Abstract: A capacitor module that includes: a plurality of capacitors each including: a first electrode and a second electrode that face each other, and a side surface joining the first electrode and the second electrode, the side surface having a pair of flat portions that face each other, and a pair of curved portions joining the pair of flat portions to each other, the plurality of capacitors being arrayed in a row such that the flat portions of adjacent capacitors face each other; at least one metal sheet arranged in any of spaces between the flat portions of the adjacent capacitors, the at least one metal sheet being in contact with the first electrode of at least one of the adjacent capacitors; a first bus-bar electrically connected to the at least one metal sheet; and a second bus-bar electrically connected to each of the second electrodes of the plurality of capacitors.

Abstract: High voltage metal insulator metal capacitors are described. In an example, a capacitor includes a first electrode plate, and a first capacitor dielectric on the first electrode plate. A second electrode plate is on the first capacitor dielectric and is over and parallel with the first electrode plate, and a second capacitor dielectric is on the second electrode plate. A third electrode plate is on the second capacitor dielectric and is over and parallel with the second electrode plate, and a third capacitor dielectric is on the third electrode plate. A fourth electrode plate is on the third capacitor dielectric and is over and parallel with the third electrode plate. In another example, a capacitor includes a first electrode, a capacitor dielectric on the first electrode, and a second electrode on the capacitor dielectric. The capacitor dielectric includes a plurality of alternating first dielectric layers and second dielectric layers.

Abstract: To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.

Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.

Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes and external electrodes disposed on an external surface of the body and connected to the internal electrodes. The body includes a first surface and a second surface to which the internal electrodes are exposed, the first surface and the second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction which is a direction in which the dielectric layers are stacked, and a fifth surface and a sixth surface opposing each other in a third direction. At least one of the internal electrodes include a first bottleneck structure having a first directional length of a third-directional outer region smaller than an inner region thereof and a second bottleneck structure having a third directional length of a first directional outer region smaller than an inner region thereof.

Abstract: A solid electrolytic capacitor element includes an anode body that includes a porous part in at least a surface layer of the anode body, a dielectric layer, and a cathode part. The cathode part includes a solid electrolyte layer that covers the at least a part of the dielectric layer. The anode body includes a first part and a second part. The first part is a cathode forming part on which the solid electrolyte layer is formed, and the second part is a part on which the solid electrolyte layer is not formed. The second part includes at least an anode part including an end of the anode body opposite to the first part. The first part is sectionalized into a plurality of regions, and the first part has a groove at a boundary between adjacent regions among the plurality of regions.

Abstract: A cathode foil for electrolytic capacitors includes a metal porous part, a metal core part that is continuous with the metal porous part, and a coating film covering the metal porous part. Pores in the metal porous part are open at a first main surface of the cathode foil. The coating film is disposed in a region from the first main surface to a depth more than or equal to 10% of a thickness of the metal porous part in a thickness direction of the metal porous part.

Abstract: A capacitor that includes a substrate having a surface; a lower electrode opposing the surface of the substrate; a dielectric film on the lower electrode; an upper electrode on the dielectric film; a protective layer on the lower electrode, the dielectric film, and the upper electrode, the protective layer defining a through-hole exposing at least one of the lower electrode and the upper electrode; at least one protrusion in the through-hole; and an outer electrode covering the through-hole and the at least one protrusion.

Abstract: A multilayer capacitor is provided. The multilayer capacitor includes a body and an external electrode disposed outside the body, wherein the body includes an active portion including a plurality of dielectric layers and a plurality of internal electrodes stacked with dielectric layers interposed therebetween, and a side margin portion covering at least one side surface of side surfaces to which the internal electrodes are exposed in the laminate, wherein the side margin portion includes a dielectric including a BaTiO3-based main component, a first subcomponent including a rare earth element, and a second subcomponent including Zr, wherein, based on a molar content per 100 moles of the main component, when a molar content of the rare earth element is RE, a molar content of Zr and RE satisfies 0.20?Zr/RE?0.37.

