Abstract: A two-component polyurethane composition containing at least 55% by weight of polybutadiene polyols based on the total amount of all polyols having an average molecular weight of at least 500 g/mol, and at least one latent hardener, where the ratio of the number of reactive groups in the latent hardener to the number of OH groups present is in the range from 0.02 to 0.4. The composition has a long open time, blister-free curing, a very low glass transition temperature, high elasticity and surprisingly high strength which is very constant over a wide temperature range. Furthermore, it has very good adhesion to metallic and nonmetallic substrates, causing barely any stress cracks on glassy thermoplastics.
Abstract: Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.
Type:
Grant
Filed:
February 15, 2019
Date of Patent:
October 12, 2021
Assignee:
XEROX CORPORATION
Inventors:
Sarah J. Vella, Guiqin Song, Chad Steven Smithson, Kurt Halfyard
Abstract: The present invention relates to adhesive formulations for bonding materials, comprising 40 to 80 wt.-% of an epoxy monomer, and 15 to 30 wt.-% of an oxetane monomer, and 0.1 to 10 wt.-% of an adhesion promotor, and 0.1 to 5 wt.-% of a sensitizer, and 1 to 10 wt.-% of a radiation and temperature activable photoinitiator or a mixture of a photoinitiator and a thermal initiator. Further, the present invention relates to a method for bonding at least two parts of which one is at least an inert material, comprising the steps applying to one part an adhesive formulation as described, placing another part to be bond on the one part, exposing the parts to UV light radiation and heat treating of the part.
Abstract: A system and method for laminating filter media can include applying an adhesive to a layer of the filter media and curing the adhesive. A multilayer filter assembly can include a first and a second layer laminated together using an inorganic adhesive.
Type:
Grant
Filed:
February 3, 2021
Date of Patent:
August 24, 2021
Assignee:
Molekule, Inc.
Inventors:
Jaspreet S. Dhau, Avtar Singh, David Goslin
Abstract: The present application relates to a method for manufacturing a pressure-sensitive adhesive film. In an embodiment, a method for manufacturing a pressure-sensitive adhesive film having a pressure-sensitive adhesive layer and a base layer includes applying a pressure-sensitive adhesive composition on at least one side of a base layer, where the pressure-sensitive adhesive composition comprises an isocyanate compound, a metal compound and an acrylic polymer; and drying the pressure-sensitive adhesive composition at a temperature of 100° C. or higher to form a pressure-sensitive adhesive layer on the base layer.
Type:
Grant
Filed:
October 31, 2017
Date of Patent:
August 17, 2021
Inventors:
Hui Je Lee, Byung Su Park, Yoon Kyung Kwon
Abstract: The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.
Abstract: An object of the present invention is to provide a composite material including an epoxide resin, having an improved strength. The object can be solved by a curable epoxide composition comprising an epoxide compound; a carbon fiber; a curing agent; and phosphite ester or phosphate ester. According to the present invention, a strength of the curable epoxide composition comprising a carbon fiber can be improved.
Abstract: In the present invention, a solvent-based (SB) adhesive for the purpose of closing or sealing the open end of a bag, such as a plastic trash bag, liner or like, is coated to the exterior or interior surface of said bag and creates a neat, tight functional seal to said bag when twist activated.
Type:
Grant
Filed:
March 31, 2020
Date of Patent:
August 3, 2021
Assignee:
Sun Chemical Corporation
Inventors:
Paul Kurtz, Philippe Schottland, Russell Schwartz, Kohei Nakane
Abstract: A method is provided for manufacturing a segment of a drill string, such as a tubular tool, from a plurality of layers. The method includes arranging a plurality of layers based on a selected length of the segment. Each of the plurality of layers includes an aperture that is received over an alignment feature that restricts movement of the plurality of layers to two or fewer degrees of freedom. A joining process is performed to join the plurality of layers, which may include at least one replacement layer.
Type:
Grant
Filed:
November 21, 2018
Date of Patent:
August 3, 2021
Assignee:
HALLIBURTON ENERGY SERVICES, INC.
Inventors:
Alston Jun Ngai Wong, Jia Ming Kew, Doren Hui Ping Ho, Guan Yee Chan
Abstract: A new hot-melt adhesive formulations having improved processability and that are easily processable even with processes at high speed and in particular with Spraying or Fiberization processes. Said hot-melt adhesive formulations comprise, as their main polymer component, at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a substantially bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps, where the first polymer (polymer A) of said compositionally bimodal polymer composition is an isotactic butene-1 homopolymer or an isotactic butene-1 copolymer with another olefin, while the second polymer (polymer B) is an isotactic copolymer of butene-1, with another olefin, with a chemical composition obviously different from A, qualitatively and/or quantitatively; said hot-melts further comprising a viscosity modifier that is not solid at room temperature.
Abstract: Epoxy adhesives include a latent curing agent, a reactive toughener having capped isocyanate groups, and certain urea compounds. The toughener is made by chain extending and capping a mixture of isocyanate-terminated prepolymers. The prepolymers include an isocyanate-terminated polyether and an isocyanate-terminated diene polymer. The adhesives have excellent wash-off resistance and excellent ability to adhere to oily substrates.
