, the main mixed batch forming a second plaster layer; providing a second facing sheet on the first and second plaster layers; and forming the plasterboard; wherein the secondary mixed batch has a greater density than the main mixed batch.

Abstract: Peeling due to interfacial fracture between a tack-free layer 11 and a heat-conductive layer is prevented. In the tack-free layer, an inorganic filler having a median diameter of 0.5 ?M or more is contained in a thermoplastic resin having a glass transition temperature of 60° C. or higher to form concaves and convexes on an adhesive surface. Then, the heat-conductive layer being in contact with the adhesive surface is disposed. The adhesion between the tack-free layer and the heat-conductive layer is strengthened by an anchor effect caused by the concaves and convexes of the adhesive surface, without strengthening the adhesion of the surface opposite to the adhesive surface.

Abstract: A method for producing a sandwich component, in particular an inner trim component for a motor vehicle, is disclosed. The method begins with a core layer made from a foamed plastic and a cover layer which includes reinforcing fibers and plastic fibers. The plastic of the core layer has a first melting temperature which is higher than the second melting temperature of the plastic fibers of the cover layer. By the core layer being arranged on the cover layer, a multilayer composite is created. This multilayer composite can be further processed into a semi-finished product. The multilayer composite or the semi-finished product is then heated in a heating device to a temperature which is lower than the first melting temperature but therefore higher than the second melting temperature. Then the heated multilayer composite or the semi-finished product is formed in a forming tool in order to produce the sandwich component.

Abstract: The present disclosure relates to a method of preventing corrosion of mating surfaces of components. The method comprising impregnating a polyester based carrier with an anaerobic acrylic adhesive to form an impregnated carrier and spraying a pressure sensitive acrylic adhesive on one surface of the impregnated carrier to form an impregnated carrier having a pressure sensitive acrylic adhesive layer, which is protected using a protective silicon release liner to configure a pasting surface. The pasting surface is pasted on a first component, such that pasting layer is in contact with first component. A second component is abutted to first component with the impregnated carrier there between and force is applied on first and second components such that the anaerobic acrylic adhesive oozes out from the impregnated carrier and coats both mating surfaces in absence of oxygen to commence and complete curing of anaerobic acrylic adhesive on the mating surfaces of the first and the second components.

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.