Patents Examined by Daniel M Dubuisson
  • Patent number: 12040136
    Abstract: A multilayer ceramic capacitor includes end-surface external electrodes and side-surface external electrodes. The end-surface external electrodes are respectively provided at end surfaces of a multilayer body and are respectively connected to end-surface connecting internal electrodes. The side-surface external electrodes are respectively provided at the side surfaces of the multilayer body and respectively connected to side-surface connecting internal electrodes. The end-surface connecting internal electrodes each include end surface opposing portion opposing the side-surface connecting internal electrode 15B adjacent in a lamination direction, and an end surface lead-out portion extending from the end surface opposing portion to one of the end-surface external electrodes.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: July 16, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Akira Ishizuka, Shinichi Kokawa, Yasuyuki Shimada
  • Patent number: 12033802
    Abstract: In the sintered electrode layer covering the one end face, a wraparound dimension of a wraparound portion wrapping around from the one end face to the one main face in the facing direction is set to a dimension b, a distance between the one end face and the end portions of the plurality of second internal electrodes on the one end face side in the facing direction is set to a dimension Lg, a distance between the pair of main faces in the stacking direction is set to a dimension T, and a distance between the one main face and the second internal electrode closest to the one main face is set to a dimension Tg1, a relational expression of Lg>b?(2×b×Tg1/T) is satisfied.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: July 9, 2024
    Assignee: TDK CORPORATION
    Inventors: Toru Onoue, Daisuke Himeta, Yusuke Karasawa
  • Patent number: 12020869
    Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers respectively interposed therebetween, the first internal electrodes being exposed to two end surfaces of the body, the second internal electrodes being exposed to a mounting surface of the body perpendicular to the end surfaces; a pair of connection portions each including a conductive layer disposed on one of the end surfaces of the body and connected to the first internal electrodes and an insulating layer disposed on the conductive layer; first and second external electrodes disposed on the mounting surface of the body and connected to the conductive layers of the pair of connection portions, respectively; and a third external electrode disposed between the first and second external electrodes on the mounting surface of the body and connected to the second internal electrodes.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hyeong Kim, Myung Jun Park, Kyu Sik Park, Eui Hyun Jo, Jin Yeop Yoo, Ha Jeong Kim, Jong Ryeong Kim, Eun Me Park
  • Patent number: 12014878
    Abstract: A conductive paste includes a core including a first metal and a shell including a second metal having a melting point higher than that of the first metal and enclosing a surface of the core. A multilayer ceramic component includes an external electrode having a sintered electrode layer made of the conductive paste.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: June 18, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chung Hyeon Ryu, Hyo Kyong Seo, Jun Ho Yun, Ye Ji Hwang, Seung Been Kim
  • Patent number: 11996240
    Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: May 28, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kong Joo Jeon, So Jung An, Kwang Yeun Won, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park
  • Patent number: 11990282
    Abstract: A multilayer ceramic capacitor includes a laminate and an external electrode. The laminate includes a central layer portion in which first and second internal electrode layers are alternately laminated with a dielectric ceramic layer therebetween, a peripheral layer portion sandwiching the central layer portion in the lamination direction, and a side margin sandwiching the central layer portion and the peripheral layer portion in the width direction. When a point P indicates an end in the width direction of the internal electrode layer closest to a main surface of the laminate, and a point Q indicates a point where a boundary between the peripheral layer portion including the point P and the side margin including the point P intersects the main surface, and an imaginary line IL is drawn to pass through the point P and the point Q, the boundary is curved from the imaginary line IL.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: May 21, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Taro Sakai
  • Patent number: 11990285
    Abstract: A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: May 21, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Riki Suemasa, Takayuki Sekiguchi
  • Patent number: 11990280
    Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. A region, containing nickel (Ni) and carbon (C), is present between the internal electrode layer and the dielectric layer.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: May 21, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Joon Oh, Jeong Ryeol Kim
  • Patent number: 11978595
    Abstract: A capacitor component includes a body having first surface and second surfaces opposing each other and including through-holes penetrating through the first surface and the second surface, a first electrode covering an inner wall of each of the plurality of through-holes, a first common electrode covering the first surface and connected to the first electrode, a dielectric layer surrounded by the first electrode in the through-hole, a second electrode surrounded by the dielectric layer in the through-hole, a second common electrode layer covering the second surface and connected to the second electrode, a first external electrode disposed on at least one of a plurality of side surfaces of the body and connected to the first common electrode layer, and a second external electrode disposed on at least one of the plurality of side surfaces of the body and connected to the second common electrode layer.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: May 7, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong Lee, Su Bong Jang, Min Cheol Park, Tae Ho Yun, Han Kim
  • Patent number: 11967461
    Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately laminated therein, and two end surfaces opposing each other in a length direction, and two side surfaces opposing each other in a width direction, and two external electrodes respectively on the two end surfaces of the multilayer body. At least one of two opposed main surfaces of the multilayer ceramic capacitor includes raised portions provided respectively on one side and another side with a middle portion of the main surface interposed therebetween. The raised portions are each raised to become thicker in the lamination direction from the middle portion toward an outer periphery of the main surface.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: April 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuyuki Shimada, Akira Tanaka, Shinichi Kokawa
  • Patent number: 11967462
    Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 23, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Sung Kang, Su Yeon Lee, Won Jun Na, Byung Kun Kim, Yu Hong Oh, Sun Hwa Kim, Jae Eun Heo, Hoe Chul Jung
  • Patent number: 11961678
    Abstract: A film capacitor device includes a film stack with metal strips including adjacent metal strips in 180° opposite orientations in a direction in which the metal strips continuously extend, metal-sprayed electrodes on a pair of end faces of the film stack, and conductors extending continuously in a stacking direction on a pair of end faces (cut surfaces) different from the pair of end faces on which the metal-sprayed electrodes are located.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 16, 2024
    Assignee: Kyocera Corporation
    Inventor: Kazuki Imagawa
  • Patent number: 11961681
    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed therebetween; and an external electrode disposed on the capacitor body to be connected to one or more of the internal electrodes. Porosity of ends of the internal electrodes is less than 50% on an interfacial surface between a margin of the capacitor body in a width direction the capacitor body and the internal electrodes.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Kwang Seo, Berm Ha Cha, Kang Hyun Lee, Jong Hwa Lee, Jong Han Kim
  • Patent number: 11961679
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Eun Jung Lee, Jong Suk Jeong, Chun Hee Seo, Jong Hoon Yoo, Tae Hyung Kim, Ho Sam Choi, Sim Chung Kang
  • Patent number: 11961680
    Abstract: A ceramic electronic component includes an element body and at least one external electrode. The element body includes a dielectric and at least one internal electrode therein. The element body has a plurality of surfaces that includes a first surface and a second surface opposite the first surface. Two end regions are defined on the second surface at opposite ends of the second surface, and an intermediate region is defined on the second surface between the two end regions. The intermediate region has a surface roughness smaller than each of the two end regions. The respective external electrode is formed on the element body at a position away from the second surface. The respective external electrode includes a base layer formed on the element body and a plating layer formed on the base layer. The base layer is connected to the respective internal electrode and contains at least one metal.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Takashi Shimada
  • Patent number: 11955292
    Abstract: A structure of capacitors connected in parallel includes a substrate. A trench embedded in the substrate. Numerous electrode layers respectively conformally fill in and cover the trench. The electrode layers are formed of numerous nth electrode layers, wherein n is a positive integer from 1 to M, and M is not less than 3. The nth electrode layer with smaller n is closer to the sidewall of the trench. When n equals to M, the Mth electrode layer fills in the center of the trench, and the top surface of the Mth electrode is aligned with the top surface of the substrate. A capacitor dielectric layer is disposed between the adjacent electrode layers. A first conductive plug contacts the nth electrode layer with odd-numbered n. A second conductive plug contacts the nth electrode layer with even-numbered n.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Purakh Raj Verma, Ching-Yang Wen, Xingxing Chen, Chao Jin
  • Patent number: 11948754
    Abstract: A three-terminal capacitor includes a main body having a cylindrical or substantially cylindrical shape extending in a first direction and including first and second inner electrodes alternately laminated together with dielectric layers interposed therebetween, a pair of first outer electrodes on two end surfaces of the main body in the first direction and electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The main body includes a projecting portion projecting in a direction perpendicular or substantially perpendicular to the first direction at a position between the pair of first outer electrodes. The second outer electrode is provided on one surface of the projecting portion viewable when viewed in the first direction.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: April 2, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shingo Ito, Koichi Ikeda, Ken Takakura, Satoshi Yoshida, Syuichi Nabekura, Takahiro Hirao, Masanori Nakamura, Kyosuke Uno, Haruhiko Ueno, Yohei Mukobata
  • Patent number: 11935703
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Patent number: 11929206
    Abstract: A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jun Jung, Yun Kim, Hyun Kim, Sim Chung Kang, Eun Jung Lee
  • Patent number: 11929213
    Abstract: A structure of capacitors connected in parallel includes a substrate. A trench embedded in the substrate. Numerous electrode layers respectively conformally fill in and cover the trench. The electrode layers are formed of numerous nth electrode layers, wherein n is a positive integer from 1 to M, and M is not less than 3. The nth electrode layer with smaller n is closer to the sidewall of the trench. When n equals to M, the Mth electrode layer fills in the center of the trench, and the top surface of the Mth electrode is aligned with the top surface of the substrate. A capacitor dielectric layer is disposed between the adjacent electrode layers. A first conductive plug contacts the nth electrode layer with odd-numbered n. A second conductive plug contacts the nth electrode layer with even-numbered n.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: March 12, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Purakh Raj Verma, Ching-Yang Wen, Xingxing Chen, Chao Jin