Abstract: A description is given of the use of a one-component laminating adhesive for composite film lamination, and also of a method for composite film lamination. The laminating adhesive comprises an aqueous polymer dispersion preparable by radical emulsion polymerization of monomers comprising (a) at least 60 wt %, based on the total amount of monomers, of at least one monomer selected from the group consisting of C1 to C20 alkyl acrylates, C1 to C20 alkyl methacrylates, vinyl esters of carboxylic acids comprising up to 20 carbon atoms, vinylaromatics having up to 20 carbon atoms, vinyl halides, vinyl ethers of alcohols comprising 1 to 10 carbon atoms, aliphatic hydrocarbons having 2 to 8 carbon atoms and one or two double bonds, and mixtures of these monomers, and (b) at least 0.1 wt %, based on the total amount of monomers, of at least one monomer having at least one acid group, and (c) 0.
Type:
Grant
Filed:
January 10, 2017
Date of Patent:
May 25, 2021
Assignee:
BASF SE
Inventors:
Karl-Heinz Schumacher, Christine Tonhauser, Christoph Kiener, Peter Preishuber-Pfluegl, Andrea Kuntz
Abstract: A two-component solventless adhesive composition is disclosed, the composition comprising an isocyanate component comprising an isocyanate prepolymer that is the reaction product of reactants comprising at least one polyisocyanate, at least one polyester polyol, at least one polyether polyol, and at least one polyol comprising a hydroxyl and COOH acid functionality. The adhesive composition further comprises a polyol component comprising at least one polyester polyol, at least one polyether polyol, or a combination thereof. A method for forming a laminate using the adhesive composition and a laminate itself are also disclosed. The method comprises forming a solventless adhesive composition, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. A laminate made according to the method is further disclosed.
Type:
Grant
Filed:
March 28, 2016
Date of Patent:
May 25, 2021
Assignees:
Dow Global Technologies LLC, Rohm and Haas Company
Abstract: The present teachings contemplate a method comprising coating an polymeric material with a composition including a dicarbonyl compound and having a viscosity of from about 50 cps to about 500 cps, wherein the coating initiates either: (i) spontaneous polymerization (e.g., in less than about one minute) at room temperature of the composition without the addition of an initiator; or (ii) polymerization at room temperature at a selected later time with or without the addition of an initiator; and wherein the composition adheres or facilitates adhesion of the polymeric material to a substrate.
Type:
Grant
Filed:
April 21, 2017
Date of Patent:
May 25, 2021
Assignee:
Zephyros, Inc.
Inventors:
Yuan Lu, Kenneth Mazich, Kevin Hicks, Austin O'Connor, Michael Czaplicki
Abstract: A two-part curable urethane adhesive composition of the present technology comprises: a main agent containing a urethane prepolymer (A), an isocyanate group-containing polyisocyanate (B), and isocyanate silane (C); and a curing agent containing a compound having at least two active hydrogen groups per molecule (D) and an aromatic compound (E) represented by Formula (1) below, where n is an integer of 1 to 5, and X represents a hydrogen atom, a hydroxy group, or an alkoxy group having from 1 to 12 carbons.
Abstract: Laminates of polymeric films and solvent-based polyurethane adhesive formulations for preparing them are provided. The adhesive formulations include a hydroxyl-terminated polyester that forms crystalline polyester domains after reaction with an appropriate polyisocyanate, but prior to completion of cure. The result is an adhesive layer that substantially enhances the oxygen barrier properties of the adhesive and, therefore, of the laminate as a whole, while offering desirable convenience of application even at relatively low temperatures. The laminates may also exhibit desirable retention of barrier properties following flex-cracking.
Type:
Grant
Filed:
October 8, 2014
Date of Patent:
March 30, 2021
Assignees:
Dow Global Technologies LLC, Rohm and Haas Company
Inventors:
Daniele Vinci, Mai Chen, Thomas Udhayasingh, Thorsten Schmidt
Abstract: The present invention relates to the use of block copolymers produced from OH-functionalized polyolefins and polyesters in adhesives or sealants and to adhesives or sealants containing said block co-polymers.
Type:
Grant
Filed:
February 3, 2017
Date of Patent:
March 30, 2021
Assignee:
Evonik Operations GmbH
Inventors:
Nicolai Kolb, Gabriele Brenner, Patrick Glöckner, Bernhard Schleimer
Abstract: A method for manufacturing a thin substrate uses a temporary adhesive film for substrate processing for temporarily adhesion of a substrate to a support on a surface of the substrate opposite to a surface to be processed, the temporary adhesive film for substrate processing containing a siloxane bond-containing polymer having a weight average molecular weight of 3,000 to 500,000 in an amount of 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass; and includes: (a) laminating the temporary adhesive film for substrate processing onto the support and/or the surface of the substrate opposite to the surface to be processed; (b) bonding thereof under reduced pressure; (c) processing the substrate by grinding or polishing; (d) treating the substrate with acid or base; (e) other processing; (f) separating the processed substrate from the support; and (g) cleaning the substrate.