Abstract: A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is ‘a’, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is ‘b’, ‘b/a’ is 0.07 or more.

Abstract: An element body is formed with a through hole to be open at the first main surface and the second main surface opposing each other. A through-conductor includes a first portion located inside the through-hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A tube covers the first portion and is electrically insulating. A resin is contained in the cover and is located in a space between an inner surface of the element body and the tube. The tube has an electrical resistivity equal to or greater than an electrical resistivity of the resin.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of internal electrodes disposed inside the ceramic body and each exposed to first and second surfaces of the ceramic body and to one of the third and fourth surfaces, and a first side margin portion and a second side margin portion disposed on sides of the plurality of internal electrodes exposed to the first and second surfaces. The ceramic body includes an active portion including the plurality of internal electrodes disposed to overlap each other with the dielectric layer interposed therebetween to form capacitance, an upper cover portion disposed above the active portion, and a lower cover portion disposed below the active portion. The first and second side margin portions have a dielectric composition different from a dielectric composition of one of the upper cover portion and the lower cover portion.

Abstract: An integrated component may include a multilayer capacitor include a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The integrated component may include a discrete varistor comprising a first external varistor termination connected with the first active termination and a second external varistor termination connected with the second active termination of the multilayer capacitor.

Abstract: A laminated ceramic electronic component according to the present disclosure includes a laminated body in which ceramic layers and electrode layers are alternately laminated, a pair of external electrodes provided at end portions of the laminated body, and an intermediate electrode configured to electrically connect at least one electrode layer and one of the external electrodes, wherein the intermediate electrode contains a conductive carbon material.

Abstract: A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, and external electrodes each connected to the internal conductive layers. The internal conductive layers each include holes each having a different area equivalent diameter. The holes include first holes including ceramic pillars therein and second holes not including ceramic pillars therein. The ceramic pillars connect ceramic layers on sides of the internal conductive layers. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes existing in each of the internal conductive layers is 90% is defined as an area equivalent diameter D90, an abundance ratio of the first holes in a first population including holes each having the area equivalent diameter D90 or more is about 14% or more.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.

Abstract: A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other and an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other.

Abstract: In a multilayer capacitor, when a width of a element body in a facing direction of a pair of side surfaces is W, and a distance from a start position of a curved shape of the element body on the side surface side in a plane of a first internal electrode of an outermost layer to a virtual surface including the side surface when viewed from the facing direction of a pair of end surfaces is Rw, We/4?X<W?2×Rw is satisfied.

Abstract: A ceramic electronic device includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked, a main component of the dielectric layers being BaTiO3, wherein a rare earth element that is at least one of Gd, Tb, Dy, Ho, Y and Er is solid-solved in both of an A site and a B site of BaTiO3 of the dielectric layers.

Abstract: A capacitor includes a capacitor element, a pair of bus bars, and an insulating member. The capacitor element includes a positive electrode surface and a negative electrode surface. The pair of bus bars includes a positive electrode bus bar that is connected to the positive electrode surface of the capacitor element and a negative electrode bus bar that is connected to the negative electrode surface, A plate-shaped insulating member is disposed between the positive electrode bus bar and the negative electrode surface. A part of the insulating member is inserted into a bus bar through-hole provided in the positive electrode bus bar.

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer, a protective layer disposed on the body, and an external electrode disposed on at least a portion of the protective layer. The protective layer includes oxide ceramic and a metal the same as a metal of the internal electrode layer.

Abstract: A method for manufacturing a multilayer ceramic electronic device includes punching out a ceramic sheet by one of left and right side surfaces of a laminated body so as to form a side margin part on the one of the left and right side surfaces of said laminated body; and punching out another ceramic sheet by another of the left and right side surfaces of the laminated body so as to form a side margin part on the another of the left and right side surfaces of said laminated body, thereby forming a ceramic main body having the laminated body and the pair of side margin parts that respectively cover the left and right side surfaces of the laminated body. The width W is greater than the length L in the multilayer ceramic electronic device.

Abstract: A ceramic electronic component includes: a body including an active portion, including a first dielectric layer and an internal electrode, and a margin portion disposed a side surface of the active portion and including a second dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The first and second dielectric layers have different dielectric compositions. The first dielectric layer includes tin (Sn) and dysprosium (Dy). The second dielectric layer includes magnesium (Mg).

Abstract: A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.

Abstract: A multilayer ceramic capacitor includes end-surface external electrodes and side-surface external electrodes. The end-surface external electrodes are respectively provided at end surfaces of a multilayer body and are respectively connected to end-surface connecting internal electrodes. The side-surface external electrodes are respectively provided at the side surfaces of the multilayer body and respectively connected to side-surface connecting internal electrodes. The end-surface connecting internal electrodes each include end surface opposing portion opposing the side-surface connecting internal electrode 15B adjacent in a lamination direction, and an end surface lead-out portion extending from the end surface opposing portion to one of the end-surface external electrodes.

Abstract: In the sintered electrode layer covering the one end face, a wraparound dimension of a wraparound portion wrapping around from the one end face to the one main face in the facing direction is set to a dimension b, a distance between the one end face and the end portions of the plurality of second internal electrodes on the one end face side in the facing direction is set to a dimension Lg, a distance between the pair of main faces in the stacking direction is set to a dimension T, and a distance between the one main face and the second internal electrode closest to the one main face is set to a dimension Tg1, a relational expression of Lg>b?(2×b×Tg1/T) is satisfied.

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers respectively interposed therebetween, the first internal electrodes being exposed to two end surfaces of the body, the second internal electrodes being exposed to a mounting surface of the body perpendicular to the end surfaces; a pair of connection portions each including a conductive layer disposed on one of the end surfaces of the body and connected to the first internal electrodes and an insulating layer disposed on the conductive layer; first and second external electrodes disposed on the mounting surface of the body and connected to the conductive layers of the pair of connection portions, respectively; and a third external electrode disposed between the first and second external electrodes on the mounting surface of the body and connected to the second internal electrodes.

Abstract: A conductive paste includes a core including a first metal and a shell including a second metal having a melting point higher than that of the first metal and enclosing a surface of the core. A multilayer ceramic component includes an external electrode having a sintered electrode layer made of the conductive paste.