Abstract: A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, wherein the dielectric layer includes a plurality of first secondary phases, the first secondary phase is a secondary phase including Ni, Mg, Al, Si, and O, and at least one of the plurality of first secondary phases has a ratio of a major axis length to a minor axis length of 4 or more.

Abstract: A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.

Abstract: A ceramic electronic component includes a multilayer body in which internal electrodes are stacked in a first axis direction, the multilayer body having side faces perpendicular to a second axis direction that is orthogonal to the first axis direction, ends of the internal electrodes being positioned at the side faces and aligned within a range of 0.5 ?m in the second axis direction; and side margin portions covering the side faces, respectively, the side margin portions including a ceramic polycrystal as a main component and glass grains dispersed in the polycrystal, a total volume ratio of the glass grains with respect to the polycrystal being 1% or more and 20% or less, a median diameter of the glass grains is 0.20 ?m or more and less than 0.75 ?m, and is 90% or more of a median diameter of crystal grains constituting the polycrystal.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be alternately stacked with the dielectric layer interposed therebetween, a first external electrode and a second external electrode connected to the first and the second internal electrode respectively. The first external electrode includes a first base electrode layer disposed in contact with the ceramic body, a first glass layer disposed on the first base electrode layer, and a first resin electrode layer disposed on the first glass layer. The second external electrode includes a second base electrode layer disposed in contact with the ceramic body, a second glass layer disposed on the second base electrode layer, and a second resin electrode layer disposed on the second glass layer.

Abstract: A solid electrolytic capacitor according to one aspect of the present disclosure includes: an anode body made of a valve metal; a dielectric layer formed on the anode body; and a solid electrolyte layer formed on the dielectric layer. The solid electrolyte layer includes: a first conductive polymer layer formed on the dielectric layer and heterogeneously doped with a monomolecular dopant; a block layer formed on the first conductive polymer layer; and a second conductive polymer layer formed on the block layer and composed of a self-doped-type conductive polymer containing a plurality of side chains containing a functional group that can be doped. The block layer blocks a migration of the self-doped-type conductive polymer from the second conductive polymer layer into the first conductive polymer layer and/or a migration of the self-doped-type conductive polymer from the second conductive polymer layer into pores of the porous anode body.

Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: A capacitor includes a stack and an external electrode located on a surface of the stack. The stack includes a plurality of dielectric layers and a plurality of internal electrode layers alternately stacked on one another. Crystal grains include first crystal grains having a small grain size and second crystal grains having a larger grain size. The first crystal grains satisfy 0.13 ?m?d1<0.30 ?m, where d1 is the grain size of the first crystal grains. The second crystal grains satisfy 0.30 ?m?d2<0.50 ?m, where d2 is the grain size of the second crystal grains. The second crystal grains have a higher additive element content than the first crystal grains.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic electronic component main body, first and second metal terminals, an exterior material covering the multilayer ceramic electronic component main body, a portion of the first metal terminal, and a portion of the second metal terminal, and an electrostatic shielding metal embedded in the exterior material and covering at least a portion of the multilayer ceramic electronic component main body. The electrostatic shielding metal is between a surface of the exterior material and a surface of the multilayer ceramic electronic component main body, and is spaced away from the multilayer ceramic electronic component main body.

Abstract: A capacitor (2) includes a capacitor main body (4) and a base (6). The capacitor main body includes an opening sealing member (14) attached to an opening of an outer package case (10), and a terminal lead (16-1, 16-2) led out from a first insertion through hole portion (17-1, 17-2) of the opening sealing member. The base is disposed on the side of the opening sealing member of the capacitor main body, and has a second insertion through hole portion (18-1, 18-2). For example, the base includes a first protruding portion (20) surrounding the second insertion through hole portion, so that the second insertion through hole portion of the base forms an insertion through hole. The opening distance on the side of the substrate mounting face of the insertion through hole is larger than the opening distance on the side of the capacitor main body of the insertion through hole.